Patents by Inventor Wang JIAO

Wang JIAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LASER CHIP AND PREPARATION METHOD THEREFOR
    Publication number: 20230043539
    Abstract: Disclosed in the present invention are a laser chip and a preparation method therefor.
    Type: Application
    Filed: February 26, 2021
    Publication date: February 9, 2023
    Inventors: Chao-chen CHENG, Xinqi DING, Yangfeng WU, Wang JIAO, Guibo LIAO, Ju WANG, Qingming TU
  • ALIGNMENT METHOD FOR BACKSIDE PHOTOLITHOGRAPHY PROCESS
    Publication number: 20220336368
    Abstract: The present application provides an alignment method for backside photolithography process of the wafer, the alignment method includes: cutting the wafer, and using at least two edges formed by cutting as the first alignment mark; bonding the front side of the wafer to the wafer pad to form a composite wafer; aligning the first alignment mark with the corresponding second alignment mark on the photomask for backside photolithography. This method is not limited by wafer thickness and material, and reduces the secondary input of the photolithography equipment; meanwhile, the probability of fragments of thin wafers in the photolithography process can be reduced, and the yield of the product is effectively improved.
    Type: Application
    Filed: November 20, 2020
    Publication date: October 20, 2022
    Inventors: Xinqi DING, Jiarui AI, Wang JIAO, Chao-chen CHENG