Abstract: A dual-shaft synchronous transmission device includes a hinge structure, a driving structure, and a linkage assembly, which are linked with each other. The hinge structure includes a first shaft, a second shaft parallel to the first shaft, and a carrier fixed on the first shaft and having a track slot. The driving structure is sleeved at the first shaft and can be driven by the second shaft. A guiding slot is formed on the outer surface of the driving structure. The linkage assembly includes a linking member sleeved at the guiding slot, a first connecting rod connected to the linking member, a second connecting rod linked to the linking member. The linking member is configured to move along the guiding slot with respect to the driving structure and parallel to the first shaft for driving a column of the second connecting rod in the track slot.

Abstract: A dual-shaft synchronous transmission device includes a hinge structure, a driving structure, and a linkage assembly, which are linked with each other. The hinge structure includes a first shaft, a second shaft parallel to the first shaft, and a carrier fixed on the first shaft and having a track slot. The driving structure is sleeved at the first shaft and can be driven by the second shaft. A guiding slot is formed on the outer surface of the driving structure. The linkage assembly includes a linking member sleeved at the guiding slot, a first connecting rod connected to the linking member, a second connecting rod linked to the linking member. The linking member is configured to move along the guiding slot with respect to the driving structure and parallel to the first shaft for driving a column of the second connecting rod in the track slot.

Abstract: The present invention discloses a content protection system in a storage medium and the method of the same. The storage medium includes a flash disk, a memory card, a hard disk, a CDR, or a MO. In one aspect of the present invention, the content protection system in a storage medium includes a database; a partitioning module coupled to the database to partition the storage medium; and a link table managing module coupled to the database to establish and manage a link table of a file to be stored in the storage medium.

Abstract: A payment relay system according to the present disclosure may allow even a PG server, which is unable to access (use) account information or card information, to process a payment for a cost and a wire transfer by using a key value of an online ID, which substitutes for a bank account or a credit card, and is configured in a form of file or by a combination of numbers and characters. Also, the payment relay system can also minimize a separate change or the demand on devices for processing such payment manner.

Abstract: An electronic apparatus includes a main board, a semiconductor package, an upper conductive EMI shield member, and a lower conductive EMI shield member. The main board includes a first ground pad. The semiconductor package is spaced apart from and electrically connected to the main board. The upper conductive EMI shield member covers a top surface and a sidewall of the semiconductor package. The lower conductive EMI shield member surrounds a space between the main board and the semiconductor package, and is electrically connected to the upper conductive EMI shield member and the first ground pad.

Abstract: Disclosed is a financial transaction relay system using a mobile terminal, capable of allowing a user of a mobile terminal to perform payment or receive payment using the mobile terminal, even if the user does not know a payment means or a payment place of another party. The financial transaction relay system is configured to perform a financial transaction with respect to a product cost, a service cost and to perform a general money transfer.

Abstract: An electronic apparatus includes a main board, a semiconductor package, an upper conductive EMI shield member, and a lower conductive EMI shield member. The main board includes a first ground pad. The semiconductor package is spaced apart from and electrically connected to the main board. The upper conductive EMI shield member covers a top surface and a sidewall of the semiconductor package. The lower conductive EMI shield member surrounds a space between the main board and the semiconductor package, and is electrically connected to the upper conductive EMI shield member and the first ground pad.

Abstract: Provided are a rotation joint capable of compensating for a mismatch due to thermal expansion and a semiconductor device having the same. The rotation joint can include a support member and a first contact member coupled to a first portion of the support member such that a surface of the first contact member is moveable relative to a surface of the support member adjacent to the first contact member. The first contact member can include solder material.

Abstract: Provided is a wafer level chip scale package that reduces the parasitic capacitance generated between ball pads and the solder balls, and enhances the joint reliability between the ball pads and the solder balls. The wafer level chip scale package provides a conductive pattern in each ball pad section, on which a solder ball is mounted, so as to have a spiral or mesh shape, provides a space defined by the conductive pattern such that a first dielectric layer under the conductive pattern is exposed, and provides the solder ball on a top surface of each ball pad section such that part of the solder ball is inserted into the space defined by the conductive pattern. When viewed from the top, the dielectric layer is exposed from each ball pad section by an area of about 50% or less.

Abstract: The present invention discloses a content protection system in a storage medium and the method of the same. The storage medium includes a flash disk, a memory card, a hard disk, a CDR, or a MO. In one aspect of the present invention, the content protection system in a storage medium includes a database; a partitioning module coupled to the database to partition the storage medium; and a link table managing module coupled to the database to establish and manage a link table of a file to be stored in the storage medium.

Abstract: Provided are a rotation joint capable of compensating for a mismatch due to thermal expansion and a semiconductor device having the same. The rotation joint can include a support member and a first contact member coupled to a first portion of the support member such that a surface of the first contact member is moveable relative to a surface of the support member adjacent to the first contact member. The first contact member can include solder material.

Abstract: Provided are a semiconductor package and a manufacturing method thereof. The semiconductor package includes a flexible film with a film wire region formed of a film substrate region on which a semiconductor chip is mounted, and a plurality of sub film wires branching and extending from the film substrate region and electrically connected to the semiconductor chip. A plurality of external contact terminals arranged on the outer surface of the flexible film and electrically connected to the semiconductor chip is further included. Also included is a plurality of conductive patterns having first pads disposed in the flexible film, arranged on the film substrate region, and electrically connected to one of the plurality of external contact terminals; and second pads arranged on the film wire region and electrically connected to the semiconductor chip.

Abstract: Provided is a wafer level chip scale package that reduces the parasitic capacitance generated between ball pads and the solder balls, and enhances the joint reliability between the ball pads and the solder balls. The wafer level chip scale package provides a conductive pattern in each ball pad section, on which a solder ball is mounted, so as to have a spiral or mesh shape, provides a space defined by the conductive pattern such that a first dielectric layer under the conductive pattern is exposed, and provides the solder ball on a top surface of each ball pad section such that part of the solder ball is inserted into the space defined by the conductive pattern. When viewed from the top, the dielectric layer is exposed from each ball pad section by an area of about 50% or less.

Abstract: Provided is a board-on-chip package and stack package using the same to reduce the likelihood that bonding wires in an encapsulant may be damaged due to mechanical stresses applied during a package stacking process. A semiconductor package may have a spacer provided along the opposing sides of an encapsulant. The spacer may be spaced away from bonding wires embedded in the encapsulant. The height of the spacer may be greater than the height of the encapsulated bonding wire from the bottom surface of the semiconductor package. The spacer may be formed of a bar or a protrusion. In a stack package using the semiconductor package, the spacer may be provided between a semiconductor chip of a lower semiconductor package and an encapsulant of an upper semiconductor package.