Abstract: A handling system for testing electronic components comprises a rotary turret and pick heads mounted on the rotary turret, each pick head being configured to hold a respective electronic component provided by a supply source. A carrier system which is positionable adjacent to the rotary turret is configured to carry a plurality of electronic components. The carrier system is receivable by a testing station that is operative to simultaneously test a plurality of the electronic components which have been arranged on the carrier system. The pick heads or other transfer mechanism may transfer the electronic components onto the carrier system prior to testing the same at the testing station and remove electronic components from the carrier system after testing the same at the testing station.

Abstract: An apparatus for arranging integrated circuit receiving tubes, the apparatus including a reverse mechanism, a detection element and a discharge mechanism. In use, the reverse mechanism receives a tube and the detection element determines an orientation of the received tube. The reverse mechanism moves to allow the discharge mechanism to receive the tube from itself. If the orientation of the received tube differs from a desired orientation, the movement of the reverse mechanism changes the orientation of the tube before allowing the discharge mechanism to receive the tube. Otherwise, the orientation of the tube is maintained notwithstanding the movement of the reverse mechanism, and is subsequently received by the discharge mechanism. This helps to automatically ensure that all the tubes are received by the discharge mechanism in the same orientation.

Abstract: The present invention relates to an apparatus for holding a workpiece to allow dicing of the workpiece. The apparatus comprises a base, an inner support member and an outer support member that is more deformable than the inner support member and arranged along a periphery of the inner support member. In use, air is extracted from suction holes of the inner support member, urging the workpiece against the inner and outer support members. Upon such urging, the outer support member deforms to seal a gap between the workpiece and the inner support member. This helps to increase the magnitude of the forces holding the workpiece against the inner support member.

Abstract: The present invention relates to an apparatus for arranging integrated circuit receiving tubes. The apparatus comprises a reverse mechanism, a detection element and a discharge mechanism. In use, the reverse mechanism receives a tube and the detection element determines an orientation of the received tube. The reverse mechanism moves to allow the discharge mechanism to receive the tube from itself. If the orientation of the received tube differs from a desired orientation, the movement of the reverse mechanism changes the orientation of the tube before allowing the discharge mechanism to receive the tube. Otherwise, the orientation of the tube is maintained notwithstanding the movement of the reverse mechanism, and is subsequently received by the discharge mechanism. This helps to automatically ensure that all the tubes are received by the discharge mechanism in the same orientation.

Abstract: An apparatus for handling electronic components on a lead frame. The apparatus including a singulation device configured to singulate the lead frame to thereby separate the electronic components and to position the separated electronic components alternately into at least two layers along different levels; and a guide having a plurality of lanes running along a surface of the guide, the lanes being configured to transport the separated electronic components from a first end of the guide arranged adjacent to the singulation device to a second end of the guide arranged adjacent to an output area. The lanes at the first end of the guide are alternately arranged into at least two layers having respective levels to receive the electronic components from the singulation device, whereas the lanes at the second end of the guide are arranged into a single layer along a common level for transferring the electronic components to the output area.

Abstract: Disclosed is an apparatus for handling electronic components on a lead frame. The apparatus comprises a singulation device configured to singulate the lead frame to thereby separate the electronic components and to position the separated electronic components alternately into at least two layers along different levels; and a guide having a plurality of lanes running along a surface of the guide, the lanes being configured to transport the separated electronic components from a first end of the guide arranged adjacent to the singulation device to a second end of the guide arranged adjacent to an output area. The lanes at the first end of the guide are alternately arranged into at least two layers having respective levels to receive the electronic components from the singulation device, whereas the lanes at the second end of the guide are arranged into a single layer along a common level for transferring the electronic components to the output area. Also disclosed is a guide suitable for use with the apparatus.

Abstract: A rotary apparatus comprises a rotary bobbin, a processing component fixedly attached to the bobbin and connectors fixedly connected to the processing component. At least one helical groove is located along the bobbin wherein the connectors are housed. A motor coupled to the processing component is operative to rotate the processing component together with the bobbin in two opposite rotary directions.

Abstract: A handling system for testing electronic components comprises a rotary turret and pick heads mounted on the rotary turret, each pick head being configured to hold a respective electronic component provided by a supply source. A carrier system which is positionable adjacent to the rotary turret is configured to carry a plurality of electronic components. The carrier system is receivable by a testing station that is operative to simultaneously test a plurality of the electronic components which have been arranged on the carrier system. The pick heads or other transfer mechanism may transfer the electronic components onto the carrier system prior to testing the same at the testing station and remove electronic components from the carrier system after testing the same at the testing station.

Abstract: A transfer assembly for transferring first and second groups of electronic components simultaneously comprises a holding plate containing first and second sets of suction holes. The respective first and second sets of suction holes are operative to hold the first and second groups of electronic components respectively against the holding plate during transfer of the electronic components. A first vacuum chamber located next to the holding plate is connected only to the first set of suction holes. A vacuum compartment located within the first vacuum chamber encloses a second vacuum chamber. The vacuum compartment includes a sealing sheet in contact with the holding plate which has vacuum holes connecting the second vacuum chamber to the second set of suction holes. First and second vacuum sources are provided for applying vacuum suction forces separately in the first and second vacuum chambers.

Abstract: A rotary apparatus comprises a rotary bobbin, a processing component fixedly attached to the bobbin and connectors fixedly connected to the processing component. At least one helical groove is located along the bobbin wherein the connectors are housed. A motor coupled to the processing component is operative to rotate the processing component together with the bobbin in two opposite rotary directions.

Abstract: An apparatus for transferring a plurality of electronic components includes a row of pick heads operative to pick up the electronic components simultaneously from a first location and to place them at a second location. Additionally, there is a driving mechanism operative to drive the pick heads to move relative to one another in directions which are parallel to a length of the row of pick heads whereby to adjust a pitch width of the pick heads.

Abstract: A transfer assembly for transferring first and second groups of electronic components simultaneously comprises a holding plate containing first and second sets of suction holes. The respective first and second sets of suction holes are operative to hold the first and second groups of electronic components respectively against the holding plate during transfer of the electronic components. A first vacuum chamber located next to the holding plate is connected only to the first set of suction holes. A vacuum compartment located within the first vacuum chamber encloses a second vacuum chamber. The vacuum compartment includes a sealing sheet in contact with the holding plate which has vacuum holes connecting the second vacuum chamber to the second set of suction holes. First and second vacuum sources are provided for applying vacuum suction forces separately in the first and second vacuum chambers.

Abstract: An apparatus for cleaning electronic packages comprises a tank containing cleaning fluid and a holder above the tank that supports the electronic packages above a top surface of the cleaning fluid with the electronic packages facing the cleaning fluid. Acoustic energy generators are immersed in the cleaning fluid for generating and propagating acoustic energy towards the top surface of the cleaning fluid to create streaming fluid jets projecting upwardly at the top surface to contact and clean the electronic packages supported on the holder.

Abstract: An apparatus for cleaning electronic packages comprises a tank containing cleaning fluid and a holder above the tank that supports the electronic packages above a top surface of the cleaning fluid with the electronic packages facing the cleaning fluid. Acoustic energy generators are immersed in the cleaning fluid for generating and propagating acoustic energy towards the top surface of the cleaning fluid to create streaming fluid jets projecting upwardly at the top surface to contact and clean the electronic packages supported on the holder.

Abstract: An apparatus for transferring a plurality of electronic components includes a row of pick heads operative to pick up the electronic components simultaneously from a first location and to place them at a second location. Additionally, there is a driving mechanism operative to drive the pick heads to move relative to one another in directions which are parallel to a length of the row of pick heads whereby to adjust a pitch width of the pick heads.

Abstract: A system is provided for processing electronic devices, and in particular for handling, inspecting, sorting and offloading the same. An apparatus for inspecting an electronic device comprises a holder for supporting the electronic device and a driving mechanism for moving the electronic device between an onloading position where the electronic device is placed onto the holder and an offloading position where the electronic device is removed from the holder. A first optical system between the onloading and offloading positions is configured to inspect a first surface of the electronic device while it is supported by the holder, Concurrently or subsequently, a second optical system between the onloading and offloading positions is configured to inspect a second surface of the electronic device that is opposite to the first surface while it is supported by the holder.