Abstract: Embodiments of this application relate to the electronic device field, and disclose an electronic device, a circuit board, and a manufacturing method for the circuit board, to resolve a problem that a requirement for a high through-current capability cannot be met because a via having a thick conductive layer cannot be manufactured on a circuit board connected to a high-power chip. The circuit board having a first surface includes a pad array and a first conductive hole that are both disposed on the first surface. The pad array includes at least one pad unit, and the pad unit includes at least two first power pads that are disposed adjacently. All the first power pads of the pad unit are connected to a same power network of the chip. The first conductive hole and the pad unit are disposed correspondingly.