Patents by Inventor Wang-Yi Chang

Wang-Yi Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150240863
    Abstract: A microstructure sucker device includes a substrate, a microstructure and an operation surface. The microstructure is arranged on the first surface of the substrate to form a microstructure sucker layer. The operation surface is provided on the second surface of the substrate and corresponds to the surface sucker layer. An operation method of the microstructure sucker device includes: aligning the sucker layer with a predetermined surface; attaching the microstructure sucker layer to the predetermined surface; pressing the microstructure sucker layer to discharge an amount of air from the microstructure sucker layer to suck the predetermined surface; pulling an edge of the microstructure sucker layer to separate the microstructure sucker layer from the predetermined surface.
    Type: Application
    Filed: December 31, 2014
    Publication date: August 27, 2015
    Inventors: Yi-Chang Chung, Wang-Yi Chang, Yi-Hong Chiu