Abstract: A method for defining a route for a connecting medium through a three-dimensional building, involving modeling the three-dimensional building as a two-dimensional array of panels, wherein any two panels in the array of panels are connected panels if a connecting medium can be directly routed from one panel to the other panel, a set of coordinates for each of one or more panels in the array of panels where a connecting medium can enter or exit the panel, and a union of the respective set of coordinates for each of the one or more connected panels in the array of panels where a connecting medium can be routed between the connected panels. The process selects one or more panels in the array through which to route the connecting medium based on the unions of the respective set of coordinates for each of the one or more connected panels in the array of panels.

Abstract: A location for each of a plurality of electrical devices in a plan for a three-dimensional (3D) building is determined by: receiving an architectural model (AM) of the 3D building; receiving an annotated AM with structural design information, and electrical design information, receiving structural framing data for a plurality of two-dimensional (2D) panels that comprise the 3D building based on the annotated AM; determining available locations in one or more of the plurality of 2D panels at which an electrical device can be located according to the annotated AM and the structural framing data; specifying the location for each of the plurality of electrical devices in one or more of the plurality of 2D panels based on the determined available locations in the one or more 2D panels; and adding to the structural framing data the specified location for each of the plurality of electrical devices in one or more of the plurality of 2D panels.

Abstract: A method for defining a route for a wire through a three-dimensional building. The method comprises: modeling the three-dimensional building as: a two-dimensional array of panels, wherein any two panels in the array of panels are connected panels if a wire can be directly routed from one panel to the other panel, a set of coordinates for each of one or more panels in the array of panels where a wire can enter or exit the panel, and a union of the respective set of coordinates for each of the one or more connected panels in the array of panels where a wire can be routed between the connected panels; and selecting one or more panels in the array through which to route the wire based on the unions of the respective set of coordinates for each of the one or more connected panels in the array of panels.

Abstract: Defining a route for a wire between electrical devices in a plan for a three-dimensional (3D) building.

Abstract: Systems and methods for realizing a complex building system are disclosed. The systems and methods utilize computer-based techniques to rapidly explore large numbers of pattern matching scenarios on a scale which heretofore has not been attempted. In an embodiment, the computer-based technique performs large-scale pattern matching operations to find the best match between functional patterns and spatial patterns. For example, with reference to a particular building system, the technique involves operational modeling to identify the types and volumes of services to provide (functional patterns) and to characterize the physical relationships between the services (e.g., adjacency preferences), along with establishing libraries of three dimensional spaces (spatial patterns), in the form of room and department libraries and building massing configuration libraries.

Abstract: A system and method for realizing a building system is disclosed. In an embodiment, a holistic approach to a complex building system involves using high-productivity high-performance computing resources, such as cloud services, to manage a complex building system from building inception through to building operation. Because high-productivity high-performance computing resources are used, modeling, optimization, simulation, and verification can be performed from a single platform on a scale which heretofore has not been applied to complex building systems. Additionally, the holistic approach to complex building systems involves using a centralized database to manage all of the information related to a building system.

Abstract: A system and method for realizing a building system is disclosed. In an embodiment, a holistic approach to a complex building system involves using high-productivity high-performance computing resources, such as cloud services, to manage a complex building system from building inception through to building operation. Because high-productivity high-performance computing resources are used, modeling, optimization, simulation, and verification can be performed from a single platform on a scale which heretofore has not been applied to complex building systems. Additionally, the holistic approach to complex building systems involves using a centralized database to manage all of the information related to a building system.

Abstract: Systems and methods for realizing a complex building system are disclosed. The systems and methods utilize computer-based techniques to rapidly explore large numbers of pattern matching scenarios on a scale which heretofore has not been attempted. In an embodiment, the computer-based technique performs large-scale pattern matching operations to find the best match between functional patterns and spatial patterns. For example, with reference to a particular building system, the technique involves operational modeling to identify the types and volumes of services to provide (functional patterns) and to characterize the physical relationships between the services (e.g., adjacency preferences), along with establishing libraries of three dimensional spaces (spatial patterns), in the form of room and department libraries and building massing configuration libraries.

Abstract: A system and method for realizing a building system is disclosed. In an embodiment, a holistic approach to a complex building system involves using high-productivity high-performance computing resources, such as cloud services, to manage a complex building system from building inception through to building operation. Because high-productivity high-performance computing resources are used, modeling, optimization, simulation, and verification can be performed from a single platform on a scale which heretofore has not been applied to complex building systems. Additionally, the holistic approach to complex building systems involves using a centralized database to manage all of the information related to a building system.

Abstract: An integrated circuit has a plurality of metal layers separated by a plurality of insulating layers. The integrated circuit comprises a pair of conductors on a first metal layer; at least one conductive fill element disposed between the conductors; and a via connecting the fill element to a ground contact on a metal layer adjacent to said first metal layer, where the via is formed of a conductive material.

Abstract: For an integrated circuit having multiple metal layers, a computer-aided design (CAD) method for designing grounded fill in the integrated circuit includes: (a) finding the eligible fill areas for each metal layer; (b) storing the eligible fill area data for each metal layer in an overflow memory; (c) finding ground contact areas for each metal layer; (d) storing the ground contact area data for each metal layer in an overflow memory; (e) temporarily storing the eligible fill area data for a selected metal layer and the ground contact area data for the metal layers adjacent to the selected metal layer in active memory; (f) fitting a fill pattern to an eligible fill area in the selected metal layer, where the fill pattern is composed of at least one element; (g) checking the adjacent metal layers for a ground contact where the element of the fill pattern may be grounded; (h) locating a conductive via between the element of the fill pattern and a ground contact in an adjacent layer; and (i) repeating steps (e)

Abstract: An integrated circuit has a plurality of metal layers separated by a plurality of insulating layers. The integrated circuit comprises a pair of conductors on a first metal layer; at least one conductive fill element disposed between the conductors; and a via connecting the fill element to a ground contact on a metal layer adjacent to said first metal layer, where the via is formed of a conductive material.