Patents by Inventor WANG-LAI YANG
WANG-LAI YANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10950563Abstract: A chip package for optical sensing includes a substrate, and a semiconductor device positioned on the substrate and coupled to the substrate through a first conducting element. Two molding processes are applied, to form a first colloid body on the substrate so as to cover the semiconductor device and, on the first colloid body, to form a second colloid body which covers an optical device. The optical device is electrically connected to the substrate through a second conducting element. The light transmittance of the second colloid body exceeds that of the first colloid body.Type: GrantFiled: August 26, 2020Date of Patent: March 16, 2021Assignee: SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITEDInventor: Wang-Lai Yang
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Patent number: 10867942Abstract: A chip package for optical sensing includes a substrate, and a semiconductor device positioned on the substrate and coupled to the substrate through a first conducting element. Two molding processes are applied, to form a first colloid body on the substrate so as to cover the semiconductor device and, on the first colloid body, to form a second colloid body which covers an optical device. The optical device is electrically connected to the substrate through a second conducting element. The light transmittance of the second colloid body exceeds that of the first colloid body.Type: GrantFiled: July 2, 2020Date of Patent: December 15, 2020Assignee: SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITEDInventor: Wang-Lai Yang
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Publication number: 20200388585Abstract: A chip package for optical sensing includes a substrate, and a semiconductor device positioned on the substrate and coupled to the substrate through a first conducting element. Two molding processes are applied, to form a first colloid body on the substrate so as to cover the semiconductor device and, on the first colloid body, to form a second colloid body which covers an optical device. The optical device is electrically connected to the substrate through a second conducting element. The light transmittance of the second colloid body exceeds that of the first colloid body.Type: ApplicationFiled: August 26, 2020Publication date: December 10, 2020Inventor: WANG-LAI YANG
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Patent number: 10818619Abstract: A chip package for optical sensing includes a substrate, and a semiconductor device positioned on the substrate and coupled to the substrate through a first conducting element. Two molding processes are applied, to form a first colloid body on the substrate so as to cover the semiconductor device and, on the first colloid body, to form a second colloid body which covers an optical device. The optical device is electrically connected to the substrate through a second conducting element. The light transmittance of the second colloid body exceeds that of the first colloid body.Type: GrantFiled: July 2, 2020Date of Patent: October 27, 2020Assignee: SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITEDInventor: Wang-Lai Yang
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Publication number: 20200335462Abstract: A chip package for optical sensing includes a substrate, and a semiconductor device positioned on the substrate and coupled to the substrate through a first conducting element. Two molding processes are applied, to form a first colloid body on the substrate so as to cover the semiconductor device and, on the first colloid body, to form a second colloid body which covers an optical device. The optical device is electrically connected to the substrate through a second conducting element. The light transmittance of the second colloid body exceeds that of the first colloid body.Type: ApplicationFiled: July 2, 2020Publication date: October 22, 2020Inventor: WANG-LAI YANG
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Patent number: 10770417Abstract: A chip package for optical sensing includes a substrate, and a semiconductor device positioned on the substrate and coupled to the substrate through a first conducting element. Two molding processes are applied, to form a first colloid body on the substrate so as to cover the semiconductor device and, on the first colloid body, to form a second colloid body which covers an optical device. The optical device is electrically connected to the substrate through a second conducting element. The light transmittance of the second colloid body exceeds that of the first colloid body.Type: GrantFiled: March 9, 2018Date of Patent: September 8, 2020Assignee: SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITEDInventor: Wang-Lai Yang
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Publication number: 20190172805Abstract: A chip package for optical sensing includes a substrate, and a semiconductor device positioned on the substrate and coupled to the substrate through a first conducting element. Two molding processes are applied, to form a first colloid body on the substrate so as to cover the semiconductor device and, on the first colloid body, to form a second colloid body which covers an optical device. The optical device is electrically connected to the substrate through a second conducting element. The light transmittance of the second colloid body exceeds that of the first colloid body.Type: ApplicationFiled: March 9, 2018Publication date: June 6, 2019Inventor: WANG-LAI YANG
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Patent number: 9379505Abstract: A method of manufacturing a lead frame includes, firstly, forming a metal plate which has a frame portion, a pad portion for mounting semiconductor elements, and lead portions. After that, the lead portions are etched to form a support end, a connecting terminal and a jointing end of each lead portion. Then a receiving portion for receiving the semiconductor elements is formed, wherein the receiving portion is collectively defined by the connecting terminals, the support ends and the pad portion. After that, step portions are formed on the lead portions and the pad portion by half-etching. A method of manufacturing a semiconductor package which includes the lead frame is also provided.Type: GrantFiled: May 2, 2013Date of Patent: June 28, 2016Assignee: SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITEDInventor: Wang-Lai Yang
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Patent number: 8981571Abstract: A package assembly includes a substrate, an electronic component, and an encapsulation body. The electronic component is located on the substrate and electrically connected to the substrate. The encapsulation body encapsulates the electronic component with the substrate. A portion of the substrate corresponding to the electronic component defines a plurality of through holes. A diameter of each of the plurality of through holes gradually reduces from a top surface of the substrate toward a bottom surface of the substrate. The plurality of through holes prevent melting remnants of the encapsulation body from flowing outside of the substrate.Type: GrantFiled: April 9, 2013Date of Patent: March 17, 2015Assignee: Shunsin Technology (Zhong Shan) LimitedInventor: Wang-Lai Yang
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Publication number: 20140054792Abstract: A package assembly includes a substrate, an electronic component, and an encapsulation body. The electronic component is located on the substrate and electrically connected to the substrate. The encapsulation body encapsulates the electronic component with the substrate. A portion of the substrate corresponding to the electronic component defines a plurality of through holes. A diameter of each of the plurality of through holes gradually reduces from a top surface of the substrate toward a bottom surface of the substrate. The plurality of through holes prevent melting remnants of the encapsulation body from flowing outside of the substrate.Type: ApplicationFiled: April 9, 2013Publication date: February 27, 2014Applicants: HON HAI PRECISION INDUSTRY CO., LTD., AMBIT MICROSYSTEMS (ZHONGSHAN) LTD.Inventor: WANG-LAI YANG
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Patent number: 8587100Abstract: A semiconductor package includes a lead frame, a first chip, a second chip, a plurality of bonding wires and a mold compound. The lead frame includes a pad portion at a center of the frame and a plurality of lead portions. The pad portion and the plurality of lead portions collectively define a receiving portion. The first chip is securely received in the receiving portion. The second chip is mechanically attached to the first chip. The plurality of bonding wires electrically connect the second chip to the plurality of lead portions. The mold compound encapsulates the lead frame, the first chip, the second chip and the plurality of bonding wires to form the semiconductor package.Type: GrantFiled: March 23, 2011Date of Patent: November 19, 2013Assignee: Ambit Microsystems (Zhongshan) Ltd.Inventor: Wang-Lai Yang
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Publication number: 20130239409Abstract: A method of manufacturing a lead frame includes, firstly, forming a metal plate which has a frame portion, a pad portion for mounting semiconductor elements, and lead portions. After that, the lead portions are etched to form a support end, a connecting terminal and a jointing end of each lead portion. Then a receiving portion for receiving the semiconductor elements is formed, wherein the receiving portion is collectively defined by the connecting terminals, the support ends and the pad portion. After that, step portions are formed on the lead portions and the pad portion by half-etching. A method of manufacturing a semiconductor package which includes the lead frame is also provided.Type: ApplicationFiled: May 2, 2013Publication date: September 19, 2013Applicant: AMBIT MICROSYSTEMS (ZHONGSHAN) LTD.Inventor: WANG-LAI YANG
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Publication number: 20110309484Abstract: A semiconductor package includes a lead frame, a first chip, a second chip, a plurality of bonding wires and a mold compound. The lead frame includes a pad portion at a center of the frame and a plurality of lead portions. The pad portion and the plurality of lead portions collectively define a receiving portion. The first chip is securely received in the receiving portion. The second chip is mechanically attached to the first chip. The plurality of bonding wires electrically connect the second chip to the plurality of lead portions. The mold compound encapsulates the lead frame, the first chip, the second chip and the plurality of bonding wires to form the semiconductor package.Type: ApplicationFiled: March 23, 2011Publication date: December 22, 2011Applicants: HON HAI PRECISION INDUSTRY CO., LTD., AMBIT MICROSYSTEMS (ZHONGSHAN) LTD.Inventor: WANG-LAI YANG