Patents by Inventor WanGeng LI

WanGeng LI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer acceptance test tool and test method using thereof
    Patent number: 12613270
    Abstract: A method includes pressing probes against probe pads on a test line over a substrate at a first position on the probe pads to form first probe marks on the probe pads; capturing first images of the first probe marks on the probe pads; transmitting the captured first images of the first probe marks to an image inspection machine; identifying the first probe marks from the probe pads of the captured first images through the image inspection machine; determining whether the identified first probe marks are acceptable through the image inspection machine; in response to the determination determines that the identified first probe marks are acceptable, performing a first wafer acceptance test (WAT) to the substrate with the probes at the first position.
    Type: Grant
    Filed: November 21, 2023
    Date of Patent: April 28, 2026
    Assignees: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., TSMC CHINA COMPANY LIMITED
    Inventors: Jin Yao, SenSen Zhang, Ni Shen, WanGeng Li, Chang-Chun Xu
  • WAFER ACCEPTANCE TEST TOOL AND TEST METHOD USING THEREOF
    Publication number: 20250155491
    Abstract: A method includes pressing probes against probe pads on a test line over a substrate at a first position on the probe pads to form first probe marks on the probe pads; capturing first images of the first probe marks on the probe pads; transmitting the captured first images of the first probe marks to an image inspection machine; identifying the first probe marks from the probe pads of the captured first images through the image inspection machine; determining whether the identified first probe marks are acceptable through the image inspection machine; in response to the determination determines that the identified first probe marks are acceptable, performing a first wafer acceptance test (WAT) to the substrate with the probes at the first position.
    Type: Application
    Filed: November 21, 2023
    Publication date: May 15, 2025
    Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., TSMC CHINA COMPANY LIMITED
    Inventors: Jin YAO, SenSen ZHANG, Ni SHEN, WanGeng LI, Chang-Chun XU