Patents by Inventor Wang Ai-Chie

Wang Ai-Chie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods of forming and assembling pre-encapsulated assemblies and of forming associated semiconductor device packages
    Patent number: 8399297
    Abstract: Methods of forming pre-encapsulated frames comprise flowing a dielectric encapsulation material around at least one conductive trace. A cavity configured to receive at least one semiconductor device at least partially in the cavity is formed in the encapsulation material. A first connection area of the at least one trace is exposed within the cavity. At least another connection area of the at least one trace is exposed laterally adjacent to the cavity. The dielectric encapsulation material is hardened to form a pre-encapsulated frame.
    Type: Grant
    Filed: October 20, 2011
    Date of Patent: March 19, 2013
    Assignee: Micron Technology, Inc.
    Inventors: Tay Wuu Yean, Wang Ai-Chie
  • PRE-ENCAPSULATED CAVITY INTERPOSER
    Publication number: 20120034740
    Abstract: Methods of forming pre-encapsulated frames comprise flowing a dielectric encapsulation material around at least one conductive trace. A cavity configured to receive at least one semiconductor device at least partially in the cavity is formed in the encapsulation material. A first connection area of the at least one trace is exposed within the cavity. At least another connection area of the at least one trace is exposed laterally adjacent to the cavity. The dielectric encapsulation material is hardened to form a pre-encapsulated frame.
    Type: Application
    Filed: October 20, 2011
    Publication date: February 9, 2012
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Tay Wuu Yean, Wang Ai-Chie
  • Pre-encapsulated cavity interposer
    Patent number: 8072082
    Abstract: A pre-encapsulated cavity interposer, a pre-encapsulated frame, for a semiconductor device.
    Type: Grant
    Filed: May 28, 2008
    Date of Patent: December 6, 2011
    Assignee: Micron Technology, Inc.
    Inventors: Tay Wuu Yean, Wang Ai-Chie
  • PRE-ENCAPSULATED CAVITY INTERPOSER
    Publication number: 20090267171
    Abstract: A pre-encapsulated cavity interposer, a pre-encapsulated frame, for a semiconductor device.
    Type: Application
    Filed: May 28, 2008
    Publication date: October 29, 2009
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Tay Wuu Yean, Wang Ai-Chie