Patents by Inventor Wang-Shen Su
Wang-Shen Su has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10816422Abstract: A pressure sensor comprises a first substrate and a cap attached to the first substrate. The cap includes a processing circuit, a cavity and a deformable membrane separating the cavity and a port open to an outside of the pressure sensor. Sensing means are provided for converting a response of the deformable membrane to pressure at the port into a signal capable of being processed by the processing circuit. The cap is attached to the first substrate such that the deformable membrane faces the first substrate and such that a gap is provided between the deformable membrane and the first substrate which gap contributes to the port. The first substrate comprises a support portion the cap is attached to, a contact portion for electrically connecting the pressure sensor to an external device, and one or more suspension elements for suspending the support portion from the contact portion.Type: GrantFiled: February 24, 2017Date of Patent: October 27, 2020Assignee: InvenSense, Inc.Inventors: Chung-Hsien Lin, Rene Hummel, Ulrich Bartsch, Marion Hermersdorf, Tsung Lin Tang, Wang Shen Su, Chia Min Lin
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Patent number: 10712218Abstract: A sensor includes a deformable membrane that deflects in response to a stimuli. The sensor further includes a capacitive element coupled to the deformable membrane. The capacitive element is disposed within an enclosed cavity of the sensor. The capacitive element changes capacitance in response to the deformable membrane deflecting. The capacitive element comprises a getter material for collecting gas molecules within the enclosed cavity.Type: GrantFiled: March 29, 2019Date of Patent: July 14, 2020Assignee: InvenSense, Inc.Inventors: Johannes Schumm, Andreas Reinhard, Thomas Kraehenbuehl, Stefan Thiele, Rene Hummel, Chung-Hsien Lin, Wang Shen Su, Tsung Lin Tang, Chia Ming Lin
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Publication number: 20190226932Abstract: A sensor includes a deformable membrane that deflects in response to a stimuli. The sensor further includes a capacitive element coupled to the deformable membrane. The capacitive element is disposed within an enclosed cavity of the sensor. The capacitive element changes capacitance in response to the deformable membrane deflecting. The capacitive element comprises a getter material for collecting gas molecules within the enclosed cavity.Type: ApplicationFiled: March 29, 2019Publication date: July 25, 2019Inventors: Johannes SCHUMM, Andreas REINHARD, Thomas KRAEHENBUEHL, Stefan THIELE, Rene HUMMEL, Chung-Hsien LIN, Wang Shen SU, Tsung Lin TANG, Chia Ming LIN
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Patent number: 10254185Abstract: A sensor includes a deformable membrane that deflects in response to a stimuli. The sensor further includes a capacitive element coupled to the deformable membrane. The capacitive element is disposed within an enclosed cavity of the sensor. The capacitive element changes capacitance in response to the deformable membrane deflecting. The capacitive element comprises a getter material for collecting gas molecules within the enclosed cavity.Type: GrantFiled: March 14, 2018Date of Patent: April 9, 2019Assignee: InvenSense, Inc.Inventors: Johannes Schumm, Andreas Reinhard, Thomas Kraehenbuehl, Stefan Thiele, Rene Hummel, Chung-Hsien Lin, Wang Shen Su, Tsung Lin Tang, Chia Min Lin
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Publication number: 20180202882Abstract: A sensor includes a deformable membrane that deflects in response to a stimuli. The sensor further includes a capacitive element coupled to the deformable membrane. The capacitive element is disposed within an enclosed cavity of the sensor. The capacitive element changes capacitance in response to the deformable membrane deflecting. The capacitive element comprises a getter material for collecting gas molecules within the enclosed cavity.Type: ApplicationFiled: March 14, 2018Publication date: July 19, 2018Inventors: Johannes Schumm, Andreas Reinhard, Thomas Kraehenbuehl, Stefan Thiele, Rene Hummel, Chung-Hsien Lin, Wang Shen Su, Tsung Lin Tang, Chia Min Lin
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Patent number: 9958349Abstract: A pressure sensor comprises a deformable membrane deflecting in response to pressure applied, a first stationary electrode, and a second electrode coupled to the deformable membrane, for determining a change in a capacitance between the first and the second electrode in response to the pressure applied. At least one of the first and the second electrode comprises a getter material for collecting gas molecules.Type: GrantFiled: March 30, 2016Date of Patent: May 1, 2018Assignee: INVENSENSE, INC.Inventors: Johannes Schumm, Andreas Reinhard, Thomas Kraehenbuehl, Stefan Thiele, Rene Hummel, Chung-Hsien Lin, Wang Shen Su, Tsung Lin Tang, Chia Min Lin
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Publication number: 20170167933Abstract: A pressure sensor comprises a first substrate and a cap attached to the first substrate. The cap includes a processing circuit, a cavity and a deformable membrane separating the cavity and a port open to an outside of the pressure sensor. Sensing means are provided for converting a response of the deformable membrane to pressure at the port into a signal capable of being processed by the processing circuit. The cap is attached to the first substrate such that the deformable membrane faces the first substrate and such that a gap is provided between the deformable membrane and the first substrate which gap contributes to the port. The first substrate comprises a support portion the cap is attached to, a contact portion for electrically connecting the pressure sensor to an external device, and one or more suspension elements for suspending the support portion from the contact portion.Type: ApplicationFiled: February 24, 2017Publication date: June 15, 2017Inventors: Chung-Hsien LIN, Rene HUMMEL, Ulrich BARTSCH, Marion HERMERSDORF, Tsung Lin TANG, Wang Shen SU, Chia Min LIN
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Patent number: 9581512Abstract: A pressure sensor comprises a first substrate and a cap attached to the first substrate. The cap includes a processing circuit, a cavity and a deformable membrane separating the cavity and a port open to an outside of the pressure sensor. Sensing means are provided for converting a response of the deformable membrane to pressure at the port into a signal capable of being processed by the processing circuit. The cap is attached to the first substrate such that the deformable membrane faces the first substrate and such that a gap is provided between the deformable membrane and the first substrate which gap contributes to the port. The first substrate comprises a support portion the cap is attached to, a contact portion for electrically connecting the pressure sensor to an external device, and one or more suspension elements for suspending the support portion from the contact portion.Type: GrantFiled: October 23, 2014Date of Patent: February 28, 2017Assignee: INVENSENSE, INC.Inventors: Chung-Hsien Lin, Rene Hummel, Ulrich Bartsch, Marion Hermersdorf, Tsung Lin Tang, Wang Shen Su, Chia Min Lin
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Publication number: 20160290883Abstract: A pressure sensor comprises a deformable membrane deflecting in response to pressure applied, a first stationary electrode, and a second electrode coupled to the deformable membrane, for determining a change in a capacitance between the first and the second electrode in response to the pressure applied. At least one of the first and the second electrode comprises a getter material for collecting gas molecules.Type: ApplicationFiled: March 30, 2016Publication date: October 6, 2016Inventors: Johannes Schumm, Andreas Reinhard, Thomas Kraehenbuehl, Stefan Thiele, Rene Hummel, Chung-Hsien Lin, Wang Shen Su, Tsung Lin Tang, Chia Min Lin
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Publication number: 20150122042Abstract: A pressure sensor comprises a first substrate and a cap attached to the first substrate. The cap includes a processing circuit, a cavity and a deformable membrane separating the cavity and a port open to an outside of the pressure sensor. Sensing means are provided for converting a response of the deformable membrane to pressure at the port into a signal capable of being processed by the processing circuit. The cap is attached to the first substrate such that the deformable membrane faces the first substrate and such that a gap is provided between the deformable membrane and the first substrate which gap contributes to the port. The first substrate comprises a support portion the cap is attached to, a contact portion for electrically connecting the pressure sensor to an external device, and one or more suspension elements for suspending the support portion from the contact portion.Type: ApplicationFiled: October 23, 2014Publication date: May 7, 2015Inventors: Chung-Hsien LIN, Rene Hummel, Ulrich Bartsch, Marion Hermersdorf, Tsung Lin Tang, Wang Shen Su, Chia Min Lin
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Publication number: 20150122041Abstract: A pressure sensor comprises a first substrate and a cap attached to the first substrate. The cap includes a processing circuit, a cavity and a deformable membrane separating the cavity and a port open to an outside of the pressure sensor. Sensing means are provided for converting a response of the deformable membrane to pressure at the port into a signal capable of being processed by the processing circuit. The cap is attached to the first substrate such that the deformable membrane faces the first substrate and such that a gap is provided between the deformable membrane and the first substrate which gap contributes to the port. The first substrate comprises a support portion the cap is attached to, a contact portion for electrically connecting the pressure sensor to an external device, and one or more suspension elements for suspending the support portion from the contact portion.Type: ApplicationFiled: November 6, 2014Publication date: May 7, 2015Inventors: Chung-Hsien LIN, Rene HUMMEL, Ulrich BARTSCH, Marion HERMERSDORF, Tsung Lin TANG, Wang Shen SU, Chia Min LIN
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Patent number: 7540751Abstract: A method for fabricating a microconnector and the shape of terminals of the microconnector is proposed, which combines a cover with a base as a female connector, inserts an inserting member as a male connector between the cover and the base, and the ends of the terminals at the base electrically connecting the inserting member undergoing plasma treatment for controlling the shape thereof. The terminals of the microconnector can be actuated with by a low voltage. By such arrangement, the inserting member can be firmly engaged and the intervals between terminals and the overall size of the microconnector can be reduced while providing low insertion force and electrostatic actuating force.Type: GrantFiled: July 3, 2006Date of Patent: June 2, 2009Assignee: Industrial Technology Research InstituteInventors: Ben-Hwa Jang, Shin-Way Lin, Wei-Leun Fang, Wang-Shen Su
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Patent number: 7497712Abstract: A method for fabricating a microconnector and the shape of terminals of the microconnector is proposed, which combines a cover with a base as a female connector, inserts an inserting member as a male connector between the cover and the base, and the ends of the terminals at the base electrically connecting the inserting member undergoing plasma treatment for controlling the shape thereof. The terminals of the microconnector can be actuated with by a low voltage. By such arrangement, the inserting member can be firmly engaged and the intervals between terminals and the overall size of the microconnector can be reduced while providing low insertion force and electrostatic actuating force.Type: GrantFiled: June 5, 2007Date of Patent: March 3, 2009Assignee: Industrial Technology Research InstituteInventors: Ben-Hwa Jang, Shin-Way Lin, Wei-Leun Fang, Wang-Shen Su
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Publication number: 20080045062Abstract: A method for fabricating a microconnector and the shape of terminals of the microconnector is proposed, which combines a cover with a base as a female connector, inserts an inserting member as a male connector between the cover and the base, and the ends of the terminals at the base electrically connecting the inserting member undergoing plasma treatment for controlling the shape thereof. The terminals of the microconnector can be actuated with by a low voltage. By such arrangement, the inserting member can be firmly engaged and the intervals between terminals and the overall size of the microconnector can be reduced while providing low insertion force and electrostatic actuating force.Type: ApplicationFiled: June 5, 2007Publication date: February 21, 2008Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Ben-Hwa Jang, Shin-Way Lin, Wei-Leun Fang, Wang-Shen Su
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Publication number: 20070004256Abstract: A method for fabricating a microconnector and the shape of terminals of the microconnector is proposed, which combines a cover with a base as a female connector, inserts an inserting member as a male connector between the cover and the base, and the ends of the terminals at the base electrically connecting the inserting member undergoing plasma treatment for controlling the shape thereof. The terminals of the microconnector can be actuated with by a low voltage. By such arrangement, the inserting member can be firmly engaged and the intervals between terminals and the overall size of the microconnector can be reduced while providing low insertion force and electrostatic actuating force.Type: ApplicationFiled: July 3, 2006Publication date: January 4, 2007Inventors: Ben-Hwa Jang, Shin-Way Lin, Wei-Leun Fang, Wang-Shen Su