Patents by Inventor Wanyu TIE

Wanyu TIE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LIQUID AGENT SUPPLY DEVICE AND LIQUID AGENT SUPPLY METHOD
    Publication number: 20210260680
    Abstract: A liquid agent supply device includes: a holder that holds a board; a supply head including a plurality of nozzles for supplying a liquid agent to a plurality of supply positions on the board held by the holder are arranged; and a supply head mover that relatively moves the board and the supply head, wherein the supply head mover relatively moves the board and the supply head according to a first movement method in which the board and the supply head relatively move along a specific direction determined regardless of supply positions among the plurality of supply positions, in a supply range including the plurality of supply positions.
    Type: Application
    Filed: July 9, 2019
    Publication date: August 26, 2021
    Inventors: Hiroto MIYAZAKI, Kazuki FUKADA, Kazunori ISHIKAWA, Wanyu TIE
  • Manufacturing method of electronic component, electronic component, and manufacturing apparatus of electronic component
    Patent number: 9949380
    Abstract: A manufacturing method of an electronic component including a circuit component provided with plural first electrodes in an end, and a substrate provided with plural second electrodes includes: pressing a part of a second surface of an inside of a second edge of the circuit component in the end to the substrate by a press attaching surface of the press attaching tool with an adhesive arranged between the circuit component and the substrate; making a part of the adhesive reach the second surface to cover at least a part of the second edge by the pressing; and curing the adhesive between the end and the substrate and the part of the adhesive covering the at least the part of the second edge.
    Type: Grant
    Filed: January 12, 2016
    Date of Patent: April 17, 2018
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hideki Eifuku, Wanyu Tie, Hironori Munakata
  • MANUFACTURING METHOD OF ELECTRONIC COMPONENT, ELECTRONIC COMPONENT, AND MANUFACTURING APPARATUS OF ELECTRONIC COMPONENT
    Publication number: 20160255716
    Abstract: A manufacturing method of an electronic component including a circuit component provided with plural first electrodes in an end, and a substrate provided with plural second electrodes includes: pressing a part of a second surface of an inside of a second edge of the circuit component in the end to the substrate by a press attaching surface of the press attaching tool with an adhesive arranged between the circuit component and the substrate; making a part of the adhesive reach the second surface to cover at least a part of the second edge by the pressing; and curing the adhesive between the end and the substrate and the part of the adhesive covering the at least the part of the second edge.
    Type: Application
    Filed: January 12, 2016
    Publication date: September 1, 2016
    Inventors: Hideki EIFUKU, Wanyu TIE, Hironori MUNAKATA