Patents by Inventor Wangsheng Fang

Wangsheng Fang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • EMI shielding composition and process for applying it
    Patent number: 10287444
    Abstract: This invention relates to an EMI shielding composition comprising a thermoplastic resin and/or a thermoset resin, a solvent or a reactive diluent and conductive particles providing uniform and homogenous thickness to the EMI shielding layer. The invention also provides a process of applying the EMI shielding layer on the encapsulant protecting the CI device components.
    Type: Grant
    Filed: October 18, 2016
    Date of Patent: May 14, 2019
    Assignee: HENKEL AG & CO. KGAA
    Inventors: Wangsheng Fang, Wei Yao
  • Single crystal alumina filled die attach paste
    Patent number: 9796898
    Abstract: A die attach paste composition comprising (a) an organosilicone resin; (b) a single crystal alumina filler; (c) a hardener; and (d) an inhibitor. By using single crystal alumina filler in a silicone based die attach paste, thermal conductivity and anti-yellowing properties are improved in comparison with other spherical alumina particles at the same filler loading content.
    Type: Grant
    Filed: September 2, 2016
    Date of Patent: October 24, 2017
    Assignee: HENKEL AG & CO. KGAA
    Inventors: Long Fang, Wangsheng Fang, Wei Yao
  • EMI SHIELDING COMPOSITION AND PROCESS FOR APPLYING IT
    Publication number: 20170037261
    Abstract: This invention relates to an EMI shielding composition comprising a thermoplastic resin and/or a thermoset resin, a solvent or a reactive diluent and conductive particles providing uniform and homogenous thickness to the EMI shielding layer. The invention also provides a process of applying the EMI shielding layer on the encapsulant protecting the CI device components.
    Type: Application
    Filed: October 18, 2016
    Publication date: February 9, 2017
    Inventors: Wangsheng FANG, Wei YAO
  • SINGLE CRYSTAL ALUMINA FILLED DIE ATTACH PASTE
    Publication number: 20160369150
    Abstract: A die attach paste composition comprising (a) an organosilicone resin; (b) a single crystal alumina filler; (c) a hardener; and (d) an inhibitor. By using single crystal alumina filler in a silicone based die attach paste, thermal conductivity and anti-yellowing properties are improved in comparison with other spherical alumina particles at the same filler loading content.
    Type: Application
    Filed: September 2, 2016
    Publication date: December 22, 2016
    Inventors: Long Fang, Wangsheng Fang, Wei Yao