Patents by Inventor Wanjun Cao

Wanjun Cao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11885182
    Abstract: A cutting element comprises a supporting substrate, and a cutting table attached to an end of the supporting substrate. The cutting table comprises inter-bonded diamond particles, and a thermally stable material within interstitial spaces between the inter-bonded diamond particles. The thermally stable material comprises a carbide precipitate having the general chemical formula, A3XZn-1, where A comprises one or more of Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Y, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Hf, Ta, W, Re, Os, Ir, Pt, Au, Hg, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Ac, Th, Pa, and U; X comprises one or more of Al, Ga, Sn, Be, Bi, Te, Sb, Se, As, Ge, Si, B, and P; Z comprises C; and n is greater than or equal to 0 and less than or equal to 0.75. A method of forming a cutting element, an earth-boring tool, a supporting substrate, and a method of forming a supporting substrate are also described.
    Type: Grant
    Filed: May 11, 2022
    Date of Patent: January 30, 2024
    Assignee: Baker Hughes Holdings LLC
    Inventors: Wanjun Cao, Marc W. Bird
  • Patent number: 11807920
    Abstract: A method of forming a supporting substrate for a cutting element comprises forming a precursor composition comprising discrete WC particles, a binding agent, and discrete particles comprising Co, one or more of Al, Be, Ga, Ge, Si, and Sn, and one or more of C and W. The precursor composition is subjected to a consolidation process to form a consolidated structure including WC particles dispersed in a homogenized binder comprising Co, W, C, and one or more of Al, Be, Ga, Ge, Si, and Sn. A method of forming a cutting element, a cutting element, a related structure, and an earth-boring tool are also described.
    Type: Grant
    Filed: May 10, 2022
    Date of Patent: November 7, 2023
    Assignee: Baker Hughes Holdings LLC
    Inventors: Wanjun Cao, Marc W. Bird
  • Patent number: 11732532
    Abstract: A cutting element comprises a supporting substrate, a cutting table comprising a hard material attached to the supporting substrate, and a fluid flow pathway extending through the supporting substrate and the cutting table. The fluid flow pathway is configured to direct fluid delivered to an outermost boundary of the supporting substrate through internal regions of the supporting substrate and the cutting table. A method of forming a cutting element and an earth-boring tool are also described.
    Type: Grant
    Filed: February 13, 2020
    Date of Patent: August 22, 2023
    Assignee: BAKER HUGHES HOLDINGS LLC
    Inventors: Wanjun Cao, Xu Huang, Steven W. Webb, Bo Yu
  • Publication number: 20230091691
    Abstract: A cutting element comprises a supporting substrate, and a cutting table attached to an end of the supporting substrate. The cutting table comprises inter-bonded diamond particles, and a thermally stable material within interstitial spaces between the inter-bonded diamond particles. The thermally stable material comprises a carbide precipitate having the general chemical formula, A3XZn-1, where A comprises one or more of Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Y, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Hf, Ta, W, Re, Os, Ir, Pt, Au, Hg, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Ac, Th, Pa, and U; X comprises one or more of Al, Ga, Sn, Be, Bi, Te, Sb, Se, As, Ge, Si, B, and P; Z comprises C; and n is greater than or equal to 0 and less than or equal to 0.75. A method of forming a cutting element, an earth-boring tool, a supporting substrate, and a method of forming a supporting substrate are also described.
    Type: Application
    Filed: October 31, 2022
    Publication date: March 23, 2023
    Inventors: Wanjun Cao, Marc W. Bird
  • Patent number: 11536091
    Abstract: A cutting element comprises a supporting substrate, and a cutting table attached to an end of the supporting substrate. The cutting table comprises inter-bonded diamond particles, and a thermally stable material within interstitial spaces between the inter-bonded diamond particles. The thermally stable material comprises a carbide precipitate having the general chemical formula, A3XZn-1, where A comprises one or more of Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Y, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Hf, Ta, W, Re, Os, Ir, Pt, Au, Hg, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Ac, Th, Pa, and U; X comprises one or more of Al, Ga, Sn, Be, Bi, Te, Sb, Se, As, Ge, Si, B, and P; Z comprises C; and n is greater than or equal to 0 and less than or equal to 0.75. A method of forming a cutting element, an earth-boring tool, a supporting substrate, and a method of forming a supporting substrate are also described.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: December 27, 2022
    Assignee: Baker Hughes Holding LLC
    Inventors: Wanjun Cao, Marc W. Bird
  • Publication number: 20220298866
    Abstract: A cutting element comprises a supporting substrate, and a cutting table attached to an end of the supporting substrate. The cutting table comprises inter-bonded diamond particles, and a thermally stable material within interstitial spaces between the inter-bonded diamond particles. The thermally stable material comprises a carbide precipitate having the general chemical formula, A3XZn-1, where A comprises one or more of Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Y, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Hf, Ta, W, Re, Os, Ir, Pt, Au, Hg, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Ac, Th, Pa, and U; X comprises one or more of Al, Ga, Sn, Be, Bi, Te, Sb, Se, As, Ge, Si, B, and P; Z comprises C; and n is greater than or equal to 0 and less than or equal to 0.75. A method of forming a cutting element, an earth-boring tool, a supporting substrate, and a method of forming a supporting substrate are also described.
    Type: Application
    Filed: May 11, 2022
    Publication date: September 22, 2022
    Inventors: Wanjun Cao, Marc W. Bird
  • Publication number: 20220298867
    Abstract: A cutting element comprises a supporting substrate, and a cutting table attached to an end of the supporting substrate. The cutting table comprises inter-bonded diamond particles, and a thermally stable material within interstitial spaces between the inter-bonded diamond particles. The thermally stable material comprises a carbide precipitate having the general chemical formula, A3XZn-1, where A comprises one or more of Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Y, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Hf, Ta, W, Re, Os, Ir, Pt, Au, Hg, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Ac, Th, Pa, and U; X comprises one or more of Al, Ga, Sn, Be, Bi, Te, Sb, Se, As, Ge, Si, B, and P; Z comprises C; and n is greater than or equal to 0 and less than or equal to 0.75. A method of forming a cutting element, an earth-boring tool, a supporting substrate, and a method of forming a supporting substrate are also described.
    Type: Application
    Filed: June 1, 2022
    Publication date: September 22, 2022
    Inventors: Wanjun Cao, Marc Bird
  • Publication number: 20220275486
    Abstract: A method of forming a supporting substrate for a cutting element comprises forming a precursor composition comprising discrete WC particles, a binding agent, and discrete particles comprising Co, one or more of Al, Be, Ga, Ge, Si, and Sn, and one or more of C and W. The precursor composition is subjected to a consolidation process to form a consolidated structure including WC particles dispersed in a homogenized binder comprising Co, W, C, and one or more of Al, Be, Ga, Ge, Si, and Sn. A method of forming a cutting element, a cutting element, a related structure, and an earth-boring tool are also described.
    Type: Application
    Filed: May 10, 2022
    Publication date: September 1, 2022
    Inventors: Wanjun Cao, Marc W. Bird
  • Patent number: 11396688
    Abstract: A method of forming a supporting substrate for a cutting element comprises forming a precursor composition comprising discrete WC particles, a binding agent, and discrete particles comprising Co, one or more of Al, Be, Ga, Ge, Si, and Sn, and one or more of C and W. The precursor composition is subjected to a consolidation process to form a consolidated structure including WC particles dispersed in a homogenized binder comprising Co, W, C, and one or more of Al, Be, Ga, Ge, Si, and Sn. A method of forming a cutting element, a cutting element, a related structure, and an earth-boring tool are also described.
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: July 26, 2022
    Assignee: Baker Hughes Holdings LLC
    Inventors: Wanjun Cao, Marc W. Bird
  • Patent number: 11242714
    Abstract: A method of forming a polycrystalline diamond compact includes forming a polycrystalline diamond material at a temperature and a pressure sufficient to form diamond-to-diamond bonds in the presence of a catalyst; substantially removing the catalyst from a volume of the polycrystalline diamond material from a first surface to a first leach depth; and substantially removing the catalyst from a volume of the polycrystalline diamond material from a second surface to a second, different leach depth. A polycrystalline diamond compact includes a polycrystalline diamond material having a first volume, a second volume, and a boundary between the first volume and the second volume. The first volume includes a catalyst disposed in interstitial spaces between diamond grains. The second volume is substantially free of the catalyst. The boundary's location is selected to control thermal stability and/or impact resistance.
    Type: Grant
    Filed: April 15, 2020
    Date of Patent: February 8, 2022
    Assignee: Baker Hughes Holdings LLC
    Inventors: Danny E. Scott, Wanjun Cao
  • Patent number: 11211205
    Abstract: The present invention is directed to a method for pre-lithiation of negative electrodes during lithium loaded electrode manufacturing for use in lithium-ion capacitors. There is provided a system and method of manufacture of LIC electrodes using thin lithium film having holes therein, and in particular, to the process of manufacturing lithium loaded negative electrodes for lithium-ion capacitors by pre-lithiating electrodes with thin lithium metal films, wherein the thin lithium metal films include holes therein, and the lithium loaded negative electrodes are manufactured using a roll-to-roll lamination manufacturing, process.
    Type: Grant
    Filed: August 10, 2020
    Date of Patent: December 28, 2021
    Assignee: THE FLORIDA STATE UNIVERSITY RESEARCH FOUNDATION, INC.
    Inventors: Wanjun Cao, Jian-ping Zheng
  • Patent number: 11180989
    Abstract: An instrumented cutting element, an earth-boring drilling tool, and related methods are disclosed. The instrumented cutting element may include a substrate base, a diamond table disposed on the substrate base, a sensor disposed within the diamond table, a lead wire coupled to the sensor and disposed within a side trench formed within the substrate base, and a filler material disposed within the side trench. The earth-boring drilling tool may include securing the instrumented cutting element to a blade of a bit body. A related method may include forming the instrumented cutting element and earth-boring drilling tool.
    Type: Grant
    Filed: July 3, 2018
    Date of Patent: November 23, 2021
    Assignee: Baker Hughes Holdings LLC
    Inventors: Wanjun Cao, Steven W. Webb, Juan Miguel Bilen
  • Patent number: 11111731
    Abstract: Methods of forming earth-boring tools including one or more instrumented cutting elements may involve placing a cutting element partially within a pocket extending into a body of an earth-boring tool. The cutting element may include a first hole extending partially through a cutting element from a back side of the cutting element toward a cutting face and a second, shorter, wider hole extending partially through the cutting element from the back side toward the cutting face. The second hole may be in fluid communication with the first hole. An extension including a passageway extending through the extension may be located at least partially within the second hole, such that the passageway may be in fluid communication with the first hole. A thermocouple may be inserted through the passageway and into the first hole after affixing the cutting element in the pocket.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: September 7, 2021
    Assignee: Baker Hughes Oilfield Operations LLC
    Inventors: Wanjun Cao, Juan Miguel Bilen, Steven W. Webb
  • Publication number: 20210172259
    Abstract: Methods of forming earth-boring tools including one or more instrumented cutting elements may involve placing a cutting element partially within a pocket extending into a body of an earth-boring tool. The cutting element may include a first hole extending partially through a cutting element from a back side of the cutting element toward a cutting face and a second, shorter, wider hole extending partially through the cutting element from the back side toward the cutting face. The second hole may be in fluid communication with the first hole. An extension including a passageway extending through the extension may be located at least partially within the second hole, such that the passageway may be in fluid communication with the first hole. A thermocouple may be inserted through the passageway and into the first hole after affixing the cutting element in the pocket.
    Type: Application
    Filed: December 6, 2019
    Publication date: June 10, 2021
    Inventors: Wanjun Cao, Juan Miguel Bilen, Steven W. Webb
  • Publication number: 20210118624
    Abstract: The present invention is directed to a method for pre-lithiation of negative electrodes during lithium loaded electrode manufacturing for use in lithium-ion capacitors. There is provided a system and method of manufacture of LIC electrodes using thin lithium film having holes therein, and in particular, to the process of manufacturing lithium loaded negative electrodes for lithium-ion capacitors by pre-lithiating electrodes with thin lithium metal films, wherein the thin lithium metal films include holes therein, and the lithium loaded negative electrodes are manufactured using a roll-to-roll lamination manufacturing, process.
    Type: Application
    Filed: August 10, 2020
    Publication date: April 22, 2021
    Inventors: Wanjun Cao, Jian-ping Zheng
  • Publication number: 20210047887
    Abstract: Cutting elements for earth-boring tools may include a cutting table secured to a substrate. The cutting table may include a first region at least substantially free of an infiltrant, a second region comprising the infiltrant, and a passageway extending from an exterior partially through the first region. A distance between the exterior and a boundary between the first region and the second region, as measured from a major surface of the cutting table, may not be constant. Methods of making cutting elements for earth-boring tools may involve placing a sacrificial material among grains of a superabrasive material. The grains of the superabrasive material and the sacrificial material may be exposed to elevated temperature and pressure in a presence of a catalyst material to form a cutting table. The sacrificial material and a portion of the catalyst material may be removed from a first region of the cutting table.
    Type: Application
    Filed: August 15, 2019
    Publication date: February 18, 2021
    Inventors: Wanjun Cao, Steven W. Webb, Xu Huang
  • Patent number: 10755867
    Abstract: The present invention is directed to a method for pre-lithiation of negative electrodes during lithium loaded electrode manufacturing for use in lithium-ion capacitors. There is provided a system and method of manufacture of LIC electrodes using thin lithium film having holes therein, and in particular, to the process of manufacturing lithium loaded negative electrodes for lithium-ion capacitors by pre-lithiating electrodes with thin lithium metal films, wherein the thin lithium metal films include holes therein, and the lithium loaded negative electrodes are manufactured using a roll-to-roll lamination manufacturing process.
    Type: Grant
    Filed: April 18, 2017
    Date of Patent: August 25, 2020
    Assignees: FLORIDA STATE UNIVERSITY RESEARCH FOUNDATION, INC, GENERAL CAPACITOR, LLC
    Inventors: Wanjun Cao, Jim P. Zheng
  • Publication number: 20200240216
    Abstract: A method of forming a polycrystalline diamond compact includes forming a polycrystalline diamond material at a temperature and a pressure sufficient to form diamond-to-diamond bonds in the presence of a catalyst; substantially removing the catalyst from a volume of the polycrystalline diamond material from a first surface to a first leach depth; and substantially removing the catalyst from a volume of the polycrystalline diamond material from a second surface to a second, different leach depth. A polycrystalline diamond compact includes a polycrystalline diamond material having a first volume, a second volume, and a boundary between the first volume and the second volume. The first volume includes a catalyst disposed in interstitial spaces between diamond grains. The second volume is substantially free of the catalyst. The boundary's location is selected to control thermal stability and/or impact resistance.
    Type: Application
    Filed: April 15, 2020
    Publication date: July 30, 2020
    Inventors: Danny E. Scott, Wanjun Cao
  • Publication number: 20200181984
    Abstract: A cutting element comprises a supporting substrate, a cutting table comprising a hard material attached to the supporting substrate, and a fluid flow pathway extending through the supporting substrate and the cutting table. The fluid flow pathway is configured to direct fluid delivered to an outermost boundary of the supporting substrate through internal regions of the supporting substrate and the cutting table. A method of forming a cutting element and an earth-boring tool are also described.
    Type: Application
    Filed: February 13, 2020
    Publication date: June 11, 2020
    Inventors: Wanjun Cao, Xu Huang, Steven W. Webb, Bo Yu
  • Patent number: 10633928
    Abstract: A method of forming a polycrystalline diamond compact includes forming a polycrystalline diamond material at a temperature and a pressure sufficient to form diamond-to-diamond bonds in the presence of a catalyst; substantially removing the catalyst from a volume of the polycrystalline diamond material from a first surface to a first leach depth; and substantially removing the catalyst from a volume of the polycrystalline diamond material from a second surface to a second, different leach depth. A polycrystalline diamond compact includes a polycrystalline diamond material having a first volume, a second volume, and a boundary between the first volume and the second volume. The first volume includes a catalyst disposed in interstitial spaces between diamond grains. The second volume is substantially free of the catalyst. The boundary's location is selected to control thermal stability and/or impact resistance.
    Type: Grant
    Filed: July 31, 2015
    Date of Patent: April 28, 2020
    Assignee: Baker Hughes, a GE company, LLC
    Inventors: Danny E. Scott, Wanjun Cao