Patents by Inventor Wan-Yi Wu

Wan-Yi Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Punching apparatus for backing-films of CMP machines and preventive maintenance method for the same
    Patent number: 6886442
    Abstract: An apparatus for punching CMP machine backing film. The apparatus comprises a base, a first plate, and a second plate. The base holds the backing-film. The first plate is disposed on the base in a manner such that it moves between a first position and a second position. The first plate abuts the backing-film when it is located at the second position. The second plate, having a plurality of punches, is disposed on the base in a manner such that it moves between a third position and a fourth position. The first plate is located at the first position when the second plate is located at the third position. The first plate is located at the second position when the second plate is located at the fourth position so that the punches pass through the first plate to punch the backing-film.
    Type: Grant
    Filed: May 8, 2002
    Date of Patent: May 3, 2005
    Assignee: Nanya Technology Corporation
    Inventors: Wan-Yi Wu, Ming Fa Tsai
  • Punching apparatus for backing-films of CMP machines and preventive maintenance method for the same
    Publication number: 20040154452
    Abstract: An apparatus for punching CMP machine backing film. The apparatus comprises a base, a first plate, and a second plate. The base holds the backing-film. The first plate is disposed on the base in a manner such that it moves between a first position and a second position. The first plate abuts the backing-film when it is located at the second position. The second plate, having a plurality of punches, is disposed on the base in a manner such that it moves between a third position and a fourth position. The first plate is located at the first position when the second plate is located at the third position. The first plate is located at the second position when the second plate is located at the fourth position so that the punches pass through the first plate to punch the backing-film.
    Type: Application
    Filed: February 9, 2004
    Publication date: August 12, 2004
    Applicant: NANYA TECHNOLOGY CORPORATION
    Inventors: Wan-Yi Wu, Ming Fa Tsai
  • Punching apparatus for backing-films of CMP machines and preventive maintenance method for the same
    Publication number: 20030084997
    Abstract: An apparatus for punching CMP machine backing film. The apparatus comprises a base, a first plate, and a second plate. The base holds the backing-film. The first plate is disposed on the base in a manner such that it moves between a first position and a second position. The first plate abuts the backing-film when it is located at the second position. The second plate, having a plurality of punches, is disposed on the base in a manner such that it moves between a third position and a fourth position. The first plate is located at the first position when the second plate is located at the third position. The first plate is located at the second position when the second plate is located at the fourth position so that the punches pass through the first plate to punch the backing-film.
    Type: Application
    Filed: May 8, 2002
    Publication date: May 8, 2003
    Applicant: NANYA TECHNOLOGY CORPORATION
    Inventors: Wan-Yi Wu, Ming Fa Tsai