Patents by Inventor Wang Xianfeng

Wang Xianfeng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140340186
    Abstract: A low cost, high performance electronic device for use in electronic circuits and methods. In one exemplary embodiment, the device includes an interleaved flat coil arrangement that ensures low leakage inductance while using a smaller number of flat coil windings compared to prior art devices. The flat coil windings further include features that are configured to mate with the header assembly terminal pins which substantially simplify the manufacturing process. Methods for manufacturing the device are also disclosed.
    Type: Application
    Filed: April 2, 2014
    Publication date: November 20, 2014
    Inventors: Wang Xianfeng, Ma Hongzhong
  • Patent number: 8005650
    Abstract: Embodiments of the invention include a method for generating a two-dimensional (2D) flattened nailboard representation of a wiring harness in a three-dimensional (3D) computer-aided design (CAD) model. The nailboard representation invention may be used to provide a dimensionally accurate “flattened” view of a complex 3D wiring harness depicted in a CAD model, without cutting any of the wires included in the harness, and minimizing the overlap of multiple exposed wires present in wire loops.
    Type: Grant
    Filed: February 28, 2008
    Date of Patent: August 23, 2011
    Assignee: Autodesk, Inc.
    Inventors: Steve Flores, Baolin Jiang, Wang Xianfeng, Chengyun Yang
  • Publication number: 20090222121
    Abstract: Embodiments of the invention include a method for generating a two-dimensional (2D) flattened nailboard representation of a wiring harness in a three-dimensional (3D) computer-aided design (CAD) model. The nailboard representation invention may be used to provide a dimensionally accurate “flattened” view of a complex 3D wiring harness depicted in a CAD model, without cutting any of the wires included in the harness, and minimizing the overlap of multiple exposed wires present in wire loops.
    Type: Application
    Filed: February 28, 2008
    Publication date: September 3, 2009
    Inventors: STEVE FLORES, Baolin Jiang, Wang Xianfeng, Chengyun Yang