Patents by Inventor Wanhua Cai

Wanhua Cai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9694415
    Abstract: A method for manufacturing a mechanical part by hot stamping, and a mold and a system thereof. The method includes: heating a steel plate blank at a predetermined heating temperature; and placing the steel plate blank into a mold of the mechanical part, and stamping the steel plate blank to form wrinkles at a rounded corner of the mold and form the mechanical part in the mold: wherein, the mold of the mechanical part includes a female mold and a male mold, a stamping gap configured to accommodate the steel plate blank is provided between the female mold and the male mold, and a width of the stamping gap at the rounded corner of the mold is larger than a thickness of the wrinkles.
    Type: Grant
    Filed: December 31, 2012
    Date of Patent: July 4, 2017
    Assignee: Advanced Manufacture Technology Center, China Academy of Machinery Science & Technology
    Inventors: Zhongde Shan, Chao Jiang, Milan Zhang, Wanhua Cai, Yongsheng Ye
  • Publication number: 20140261920
    Abstract: A method for manufacturing a mechanical part by hot stamping, and a mold and a system thereof. The method includes: heating a steel plate blank at a predetermined heating temperature; and placing the steel plate blank into a mold of the mechanical part, and stamping the steel plate blank to form wrinkles at a rounded corner of the mold and form the mechanical part in the mold: wherein, the mold of the mechanical part includes a female mold and a male mold, a stamping gap configured to accommodate the steel plate blank is provided between the female mold and the male mold and a width of the stamping gap at the rounded corner of the mold is larger than a thickness of the wrinkles.
    Type: Application
    Filed: December 31, 2012
    Publication date: September 18, 2014
    Inventors: Zhongde Shan, Chao Jiang, Milan Zhang, Wanhua Cai, Yongsheng Ye