Patents by Inventor Wanjun Cao
Wanjun Cao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11885182Abstract: A cutting element comprises a supporting substrate, and a cutting table attached to an end of the supporting substrate. The cutting table comprises inter-bonded diamond particles, and a thermally stable material within interstitial spaces between the inter-bonded diamond particles. The thermally stable material comprises a carbide precipitate having the general chemical formula, A3XZn-1, where A comprises one or more of Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Y, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Hf, Ta, W, Re, Os, Ir, Pt, Au, Hg, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Ac, Th, Pa, and U; X comprises one or more of Al, Ga, Sn, Be, Bi, Te, Sb, Se, As, Ge, Si, B, and P; Z comprises C; and n is greater than or equal to 0 and less than or equal to 0.75. A method of forming a cutting element, an earth-boring tool, a supporting substrate, and a method of forming a supporting substrate are also described.Type: GrantFiled: May 11, 2022Date of Patent: January 30, 2024Assignee: Baker Hughes Holdings LLCInventors: Wanjun Cao, Marc W. Bird
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Patent number: 11807920Abstract: A method of forming a supporting substrate for a cutting element comprises forming a precursor composition comprising discrete WC particles, a binding agent, and discrete particles comprising Co, one or more of Al, Be, Ga, Ge, Si, and Sn, and one or more of C and W. The precursor composition is subjected to a consolidation process to form a consolidated structure including WC particles dispersed in a homogenized binder comprising Co, W, C, and one or more of Al, Be, Ga, Ge, Si, and Sn. A method of forming a cutting element, a cutting element, a related structure, and an earth-boring tool are also described.Type: GrantFiled: May 10, 2022Date of Patent: November 7, 2023Assignee: Baker Hughes Holdings LLCInventors: Wanjun Cao, Marc W. Bird
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Patent number: 11732532Abstract: A cutting element comprises a supporting substrate, a cutting table comprising a hard material attached to the supporting substrate, and a fluid flow pathway extending through the supporting substrate and the cutting table. The fluid flow pathway is configured to direct fluid delivered to an outermost boundary of the supporting substrate through internal regions of the supporting substrate and the cutting table. A method of forming a cutting element and an earth-boring tool are also described.Type: GrantFiled: February 13, 2020Date of Patent: August 22, 2023Assignee: BAKER HUGHES HOLDINGS LLCInventors: Wanjun Cao, Xu Huang, Steven W. Webb, Bo Yu
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Publication number: 20230091691Abstract: A cutting element comprises a supporting substrate, and a cutting table attached to an end of the supporting substrate. The cutting table comprises inter-bonded diamond particles, and a thermally stable material within interstitial spaces between the inter-bonded diamond particles. The thermally stable material comprises a carbide precipitate having the general chemical formula, A3XZn-1, where A comprises one or more of Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Y, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Hf, Ta, W, Re, Os, Ir, Pt, Au, Hg, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Ac, Th, Pa, and U; X comprises one or more of Al, Ga, Sn, Be, Bi, Te, Sb, Se, As, Ge, Si, B, and P; Z comprises C; and n is greater than or equal to 0 and less than or equal to 0.75. A method of forming a cutting element, an earth-boring tool, a supporting substrate, and a method of forming a supporting substrate are also described.Type: ApplicationFiled: October 31, 2022Publication date: March 23, 2023Inventors: Wanjun Cao, Marc W. Bird
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Patent number: 11536091Abstract: A cutting element comprises a supporting substrate, and a cutting table attached to an end of the supporting substrate. The cutting table comprises inter-bonded diamond particles, and a thermally stable material within interstitial spaces between the inter-bonded diamond particles. The thermally stable material comprises a carbide precipitate having the general chemical formula, A3XZn-1, where A comprises one or more of Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Y, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Hf, Ta, W, Re, Os, Ir, Pt, Au, Hg, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Ac, Th, Pa, and U; X comprises one or more of Al, Ga, Sn, Be, Bi, Te, Sb, Se, As, Ge, Si, B, and P; Z comprises C; and n is greater than or equal to 0 and less than or equal to 0.75. A method of forming a cutting element, an earth-boring tool, a supporting substrate, and a method of forming a supporting substrate are also described.Type: GrantFiled: May 30, 2018Date of Patent: December 27, 2022Assignee: Baker Hughes Holding LLCInventors: Wanjun Cao, Marc W. Bird
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Publication number: 20220298866Abstract: A cutting element comprises a supporting substrate, and a cutting table attached to an end of the supporting substrate. The cutting table comprises inter-bonded diamond particles, and a thermally stable material within interstitial spaces between the inter-bonded diamond particles. The thermally stable material comprises a carbide precipitate having the general chemical formula, A3XZn-1, where A comprises one or more of Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Y, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Hf, Ta, W, Re, Os, Ir, Pt, Au, Hg, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Ac, Th, Pa, and U; X comprises one or more of Al, Ga, Sn, Be, Bi, Te, Sb, Se, As, Ge, Si, B, and P; Z comprises C; and n is greater than or equal to 0 and less than or equal to 0.75. A method of forming a cutting element, an earth-boring tool, a supporting substrate, and a method of forming a supporting substrate are also described.Type: ApplicationFiled: May 11, 2022Publication date: September 22, 2022Inventors: Wanjun Cao, Marc W. Bird
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Publication number: 20220298867Abstract: A cutting element comprises a supporting substrate, and a cutting table attached to an end of the supporting substrate. The cutting table comprises inter-bonded diamond particles, and a thermally stable material within interstitial spaces between the inter-bonded diamond particles. The thermally stable material comprises a carbide precipitate having the general chemical formula, A3XZn-1, where A comprises one or more of Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Y, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Hf, Ta, W, Re, Os, Ir, Pt, Au, Hg, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Ac, Th, Pa, and U; X comprises one or more of Al, Ga, Sn, Be, Bi, Te, Sb, Se, As, Ge, Si, B, and P; Z comprises C; and n is greater than or equal to 0 and less than or equal to 0.75. A method of forming a cutting element, an earth-boring tool, a supporting substrate, and a method of forming a supporting substrate are also described.Type: ApplicationFiled: June 1, 2022Publication date: September 22, 2022Inventors: Wanjun Cao, Marc Bird
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Publication number: 20220275486Abstract: A method of forming a supporting substrate for a cutting element comprises forming a precursor composition comprising discrete WC particles, a binding agent, and discrete particles comprising Co, one or more of Al, Be, Ga, Ge, Si, and Sn, and one or more of C and W. The precursor composition is subjected to a consolidation process to form a consolidated structure including WC particles dispersed in a homogenized binder comprising Co, W, C, and one or more of Al, Be, Ga, Ge, Si, and Sn. A method of forming a cutting element, a cutting element, a related structure, and an earth-boring tool are also described.Type: ApplicationFiled: May 10, 2022Publication date: September 1, 2022Inventors: Wanjun Cao, Marc W. Bird
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Patent number: 11396688Abstract: A method of forming a supporting substrate for a cutting element comprises forming a precursor composition comprising discrete WC particles, a binding agent, and discrete particles comprising Co, one or more of Al, Be, Ga, Ge, Si, and Sn, and one or more of C and W. The precursor composition is subjected to a consolidation process to form a consolidated structure including WC particles dispersed in a homogenized binder comprising Co, W, C, and one or more of Al, Be, Ga, Ge, Si, and Sn. A method of forming a cutting element, a cutting element, a related structure, and an earth-boring tool are also described.Type: GrantFiled: December 14, 2017Date of Patent: July 26, 2022Assignee: Baker Hughes Holdings LLCInventors: Wanjun Cao, Marc W. Bird
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Patent number: 11242714Abstract: A method of forming a polycrystalline diamond compact includes forming a polycrystalline diamond material at a temperature and a pressure sufficient to form diamond-to-diamond bonds in the presence of a catalyst; substantially removing the catalyst from a volume of the polycrystalline diamond material from a first surface to a first leach depth; and substantially removing the catalyst from a volume of the polycrystalline diamond material from a second surface to a second, different leach depth. A polycrystalline diamond compact includes a polycrystalline diamond material having a first volume, a second volume, and a boundary between the first volume and the second volume. The first volume includes a catalyst disposed in interstitial spaces between diamond grains. The second volume is substantially free of the catalyst. The boundary's location is selected to control thermal stability and/or impact resistance.Type: GrantFiled: April 15, 2020Date of Patent: February 8, 2022Assignee: Baker Hughes Holdings LLCInventors: Danny E. Scott, Wanjun Cao
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Patent number: 11211205Abstract: The present invention is directed to a method for pre-lithiation of negative electrodes during lithium loaded electrode manufacturing for use in lithium-ion capacitors. There is provided a system and method of manufacture of LIC electrodes using thin lithium film having holes therein, and in particular, to the process of manufacturing lithium loaded negative electrodes for lithium-ion capacitors by pre-lithiating electrodes with thin lithium metal films, wherein the thin lithium metal films include holes therein, and the lithium loaded negative electrodes are manufactured using a roll-to-roll lamination manufacturing, process.Type: GrantFiled: August 10, 2020Date of Patent: December 28, 2021Assignee: THE FLORIDA STATE UNIVERSITY RESEARCH FOUNDATION, INC.Inventors: Wanjun Cao, Jian-ping Zheng
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Patent number: 11180989Abstract: An instrumented cutting element, an earth-boring drilling tool, and related methods are disclosed. The instrumented cutting element may include a substrate base, a diamond table disposed on the substrate base, a sensor disposed within the diamond table, a lead wire coupled to the sensor and disposed within a side trench formed within the substrate base, and a filler material disposed within the side trench. The earth-boring drilling tool may include securing the instrumented cutting element to a blade of a bit body. A related method may include forming the instrumented cutting element and earth-boring drilling tool.Type: GrantFiled: July 3, 2018Date of Patent: November 23, 2021Assignee: Baker Hughes Holdings LLCInventors: Wanjun Cao, Steven W. Webb, Juan Miguel Bilen
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Patent number: 11111731Abstract: Methods of forming earth-boring tools including one or more instrumented cutting elements may involve placing a cutting element partially within a pocket extending into a body of an earth-boring tool. The cutting element may include a first hole extending partially through a cutting element from a back side of the cutting element toward a cutting face and a second, shorter, wider hole extending partially through the cutting element from the back side toward the cutting face. The second hole may be in fluid communication with the first hole. An extension including a passageway extending through the extension may be located at least partially within the second hole, such that the passageway may be in fluid communication with the first hole. A thermocouple may be inserted through the passageway and into the first hole after affixing the cutting element in the pocket.Type: GrantFiled: December 6, 2019Date of Patent: September 7, 2021Assignee: Baker Hughes Oilfield Operations LLCInventors: Wanjun Cao, Juan Miguel Bilen, Steven W. Webb
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Publication number: 20210172259Abstract: Methods of forming earth-boring tools including one or more instrumented cutting elements may involve placing a cutting element partially within a pocket extending into a body of an earth-boring tool. The cutting element may include a first hole extending partially through a cutting element from a back side of the cutting element toward a cutting face and a second, shorter, wider hole extending partially through the cutting element from the back side toward the cutting face. The second hole may be in fluid communication with the first hole. An extension including a passageway extending through the extension may be located at least partially within the second hole, such that the passageway may be in fluid communication with the first hole. A thermocouple may be inserted through the passageway and into the first hole after affixing the cutting element in the pocket.Type: ApplicationFiled: December 6, 2019Publication date: June 10, 2021Inventors: Wanjun Cao, Juan Miguel Bilen, Steven W. Webb
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Publication number: 20210118624Abstract: The present invention is directed to a method for pre-lithiation of negative electrodes during lithium loaded electrode manufacturing for use in lithium-ion capacitors. There is provided a system and method of manufacture of LIC electrodes using thin lithium film having holes therein, and in particular, to the process of manufacturing lithium loaded negative electrodes for lithium-ion capacitors by pre-lithiating electrodes with thin lithium metal films, wherein the thin lithium metal films include holes therein, and the lithium loaded negative electrodes are manufactured using a roll-to-roll lamination manufacturing, process.Type: ApplicationFiled: August 10, 2020Publication date: April 22, 2021Inventors: Wanjun Cao, Jian-ping Zheng
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Publication number: 20210047887Abstract: Cutting elements for earth-boring tools may include a cutting table secured to a substrate. The cutting table may include a first region at least substantially free of an infiltrant, a second region comprising the infiltrant, and a passageway extending from an exterior partially through the first region. A distance between the exterior and a boundary between the first region and the second region, as measured from a major surface of the cutting table, may not be constant. Methods of making cutting elements for earth-boring tools may involve placing a sacrificial material among grains of a superabrasive material. The grains of the superabrasive material and the sacrificial material may be exposed to elevated temperature and pressure in a presence of a catalyst material to form a cutting table. The sacrificial material and a portion of the catalyst material may be removed from a first region of the cutting table.Type: ApplicationFiled: August 15, 2019Publication date: February 18, 2021Inventors: Wanjun Cao, Steven W. Webb, Xu Huang
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Patent number: 10755867Abstract: The present invention is directed to a method for pre-lithiation of negative electrodes during lithium loaded electrode manufacturing for use in lithium-ion capacitors. There is provided a system and method of manufacture of LIC electrodes using thin lithium film having holes therein, and in particular, to the process of manufacturing lithium loaded negative electrodes for lithium-ion capacitors by pre-lithiating electrodes with thin lithium metal films, wherein the thin lithium metal films include holes therein, and the lithium loaded negative electrodes are manufactured using a roll-to-roll lamination manufacturing process.Type: GrantFiled: April 18, 2017Date of Patent: August 25, 2020Assignees: FLORIDA STATE UNIVERSITY RESEARCH FOUNDATION, INC, GENERAL CAPACITOR, LLCInventors: Wanjun Cao, Jim P. Zheng
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Publication number: 20200240216Abstract: A method of forming a polycrystalline diamond compact includes forming a polycrystalline diamond material at a temperature and a pressure sufficient to form diamond-to-diamond bonds in the presence of a catalyst; substantially removing the catalyst from a volume of the polycrystalline diamond material from a first surface to a first leach depth; and substantially removing the catalyst from a volume of the polycrystalline diamond material from a second surface to a second, different leach depth. A polycrystalline diamond compact includes a polycrystalline diamond material having a first volume, a second volume, and a boundary between the first volume and the second volume. The first volume includes a catalyst disposed in interstitial spaces between diamond grains. The second volume is substantially free of the catalyst. The boundary's location is selected to control thermal stability and/or impact resistance.Type: ApplicationFiled: April 15, 2020Publication date: July 30, 2020Inventors: Danny E. Scott, Wanjun Cao
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Publication number: 20200181984Abstract: A cutting element comprises a supporting substrate, a cutting table comprising a hard material attached to the supporting substrate, and a fluid flow pathway extending through the supporting substrate and the cutting table. The fluid flow pathway is configured to direct fluid delivered to an outermost boundary of the supporting substrate through internal regions of the supporting substrate and the cutting table. A method of forming a cutting element and an earth-boring tool are also described.Type: ApplicationFiled: February 13, 2020Publication date: June 11, 2020Inventors: Wanjun Cao, Xu Huang, Steven W. Webb, Bo Yu
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Patent number: 10633928Abstract: A method of forming a polycrystalline diamond compact includes forming a polycrystalline diamond material at a temperature and a pressure sufficient to form diamond-to-diamond bonds in the presence of a catalyst; substantially removing the catalyst from a volume of the polycrystalline diamond material from a first surface to a first leach depth; and substantially removing the catalyst from a volume of the polycrystalline diamond material from a second surface to a second, different leach depth. A polycrystalline diamond compact includes a polycrystalline diamond material having a first volume, a second volume, and a boundary between the first volume and the second volume. The first volume includes a catalyst disposed in interstitial spaces between diamond grains. The second volume is substantially free of the catalyst. The boundary's location is selected to control thermal stability and/or impact resistance.Type: GrantFiled: July 31, 2015Date of Patent: April 28, 2020Assignee: Baker Hughes, a GE company, LLCInventors: Danny E. Scott, Wanjun Cao