Patents by Inventor Wanting WEI

Wanting WEI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250354020
    Abstract: The present disclosure relates to a conductive paste based on seed silver powder and a preparation method therefor, belonging to the technical field of photovoltaic cells. The conductive paste includes 10-85 wt % seed silver powder, 2-5 wt % glass frit, and 8-12 wt % organic vehicle, with the balance being spherical silver powder. The seed silver powder uses base metal powder as a matrix. Silver is grown on the surface of the matrix via liquid-phase reduction using a supported agent. After calcination, multiple silver pores are formed in the surface of the base metal powder. After photoinduced silver electroplating, “silver anchors” are formed interspersed in the sintered layer. This increases the contact area between the sintered layer and the electroplated layer, reduces the resistivity of the grid electrode, enhances the interlayer bonding strength, mitigates resistance increase, effectively improves the photoelectric conversion efficiency, and reduces the cost of the conductive paste.
    Type: Application
    Filed: July 30, 2025
    Publication date: November 20, 2025
    Inventors: Jing ZHENG, Li YAN, Wanting WEI, Weikang HUA