Patents by Inventor Wang Yuchun

Wang Yuchun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Composition and method for enhancing pot life of hydrogen peroxide-containing CMP slurries
    Publication number: 20080132071
    Abstract: A method for providing CMP slurries for copper CMP that have improved pot life by ameliorating hydrogen peroxide degradation in slurries. The method comprises a composition that has a transition metal content of less than about 5 parts per million (ppm), preferably less than about 2 ppm. Preferably the method comprises a composition containing less than about 2 ppm of yttrium, zirconium, and/or iron.
    Type: Application
    Filed: January 25, 2008
    Publication date: June 5, 2008
    Inventors: Wang Yuchun, Bin Lu, John Parker, Roger Martin
  • Composition and method for enhancing pot life of hydrogen peroxide-containing CMP slurries
    Publication number: 20070068901
    Abstract: A composition suitable for copper chemical-mechanical polishing (CMP) comprises an abrasive powder, such as a silica and/or alumina abrasive, in a liquid carrier. The composition has a transition metal content of less than about 5 parts per million (ppm), preferably less than about 2 ppm. Preferably the composition contains less than about 2 ppm of yttrium, zirconium, and/or iron. The CMP compositions, when combined with hydrogen peroxide, provide CMP slurries for copper CMP that have improved pot life by ameliorating hydrogen peroxide degradation in slurries.
    Type: Application
    Filed: September 29, 2005
    Publication date: March 29, 2007
    Inventors: Wang Yuchun, Bin Lu, John Parker, Roger Martin