Patents by Inventor Wangi CHA

Wangi CHA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • STAGE AND SUBSTRATE TREATMENT APPARATUS INCLUDING THE SAME
    Publication number: 20250343057
    Abstract: A stage including: a body portion configured to support a substrate, wherein the body portion includes a flow path; and a peripheral device, at least a part of which is located inside the body portion, wherein the part of the peripheral device is positioned at the same height as the flow path and overlaps the flow path when viewed from above, wherein the flow path is partitioned by a flow path partition wall, wherein the part of the peripheral device is surrounded by an internal element partition and included within an internal space of the internal element partition, wherein a thickness of the flow path partition wall is smaller than a maximum width of the internal space in a direction perpendicular to a side of the flow path partition wall.
    Type: Application
    Filed: March 6, 2025
    Publication date: November 6, 2025
    Inventors: DASOM LEE, MINSUNG KIM, SUDONG MOON, HAN SANG KIM, WANGI CHA, HAKJONG YU
  • ANTENNA MODULE AND ELECTRONIC DEVICE INCLUDING SAME
    Publication number: 20250294681
    Abstract: An electronic device is provided. The electronic device includes multiple antenna arrays, multiple first printed circuit board (PCB) sets corresponding to the multiple antenna arrays, a second PCB including a power interface, and a grid array configured to couple a first surface of each of first PCBs of the first PCB sets corresponding to an antenna array and a first surface of the second PCB, wherein the size of the first PCB is smaller than that of the second PCB, and a feeding line configured to transfer a signal to an antenna element is formed on at least one of a layer corresponding to the first surface of each of the first PCBs or a layer corresponding to the first surface of the second PCB.
    Type: Application
    Filed: June 2, 2025
    Publication date: September 18, 2025
    Inventors: Kwanghyun BAEK, Youngsub KIM, Jinhoon KIM, Chunmyung PARK, Youngju LEE, Juneseok LEE, Wangi CHA, Dohyuk HA
  • Antenna module and electronic device including same
    Patent number: 12389540
    Abstract: An electronic device is provided. The electronic device includes multiple antenna arrays, multiple first printed circuit board (PCB) sets corresponding to the multiple antenna arrays, a second PCB including a power interface, and a grid array configured to couple a first surface of each of first PCBs of the first PCB sets corresponding to an antenna array and a first surface of the second PCB, wherein the size of the first PCB is smaller than that of the second PCB, and a feeding line configured to transfer a signal to an antenna element is formed on at least one of a layer corresponding to the first surface of each of the first PCBs or a layer corresponding to the first surface of the second PCB.
    Type: Grant
    Filed: February 3, 2023
    Date of Patent: August 12, 2025
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kwanghyun Baek, Youngsub Kim, Jinhoon Kim, Chunmyung Park, Youngju Lee, Juneseok Lee, Wangi Cha, Dohyuk Ha
  • Antenna module and electronic device including same
    Patent number: 12349277
    Abstract: An electronic device is provided. The electronic device includes multiple antenna arrays, multiple first printed circuit board (PCB) sets corresponding to the multiple antenna arrays, a second PCB including a power interface, and a grid array configured to couple a first surface of each of first PCBs of the first PCB sets corresponding to an antenna array and a first surface of the second PCB, wherein the size of the first PCB is smaller than that of the second PCB, and a feeding line configured to transfer a signal to an antenna element is formed on at least one of a layer corresponding to the first surface of each of the first PCBs or a layer corresponding to the first surface of the second PCB.
    Type: Grant
    Filed: February 3, 2023
    Date of Patent: July 1, 2025
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kwanghyun Baek, Youngsub Kim, Jinhoon Kim, Chunmyung Park, Youngju Lee, Juneseok Lee, Wangi Cha, Dohyuk Ha
  • ANTENNA MODULE AND ELECTRONIC DEVICE INCLUDING SAME
    Publication number: 20230187833
    Abstract: An electronic device is provided. The electronic device includes multiple antenna arrays, multiple first printed circuit board (PCB) sets corresponding to the multiple antenna arrays, a second PCB including a power interface, and a grid array configured to couple a first surface of each of first PCBs of the first PCB sets corresponding to an antenna array and a first surface of the second PCB, wherein the size of the first PCB is smaller than that of the second PCB, and a feeding line configured to transfer a signal to an antenna element is formed on at least one of a layer corresponding to the first surface of each of the first PCBs or a layer corresponding to the first surface of the second PCB.
    Type: Application
    Filed: February 3, 2023
    Publication date: June 15, 2023
    Inventors: Kwanghyun BAEK, Youngsub KIM, Jinhoon KIM, Chunmyung PARK, Youngju LEE, Juneseok LEE, Wangi CHA, Dohyuk HA