Abstract: A system for cleaning semiconductor packages is provided which includes a pickhead that is configured to hold the semiconductor packages in an array arrangement and a plurality of nozzles, each of which is constructed and arranged to project a separate jet of cleaning fluid upwardly against the semiconductor packages. A megasonic energy generator is coupled for imparting megasonic energy to the cleaning fluid and a driving device drives relative movement between the plurality of nozzles and the pickhead to direct the said jets to clean the array of packages on the pickhead.

Abstract: A semiconductor package handling system is provided comprising a package holder for receiving and holding singulated semiconductor packages, and a first inspection device which is arranged and configured to inspect a first surface of the packages while they are being held by the package holder. An offloading device receives the packages from the package holder and conveys them packages to an offloader, and a second inspection device is arranged and configured to inspect a second surface of the packages which is opposite from the first surface while they are being held by the offloading device.

Abstract: A singulation handler system is provided for a strip of electronic packages, which comprises an onloader located adjacent to an onloading location for providing an unsingulated strip of packages for singulation and a cutting jig for mounting the strip of unsingulated packages. The cutting jig is movable between the onloading location and a singulation location at which the strip is singulated by a singulation engine. The system further includes a buffer boat for holding singulated packages that have been removed from the cutting jig and which is operative to convey the singulated packages in a fixed relative orientation. A gang pick head is operative to transfer multiple singulated packages simultaneously from the buffer boat to a rotary turret device and an offloader is provided for transferring singulated packages from the rotary turret device to containers in which the singulated packages are storable.

Abstract: A pick and place apparatus is provided for picking up an electronic component from one location and placing it at another location, which comprises a pick up tool having an opening at which electronic components are configured to be held by vacuum suction. An air channel extends through the pick up tool from the opening and is connectable for fluid communication with an air supply source which is operative to blow a quantity of air out from the opening towards the electronic component for removing any debris located thereon. The air channel is also connectable for fluid communication with a vacuum suction source which is operative to generate vacuum suction force at the opening for picking up the electronic component by vacuum suction.

Abstract: A semiconductor package handling system is provided comprising a package holder for receiving and holding singulated semiconductor packages, and a first inspection device which is arranged and configured to inspect a first surface of the packages while they are being held by the package holder. An offloading device receives the packages from the package holder and conveys them packages to an offloader, and a second inspection device is arranged and configured to inspect a second surface of the packages which is opposite from the first surface while they are being held by the offloading device.

Abstract: A system for cleaning semiconductor packages is provided which comprises a pickhead that is configured to hold the semiconductor packages in an array arrangement and a plurality of nozzles, each of which is constructed and arranged to project a separate jet of cleaning fluid upwardly against the semiconductor packages. A megasonic energy generator is coupled for imparting megasonic energy to the cleaning fluid and a driving device drives relative movement between the plurality of nozzles and the pickhead to direct the said jets to clean the array of packages on the pickhead.

Abstract: A workholder, in particular a saw jig, is provided for mounting a substrate containing a plurality of electronic devices. The saw jig has a base platform having a plurality of pockets laid out in the same arrangement as the electronic devices are arranged on the substrate and a plurality of resilient collets are detachably inserted into the pockets, each collet being sized and configured to hold one electronic device by vacuum suction.

Abstract: A singulation handler system is provided for a strip of electronic packages, which comprises an onloader located adjacent to an onloading location for providing an unsingulated strip of packages for singulation and a cutting jig for mounting the strip of unsingulated packages. The cutting jig is movable between the onloading location and a singulation location at which the strip is singulated by a singulation engine. The system further includes a buffer boat for holding singulated packages that have been removed from the cutting jig and which is operative to convey the singulated packages in a fixed relative orientation. A gang pick head is operative to transfer multiple singulated packages simultaneously from the buffer boat to a rotary turret device and an offloader is provided for transferring singulated packages from the rotary turret device to containers in which the singulated packages are storable.

Abstract: A system is provided for processing electronic devices, and in particular for handling, inspecting, sorting and offloading the same. An apparatus for inspecting an electronic device comprises a holder for supporting the electronic device and a driving mechanism for moving the electronic device between an onloading position where the electronic device is placed onto the holder and an offloading position where the electronic device is removed from the holder. A first optical system between the onloading and offloading positions is configured to inspect a first surface of the electronic device while it is supported by the holder, Concurrently or subsequently, a second optical system between the onloading and offloading positions is configured to inspect a second surface of the electronic device that is opposite to the first surface while it is supported by the holder.