Patents by Inventor Wang-Jia Chen

Wang-Jia Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8237055
    Abstract: A circuit board includes an insulation layer, a signal layer disposed on one side of the insulation layer, and a ground plane and a power plane disposed on the insulation layer at a side opposite to the signal layer. The insulation layer forms a separating area arranged between the ground plane and the power plane. At least two signal traces parallel to each other are arranged on the signal layer at one side corresponding to one of the ground plane and the power plane. A width of the signal trace close to the separating area is wider than that of the signal trace away from the separating area.
    Type: Grant
    Filed: September 22, 2009
    Date of Patent: August 7, 2012
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Wang-Jia Chen, Wei Zhou, Yu-Hsu Lin, Feng Zhang
  • Publication number: 20100307795
    Abstract: A circuit board includes an insulation layer, a signal layer disposed on one side of the insulation layer, and a ground plane and a power plane disposed on the insulation layer at a side opposite to the signal layer. The insulation layer forms a separating area arranged between the ground plane and the power plane. At least two signal traces parallel to each other are arranged on the signal layer at one side corresponding to one of the ground plane and the power plane. A width of the signal trace close to the separating area is wider than that of the signal trace away from the separating area.
    Type: Application
    Filed: September 22, 2009
    Publication date: December 9, 2010
    Applicants: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: WANG-JIA CHEN, WEI ZHOU, YU-HSU LIN, FENG ZHANG
  • Publication number: 20090071702
    Abstract: A circuit board (10) for reducing a variation in impedance of signal traces thereon includes a first signal plane (30) and a second signal plane (50). The first signal plane includes a first signal trace (31) arranged thereon. The first signal trace has a first width. The second signal plane includes a plurality of second signal traces (51) arranged thereon. An orthographic projection of the first signal trace onto the second signal plane crosses the second signal traces. A width of the first signal trace at positions where the orthographic projection thereof onto the second signal plane at the intersections with the second signal traces transitions to a second width less than the first width of the first signal trace.
    Type: Application
    Filed: October 10, 2007
    Publication date: March 19, 2009
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD ., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: YU-HSU LIN, WANG-JIA CHEN