Patents by Inventor Wang Khiang

Wang Khiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070013040
    Abstract: The present invention is directed to an interposer for packaging a microchip device, which includes a plurality of electrical contacts on an outer side of the interposer, for electrically contacting the packaged microchip device and to be electrically connected with the microchip device. There is an aperture extending from the outer side into the interposer. The aperture may be divided into at least two openings, and at least a first of the openings may extend from the outer side through the interposer in order to allow connection to the microchip device.
    Type: Application
    Filed: September 21, 2006
    Publication date: January 18, 2007
    Applicant: UNITED TEST & ASSEMBLY CENTER LIMITED
    Inventor: Wang Khiang
  • Publication number: 20050257955
    Abstract: A method of packaging a microchip device, an interposer for packaging, and a packaged microchip device. An interposer (7) is placed on microchip devices (1). The interposer (7) comprises an aperture (11) which extends from the interposer surface where external electrical contacts (9) are located to the surface of the microchip devices (1). Electrical contacts (3) on the microchip device surface are accessible through the aperture (11) in order to electrically connect the electrical contacts (3) with the external electrical contacts (9) of the interposer (7). The aperture (11) is divided into at least two openings or aperture regions, separated by a bridge (18). This facilitates the handling of the interposer (7).
    Type: Application
    Filed: June 19, 2002
    Publication date: November 24, 2005
    Inventor: Wang Khiang