Patents by Inventor Wang-Shen Su

Wang-Shen Su has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10816422
    Abstract: A pressure sensor comprises a first substrate and a cap attached to the first substrate. The cap includes a processing circuit, a cavity and a deformable membrane separating the cavity and a port open to an outside of the pressure sensor. Sensing means are provided for converting a response of the deformable membrane to pressure at the port into a signal capable of being processed by the processing circuit. The cap is attached to the first substrate such that the deformable membrane faces the first substrate and such that a gap is provided between the deformable membrane and the first substrate which gap contributes to the port. The first substrate comprises a support portion the cap is attached to, a contact portion for electrically connecting the pressure sensor to an external device, and one or more suspension elements for suspending the support portion from the contact portion.
    Type: Grant
    Filed: February 24, 2017
    Date of Patent: October 27, 2020
    Assignee: InvenSense, Inc.
    Inventors: Chung-Hsien Lin, Rene Hummel, Ulrich Bartsch, Marion Hermersdorf, Tsung Lin Tang, Wang Shen Su, Chia Min Lin
  • Patent number: 10712218
    Abstract: A sensor includes a deformable membrane that deflects in response to a stimuli. The sensor further includes a capacitive element coupled to the deformable membrane. The capacitive element is disposed within an enclosed cavity of the sensor. The capacitive element changes capacitance in response to the deformable membrane deflecting. The capacitive element comprises a getter material for collecting gas molecules within the enclosed cavity.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: July 14, 2020
    Assignee: InvenSense, Inc.
    Inventors: Johannes Schumm, Andreas Reinhard, Thomas Kraehenbuehl, Stefan Thiele, Rene Hummel, Chung-Hsien Lin, Wang Shen Su, Tsung Lin Tang, Chia Ming Lin
  • Publication number: 20190226932
    Abstract: A sensor includes a deformable membrane that deflects in response to a stimuli. The sensor further includes a capacitive element coupled to the deformable membrane. The capacitive element is disposed within an enclosed cavity of the sensor. The capacitive element changes capacitance in response to the deformable membrane deflecting. The capacitive element comprises a getter material for collecting gas molecules within the enclosed cavity.
    Type: Application
    Filed: March 29, 2019
    Publication date: July 25, 2019
    Inventors: Johannes SCHUMM, Andreas REINHARD, Thomas KRAEHENBUEHL, Stefan THIELE, Rene HUMMEL, Chung-Hsien LIN, Wang Shen SU, Tsung Lin TANG, Chia Ming LIN
  • Patent number: 10254185
    Abstract: A sensor includes a deformable membrane that deflects in response to a stimuli. The sensor further includes a capacitive element coupled to the deformable membrane. The capacitive element is disposed within an enclosed cavity of the sensor. The capacitive element changes capacitance in response to the deformable membrane deflecting. The capacitive element comprises a getter material for collecting gas molecules within the enclosed cavity.
    Type: Grant
    Filed: March 14, 2018
    Date of Patent: April 9, 2019
    Assignee: InvenSense, Inc.
    Inventors: Johannes Schumm, Andreas Reinhard, Thomas Kraehenbuehl, Stefan Thiele, Rene Hummel, Chung-Hsien Lin, Wang Shen Su, Tsung Lin Tang, Chia Min Lin
  • Publication number: 20180202882
    Abstract: A sensor includes a deformable membrane that deflects in response to a stimuli. The sensor further includes a capacitive element coupled to the deformable membrane. The capacitive element is disposed within an enclosed cavity of the sensor. The capacitive element changes capacitance in response to the deformable membrane deflecting. The capacitive element comprises a getter material for collecting gas molecules within the enclosed cavity.
    Type: Application
    Filed: March 14, 2018
    Publication date: July 19, 2018
    Inventors: Johannes Schumm, Andreas Reinhard, Thomas Kraehenbuehl, Stefan Thiele, Rene Hummel, Chung-Hsien Lin, Wang Shen Su, Tsung Lin Tang, Chia Min Lin
  • Patent number: 9958349
    Abstract: A pressure sensor comprises a deformable membrane deflecting in response to pressure applied, a first stationary electrode, and a second electrode coupled to the deformable membrane, for determining a change in a capacitance between the first and the second electrode in response to the pressure applied. At least one of the first and the second electrode comprises a getter material for collecting gas molecules.
    Type: Grant
    Filed: March 30, 2016
    Date of Patent: May 1, 2018
    Assignee: INVENSENSE, INC.
    Inventors: Johannes Schumm, Andreas Reinhard, Thomas Kraehenbuehl, Stefan Thiele, Rene Hummel, Chung-Hsien Lin, Wang Shen Su, Tsung Lin Tang, Chia Min Lin
  • Publication number: 20170167933
    Abstract: A pressure sensor comprises a first substrate and a cap attached to the first substrate. The cap includes a processing circuit, a cavity and a deformable membrane separating the cavity and a port open to an outside of the pressure sensor. Sensing means are provided for converting a response of the deformable membrane to pressure at the port into a signal capable of being processed by the processing circuit. The cap is attached to the first substrate such that the deformable membrane faces the first substrate and such that a gap is provided between the deformable membrane and the first substrate which gap contributes to the port. The first substrate comprises a support portion the cap is attached to, a contact portion for electrically connecting the pressure sensor to an external device, and one or more suspension elements for suspending the support portion from the contact portion.
    Type: Application
    Filed: February 24, 2017
    Publication date: June 15, 2017
    Inventors: Chung-Hsien LIN, Rene HUMMEL, Ulrich BARTSCH, Marion HERMERSDORF, Tsung Lin TANG, Wang Shen SU, Chia Min LIN
  • Patent number: 9581512
    Abstract: A pressure sensor comprises a first substrate and a cap attached to the first substrate. The cap includes a processing circuit, a cavity and a deformable membrane separating the cavity and a port open to an outside of the pressure sensor. Sensing means are provided for converting a response of the deformable membrane to pressure at the port into a signal capable of being processed by the processing circuit. The cap is attached to the first substrate such that the deformable membrane faces the first substrate and such that a gap is provided between the deformable membrane and the first substrate which gap contributes to the port. The first substrate comprises a support portion the cap is attached to, a contact portion for electrically connecting the pressure sensor to an external device, and one or more suspension elements for suspending the support portion from the contact portion.
    Type: Grant
    Filed: October 23, 2014
    Date of Patent: February 28, 2017
    Assignee: INVENSENSE, INC.
    Inventors: Chung-Hsien Lin, Rene Hummel, Ulrich Bartsch, Marion Hermersdorf, Tsung Lin Tang, Wang Shen Su, Chia Min Lin
  • Publication number: 20160290883
    Abstract: A pressure sensor comprises a deformable membrane deflecting in response to pressure applied, a first stationary electrode, and a second electrode coupled to the deformable membrane, for determining a change in a capacitance between the first and the second electrode in response to the pressure applied. At least one of the first and the second electrode comprises a getter material for collecting gas molecules.
    Type: Application
    Filed: March 30, 2016
    Publication date: October 6, 2016
    Inventors: Johannes Schumm, Andreas Reinhard, Thomas Kraehenbuehl, Stefan Thiele, Rene Hummel, Chung-Hsien Lin, Wang Shen Su, Tsung Lin Tang, Chia Min Lin
  • Publication number: 20150122042
    Abstract: A pressure sensor comprises a first substrate and a cap attached to the first substrate. The cap includes a processing circuit, a cavity and a deformable membrane separating the cavity and a port open to an outside of the pressure sensor. Sensing means are provided for converting a response of the deformable membrane to pressure at the port into a signal capable of being processed by the processing circuit. The cap is attached to the first substrate such that the deformable membrane faces the first substrate and such that a gap is provided between the deformable membrane and the first substrate which gap contributes to the port. The first substrate comprises a support portion the cap is attached to, a contact portion for electrically connecting the pressure sensor to an external device, and one or more suspension elements for suspending the support portion from the contact portion.
    Type: Application
    Filed: October 23, 2014
    Publication date: May 7, 2015
    Inventors: Chung-Hsien LIN, Rene Hummel, Ulrich Bartsch, Marion Hermersdorf, Tsung Lin Tang, Wang Shen Su, Chia Min Lin
  • Publication number: 20150122041
    Abstract: A pressure sensor comprises a first substrate and a cap attached to the first substrate. The cap includes a processing circuit, a cavity and a deformable membrane separating the cavity and a port open to an outside of the pressure sensor. Sensing means are provided for converting a response of the deformable membrane to pressure at the port into a signal capable of being processed by the processing circuit. The cap is attached to the first substrate such that the deformable membrane faces the first substrate and such that a gap is provided between the deformable membrane and the first substrate which gap contributes to the port. The first substrate comprises a support portion the cap is attached to, a contact portion for electrically connecting the pressure sensor to an external device, and one or more suspension elements for suspending the support portion from the contact portion.
    Type: Application
    Filed: November 6, 2014
    Publication date: May 7, 2015
    Inventors: Chung-Hsien LIN, Rene HUMMEL, Ulrich BARTSCH, Marion HERMERSDORF, Tsung Lin TANG, Wang Shen SU, Chia Min LIN
  • Patent number: 7540751
    Abstract: A method for fabricating a microconnector and the shape of terminals of the microconnector is proposed, which combines a cover with a base as a female connector, inserts an inserting member as a male connector between the cover and the base, and the ends of the terminals at the base electrically connecting the inserting member undergoing plasma treatment for controlling the shape thereof. The terminals of the microconnector can be actuated with by a low voltage. By such arrangement, the inserting member can be firmly engaged and the intervals between terminals and the overall size of the microconnector can be reduced while providing low insertion force and electrostatic actuating force.
    Type: Grant
    Filed: July 3, 2006
    Date of Patent: June 2, 2009
    Assignee: Industrial Technology Research Institute
    Inventors: Ben-Hwa Jang, Shin-Way Lin, Wei-Leun Fang, Wang-Shen Su
  • Patent number: 7497712
    Abstract: A method for fabricating a microconnector and the shape of terminals of the microconnector is proposed, which combines a cover with a base as a female connector, inserts an inserting member as a male connector between the cover and the base, and the ends of the terminals at the base electrically connecting the inserting member undergoing plasma treatment for controlling the shape thereof. The terminals of the microconnector can be actuated with by a low voltage. By such arrangement, the inserting member can be firmly engaged and the intervals between terminals and the overall size of the microconnector can be reduced while providing low insertion force and electrostatic actuating force.
    Type: Grant
    Filed: June 5, 2007
    Date of Patent: March 3, 2009
    Assignee: Industrial Technology Research Institute
    Inventors: Ben-Hwa Jang, Shin-Way Lin, Wei-Leun Fang, Wang-Shen Su
  • Publication number: 20080045062
    Abstract: A method for fabricating a microconnector and the shape of terminals of the microconnector is proposed, which combines a cover with a base as a female connector, inserts an inserting member as a male connector between the cover and the base, and the ends of the terminals at the base electrically connecting the inserting member undergoing plasma treatment for controlling the shape thereof. The terminals of the microconnector can be actuated with by a low voltage. By such arrangement, the inserting member can be firmly engaged and the intervals between terminals and the overall size of the microconnector can be reduced while providing low insertion force and electrostatic actuating force.
    Type: Application
    Filed: June 5, 2007
    Publication date: February 21, 2008
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ben-Hwa Jang, Shin-Way Lin, Wei-Leun Fang, Wang-Shen Su
  • Publication number: 20070004256
    Abstract: A method for fabricating a microconnector and the shape of terminals of the microconnector is proposed, which combines a cover with a base as a female connector, inserts an inserting member as a male connector between the cover and the base, and the ends of the terminals at the base electrically connecting the inserting member undergoing plasma treatment for controlling the shape thereof. The terminals of the microconnector can be actuated with by a low voltage. By such arrangement, the inserting member can be firmly engaged and the intervals between terminals and the overall size of the microconnector can be reduced while providing low insertion force and electrostatic actuating force.
    Type: Application
    Filed: July 3, 2006
    Publication date: January 4, 2007
    Inventors: Ben-Hwa Jang, Shin-Way Lin, Wei-Leun Fang, Wang-Shen Su