Patents by Inventor Wanfa Su

Wanfa Su has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11349234
    Abstract: An electrical connector includes a housing having contact chambers between a top and a bottom configured to be mounted to a circuit board. A rear wall of the housing includes lead slots open at the top to receive leads of an electrical component. The electrical connector includes a cover coupled to the top of the housing above the leads. The electrical connector includes contacts received in corresponding contact chambers. Each contact includes a base having a solder pad at a bottom configured to be soldered to a circuit board conductor of the circuit board. Each contact includes contact beams extending from the base to form a socket proximate to the top of the housing that receives the lead of the electrical component from above to electrically connect to the lead of the electrical component.
    Type: Grant
    Filed: May 19, 2020
    Date of Patent: May 31, 2022
    Assignees: TE CONNECTIVITY SERVICES GmbH, TYCO ELECTRONICS (SHANGHAI) CO. LTD.
    Inventors: Christopher P. Devine, Hua Li, Wenke He, Wanfa Su
  • Publication number: 20210313722
    Abstract: An electrical connector includes a housing having contact chambers between a top and a bottom configured to be mounted to a circuit board. A rear wall of the housing includes lead slots open at the top to receive leads of an electrical component. The electrical connector includes a cover coupled to the top of the housing above the leads. The electrical connector includes contacts received in corresponding contact chambers. Each contact includes a base having a solder pad at a bottom configured to be soldered to a circuit board conductor of the circuit board. Each contact includes contact beams extending from the base to form a socket proximate to the top of the housing that receives the lead of the electrical component from above to electrically connect to the lead of the electrical component.
    Type: Application
    Filed: May 19, 2020
    Publication date: October 7, 2021
    Inventors: Christopher P. Devine, Hua Li, Wenke He, Wanfa Su
  • Patent number: 8542498
    Abstract: Disclosed herein are various exemplary embodiments of shielding enclosures. In an exemplary embodiment, a shielding enclosure generally includes a frame and a lid. The frame includes vertically extending sidewalls and horizontally inwardly extending lateral flanges therefrom. The lateral flanges define a top opening of the frame and include outwardly extending detent legs. The lid includes a top portion for covering the top opening of the frame. The lid also includes flanges downwardly extending from edges of the top portion. At least one of the flanges has a detent structure, such that when the lid is installed on the frame the detent legs of the frame are engaged by the detent structure. The detent structure may, for example, be detent slots or detent protrusions.
    Type: Grant
    Filed: September 30, 2010
    Date of Patent: September 24, 2013
    Assignee: Laird Technologies, Inc.
    Inventor: Wanfa Su
  • Publication number: 20110073360
    Abstract: Disclosed herein are various exemplary embodiments of shielding enclosures. In an exemplary embodiment, a shielding enclosure generally includes a frame and a lid. The frame includes vertically extending sidewalls and horizontally inwardly extending lateral flanges therefrom. The lateral flanges define a top opening of the frame and include outwardly extending detent legs. The lid includes a top portion for covering the top opening of the frame. The lid also includes flanges downwardly extending from edges of the top portion. At least one of the flanges has a detent structure, such that when the lid is installed on the frame the detent legs of the frame are engaged by the detent structure. The detent structure may, for example, be detent slots or detent protrusions.
    Type: Application
    Filed: September 30, 2010
    Publication date: March 31, 2011
    Applicant: LAIRD TECHNOLOGIES, INC.
    Inventor: Wanfa Su