Patents by Inventor Waqas Hassan SYED
Waqas Hassan SYED has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240106105Abstract: In accordance with a first aspect of the present disclosure, an antenna unit is provided, comprising: an integrated circuit package containing an integrated circuit die and an antenna structure coupled to the integrated circuit die; a dielectric layer separated from the integrated circuit package, wherein the dielectric layer is placed at a predefined distance above an upper surface of the integrated circuit package. In accordance with a second aspect of the present disclosure, a corresponding method of producing an antenna unit is conceived.Type: ApplicationFiled: September 19, 2023Publication date: March 28, 2024Inventors: Waqas Hassan Syed, Ralph Matthijs van Schelven, Giorgio Carluccio, Pieter Lok, Antonius Johannes Matheus de Graauw, Konstantinos Doris, Daniele Cavallo, Andrea Neto
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Patent number: 11810875Abstract: A packaged integrated circuit (IC) includes an IC die having first and second external contacts and a package substrate. The IC die is attached to the package substrate which includes a balun in a first metal layer. The balun is connected to the first and second external contacts of the IC die and to a first external contact of the package substrate. The first and second external contacts of the IC die communicate a differential signal with the package substrate, and the first external contact of the package substrate communicates a single-ended signal corresponding to the differential signal. Alternatively, the balun is connected to an external contact of the IC die and to first and second external contacts of the package substrate, in which the external contact of the IC die communicates a single-ended signal and the first and second external contacts of the package substrate communicate a differential signal.Type: GrantFiled: April 9, 2021Date of Patent: November 7, 2023Assignee: NXP B.V.Inventors: Waqas Hassan Syed, Cicero Silveira Vaucher, Antonius Johannes Matheus de Graauw
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Publication number: 20230198114Abstract: A compact planar balun formed on a substrate including a hairpin-shaped conductive microstrip and a single-ended contact. The hairpin-shaped conductive microstrip includes first and second linear segments integrally formed with a U-shaped segment, and a single-ended contact is conductively coupled at a location along the first linear segment. The first and second linear segments each have a first characteristic impedance and are in parallel with each other having a first end forming first and second differential contacts and having a second end. The U-shaped segment has a second characteristic impedance that is less than the first characteristic impedance in order to achieve proper scatter parameter alignment. The U-shaped segment may be generally formed thicker or wider than the linear segments to achieve a reduced characteristic impedance. In the alternative or in addition, co-planer ground metal is formed closer to the U-shaped segment to achieve a reduced characteristic impedance.Type: ApplicationFiled: December 22, 2021Publication date: June 22, 2023Inventors: Lukas Frederik Tiemeijer, Waqas Hassan Syed, Ralf Maria Theodoor Pijper, Harish Nandagopal
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Patent number: 11631625Abstract: A mechanism is provided to remove heat from an integrated circuit (IC) device die by directing heat through a waveguide to a heat sink. The waveguide is mounted on top of a package containing the IC device die. The waveguide is thermally coupled to the IC device die. The waveguide transports the heat to a heat sink coupled to the waveguide and located adjacent to the package on top of a printed circuit board on which the package is mounted. Embodiments provide both thermal dissipation of the generated heat while at the same time maintaining good radio frequency performance of the waveguide.Type: GrantFiled: August 17, 2022Date of Patent: April 18, 2023Assignee: NXP USA, INC.Inventors: Michael B. Vincent, Antonius Johannes Matheus de Graauw, Giorgio Carluccio, Waqas Hassan Syed, Maristella Spella
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Publication number: 20220392821Abstract: A mechanism is provided to remove heat from an integrated circuit (IC) device die by directing heat through a waveguide to a heat sink. The waveguide is mounted on top of a package containing the IC device die. The waveguide is thermally coupled to the IC device die. The waveguide transports the heat to a heat sink coupled to the waveguide and located adjacent to the package on top of a printed circuit board on which the package is mounted. Embodiments provide both thermal dissipation of the generated heat while at the same time maintaining good radio frequency performance of the waveguide.Type: ApplicationFiled: August 17, 2022Publication date: December 8, 2022Applicant: NXP USA, Inc.Inventors: Michael B. Vincent, Antonius Johannes Matheus de Graauw, Giorgio Carluccio, Waqas Hassan Syed, Maristella Spella
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Publication number: 20220328432Abstract: A packaged integrated circuit (IC) includes an IC die having first and second external contacts and a package substrate. The IC die is attached to the package substrate which includes a balun in a first metal layer. The balun is connected to the first and second external contacts of the IC die and to a first external contact of the package substrate. The first and second external contacts of the IC die communicate a differential signal with the package substrate, and the first external contact of the package substrate communicates a single-ended signal corresponding to the differential signal. Alternatively, the balun is connected to an external contact of the IC die and to first and second external contacts of the package substrate, in which the external contact of the IC die communicates a single-ended signal and the first and second external contacts of the package substrate communicate a differential signal.Type: ApplicationFiled: April 9, 2021Publication date: October 13, 2022Inventors: Waqas Hassan Syed, Cicero Silveira Vaucher, Antonius Johannes Matheus de Graauw
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Patent number: 11456227Abstract: A mechanism is provided to remove heat from an integrated circuit (IC) device die by directing heat through a waveguide to a heat sink. The waveguide is mounted on top of a package containing the IC device die. The waveguide is thermally coupled to the IC device die. The waveguide transports the heat to a heat sink coupled to the waveguide and located adjacent to the package on top of a printed circuit board on which the package is mounted. Embodiments provide both thermal dissipation of the generated heat while at the same time maintaining good radio frequency performance of the waveguide.Type: GrantFiled: December 17, 2019Date of Patent: September 27, 2022Assignee: NXP USA, INC.Inventors: Michael B. Vincent, Antonius Johannes Matheus de Graauw, Giorgio Carluccio, Waqas Hassan Syed, Maristella Spella
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Patent number: 11415626Abstract: A method of testing a semiconductor device. An apparatus comprising a semiconductor device and a test apparatus. The semiconductor device includes an integrated circuit and a plurality of external radiating elements at a surface of the device, the radiating elements include transmit elements and receive elements. The test apparatus includes a surface for placing against the surface of the device. The test apparatus also includes at least one waveguide, which extends through the test apparatus for routing electromagnetic radiation transmitted by one of the transmit elements of the device to one of the receive elements of the device. Each waveguide comprises a plurality of waveguide openings for coupling electromagnetically to corresponding radiating elements of the plurality of radiating elements located at the surface of the device. A spacing between the waveguide openings of each waveguide is larger than, or smaller than a spacing between the corresponding radiating elements.Type: GrantFiled: December 11, 2020Date of Patent: August 16, 2022Assignee: NXP B.V.Inventors: Jan-Peter Schat, Abdellatif Zanati, Henrik Asendorf, Maristella Spella, Waqas Hassan Syed, Giorgio Carluccio, Antonius Johannes Matheus de Graauw
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Patent number: 11276654Abstract: A mechanism is provided to remove heat from an integrated circuit (IC) device die by directing heat through a waveguide to a heat sink. Embodiments provide the waveguide mounted on top of a package containing the IC device die. The waveguide is thermally coupled to the IC device die. The waveguide transports the heat to a heat sink coupled to the waveguide and located adjacent to the package on top of a printed circuit board on which the package is mounted. Embodiments provide both thermal dissipation of the generated heat while at the same time maintaining good radio frequency (RF) performance of the waveguide.Type: GrantFiled: December 17, 2019Date of Patent: March 15, 2022Assignee: NXP USA, INC.Inventors: Michael B. Vincent, Antonius Johannes Matheus de Graauw, Giorgio Carluccio, Waqas Hassan Syed, Maristella Spella
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Publication number: 20210239754Abstract: A method of testing a semiconductor device. An apparatus comprising a semiconductor device and a test apparatus. The semiconductor device includes an integrated circuit and a plurality of external radiating elements at a surface of the device, the radiating elements include transmit elements and receive elements. The test apparatus includes a surface for placing against the surface of the device. The test apparatus also includes at least one waveguide, which extends through the test apparatus for routing electromagnetic radiation transmitted by one of the transmit elements of the device to one of the receive elements of the device. Each waveguide comprises a plurality of waveguide openings for coupling electromagnetically to corresponding radiating elements of the plurality of radiating elements located at the surface of the device. A spacing between the waveguide openings of each waveguide is larger than, or smaller than a spacing between the corresponding radiating elements.Type: ApplicationFiled: December 11, 2020Publication date: August 5, 2021Inventors: Jan-Peter Schat, Abdellatif Zanati, Henrik Asendorf, Maristella Spella, Waqas Hassan Syed, Giorgio Carluccio, Antonius Johannes Matheus de Graauw
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Publication number: 20210183797Abstract: A mechanism is provided to remove heat from an integrated circuit (IC) device die by directing heat through a waveguide to a heat sink. Embodiments provide the waveguide mounted on top of a package containing the IC device die. The waveguide is thermally coupled to the IC device die. The waveguide transports the heat to a heat sink coupled to the waveguide and located adjacent to the package on top of a printed circuit board on which the package is mounted. Embodiments provide both thermal dissipation of the generated heat while at the same time maintaining good radio frequency (RF) performance of the waveguide.Type: ApplicationFiled: December 17, 2019Publication date: June 17, 2021Applicant: NXP USA, Inc.Inventors: Michael B. Vincent, Antonius Johannes Matheus de Graauw, Giorgio Carluccio, Waqas Hassan Syed, Maristella Spella
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Publication number: 20210183725Abstract: A mechanism is provided to remove heat from an integrated circuit (IC) device die by directing heat through a waveguide to a heat sink. The waveguide is mounted on top of a package containing the IC device die. The waveguide is thermally coupled to the IC device die. The waveguide transports the heat to a heat sink coupled to the waveguide and located adjacent to the package on top of a printed circuit board on which the package is mounted. Embodiments provide both thermal dissipation of the generated heat while at the same time maintaining good radio frequency performance of the waveguide.Type: ApplicationFiled: December 17, 2019Publication date: June 17, 2021Applicant: NXP USA, Inc.Inventors: Michael B. Vincent, Antonius Johannes Matheus de Graauw, Giorgio Carluccio, Waqas Hassan Syed, Maristella Spella
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Patent number: 10615134Abstract: An integrated circuit package is described comprising an integrated circuit die and an antenna structure coupled to the integrated circuit die and comprising a stacked arrangement of metal and dielectric layers, wherein a first metal layer includes a planar antenna and at least one further metal layer comprises an artificial dielectric layer. The integrated circuit package may improve the directionality of the antenna and reduces the sensitivity of the antenna to the printed circuit board on which the integrated circuit package is mounted.Type: GrantFiled: January 15, 2018Date of Patent: April 7, 2020Assignee: NXP B.V.Inventors: Maristella Spella, Waqas Hassan Syed, Daniele Cavallo, Mingda Huang, Leo Van Gemert
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Publication number: 20180233465Abstract: An integrated circuit package is described comprising an integrated circuit die and an antenna structure coupled to the integrated circuit die and comprising a stacked arrangement of metal and dielectric layers, wherein a first metal layer includes a planar antenna and at least one further metal layer comprises an artificial dielectric layer. The integrated circuit package may improve the directionality of the antenna and reduces the sensitivity of the antenna to the printed circuit board on which the integrated circuit package is mounted.Type: ApplicationFiled: January 15, 2018Publication date: August 16, 2018Inventors: Maristella SPELLA, Waqas Hassan SYED, Daniele CAVALLO, Mingda HUANG, Leo VAN GEMERT