Abstract: Disclosed in the present disclosure is a metal structural member used in cooperation with a gallium-based liquid metal. A high phosphorus nickel alloy layer is arranged on a surface of the metal structural member in contact with the gallium-based liquid metal. The metal structural member does not react with the gallium-based liquid metal when it is in contact with the gallium-based liquid metal, thereby avoiding a degradation of heat dissipation performance due to consumption of the gallium-based liquid metal. Further disclosed in the present disclosure are a manufacturing method for the metal structural member, and an application of the metal structural member in heat dissipation of computer chips, cell phone chips, communication products, high power LEDs, insulated gate bipolar transistors, and high power electronic products.

Abstract: Provided in the present disclosure is a liquid metal substrate cleaning method and cleaning and coating integrated device, belonging to the technical field of thermal interface materials construction. The above-mentioned method includes a substrate cleaning and a cleaning qualification inspection, wherein the substrate cleaning comprises a plasma cleaning, an inorganic cleaning reagent cleaning, and an organic reagent cleaning, and any combination of the plasma cleaning, the inorganic cleaning reagent cleaning and the organic reagent cleaning; and the cleaning qualification inspection is judged as qualified or not based on a diffusion area of the organic reagent on a surface of the liquid metal substrate, and when the diffusion area meets a predetermined requirement, the cleaning is finished; and when the diffusion area does not meet the predetermined requirement, the substrate cleaning step is repeated, and the steps are repeated in this way until the diffusion area meets the predetermined requirement.

Abstract: The disclosure discloses a liquid metal packaging structure for chip heat dissipation, comprising: a fixing frame and a sealing frame, wherein a chip is provided in the inner frame of the sealing frame, and a heat sink is provided on side of the sealing frame away from the electronic component, and the heat sink is hermetically covered on an end surface of the sealing frame, the sealing frame is filled with liquid metal, and the heat sink is integrally molded with a pressing block at a position corresponding to the inner frame of the sealing frame, and the liquid metal is arranged between the chip and the pressing block. According to the liquid metal packaging structure for chip heat dissipation, the sealing frame is fixed by the fixing frame, and the sealing frame is filled with liquid metal.