Abstract: A coupled via structure includes a plate via penetrating through an board body and having first and second plates spaced apart from each other by a first gap distance, a contact pad connected to the plate via on a surface of the board body and having first and second contacts connected to the first and second plates, respectively, and a connection line connected to the contact pad on the surface of the board body and having first and second lines connected to the first and second contacts, respectively, and spaced apart from the first line by a second gap distance. Accordingly, the deviation of the characteristic impedance is reduced (or, alternatively, minimized) between the coupled via structure and the coupled signal line.

Abstract: A coupled via structure includes a plate via penetrating through an board body and having first and second plates spaced apart from each other by a first gap distance, a contact pad connected to the plate via on a surface of the board body and having first and second contacts connected to the first and second plates, respectively, and a connection line connected to the contact pad on the surface of the board body and having first and second lines connected to the first and second contacts, respectively, and spaced apart from the first line by a second gap distance. Accordingly, the deviation of the characteristic impedance is reduced (or, alternatively, minimized) between the coupled via structure and the coupled signal line.

Abstract: A coupled via structure includes a plate via penetrating through an board body and having first and second plates spaced apart from each other by a first gap distance, a contact pad connected to the plate via on a surface of the board body and having first and second contacts connected to the first and second plates, respectively, and a connection line connected to the contact pad on the surface of the board body and having first and second lines connected to the first and second contacts, respectively, and spaced apart from the first line by a second gap distance. Accordingly, the deviation of the characteristic impedance is reduced (or, alternatively, minimized) between the coupled via structure and the coupled signal line.

Abstract: A coupled via structure includes a plate via penetrating through an board body and having first and second plates spaced apart from each other by a first gap distance, a contact pad connected to the plate via on a surface of the board body and having first and second contacts connected to the first and second plates, respectively, and a connection line connected to the contact pad on the surface of the board body and having first and second lines connected to the first and second contacts, respectively, and spaced apart from the first line by a second gap distance. Accordingly, the deviation of the characteristic impedance is reduced (or, alternatively, minimized) between the coupled via structure and the coupled signal line.

Abstract: Disclosed is a probe system. The probe system includes a support member configured to grasp a circuit board to be tested vertically to a base plate, a probe-tip member having a probes that are in contact with a conductive pattern of the circuit board, a guide-arm member coupled with the probe-tip member and configured to move the probe-tip member to a desired position, and a network analyzer electrically connected with the probe of the probe-tip member and configured to analyze electromagnetic characteristics of the conductive pattern. Further disclosed is a calibration kit which that is applicable when calibrating a multi-port of the network analyzer using the probe system that is disclosed.

Abstract: Disclosed is a probe system. The probe system includes a support member configured to grasp a circuit board to be tested vertically to a base plate, a probe-tip member having a probes that are in contact with a conductive pattern of the circuit board, a guide-arm member coupled with the probe-tip member and configured to move the probe-tip member to a desired position, and a network analyzer electrically connected with the probe of the probe-tip member and configured to analyze electromagnetic characteristics of the conductive pattern.