Patents by Inventor Wansuk Yun

Wansuk Yun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12266846
    Abstract: A radio frequency package includes a first portion of an antenna array module, a second portion of the antenna array module, and a flexible cable. The first portion of the antenna array module provides a first wireless communication functionality and the second portion of the antenna array module provides a second wireless communication functionality. The flexible cable includes first surface directly coupled to the first portion of the antenna array module. The flexible cable also includes a second surface directly coupled to the second portion of the antenna array module. The flexible cable communicates signals between the first portion of the distributed antenna array module and the second portion of the antenna array module.
    Type: Grant
    Filed: September 2, 2021
    Date of Patent: April 1, 2025
    Assignee: Apple Inc.
    Inventors: Sidharth S. Dalmia, Wansuk Yun, Flynn P. Carson
  • Publication number: 20230066814
    Abstract: A radio frequency package includes a first portion of an antenna array module, a second portion of the antenna array module, and a flexible cable. The first portion of the antenna array module provides a first wireless communication functionality and the second portion of the antenna array module provides a second wireless communication functionality. The flexible cable includes first surface directly coupled to the first portion of the antenna array module. The flexible cable also includes a second surface directly coupled to the second portion of the antenna array module. The flexible cable communicates signals between the first portion of the distributed antenna array module and the second portion of the antenna array module.
    Type: Application
    Filed: September 2, 2021
    Publication date: March 2, 2023
    Inventors: Sidharth S. Dalmia, Wansuk Yun, Flynn P. Carson