Abstract: An impedance controlled elastomeric connector (10) includes signal contacts (30) and ground contacts (40) with leads (32, 42) and a ground plane (25) formed of conductive foil (24) laminated to a dielectric and insulating film (18) folded around an elastomeric core (12) with the signal, ground spacing and the dielectric constant and thickness of the film selected to provide controlled impedance signal paths through the connector as compressed between components (2, 6).

Abstract: A docking assembly including a guide housing (2) and camming assembly (38, 54 and 40) for mechanically interfacing a modular component (46) with a circuit board to thereby complete and protect multiple electrical connections therebetween. An interfacing connector (80) is also disclosed for providing an electrical and mechanical interface between a circuit board and a disk drive (82). The interfacing connector (80) allows high-density multiple electrical interconnections to the circuit board by the use of canted coil springs (100) for direct electrical contact with individual traces and/or contact pads on the circuit board. The interfacing connector (80) may also include a docking assembly (130) with guide channels (136) for guiding insertion of a circuit board to thereby insure the integrity of the electrical interconnections therebetween.

Abstract: Component package (10) includes component (24) having conductive pads (26) attached to the lid (20) of a housing (30) containing wires (14) of a cable (12) positioned therewithin to be engaged by an elastomeric connector (42) having a resilient core (44) with a thin, dielectric film (46) carrying conductive traces (48) extending over a tab (50) with the housing and lid driving the pads against the connector to interconnect the pads to the traces to the wires upon closure. In one embodiment, the wires (14) are solder coated (16) with a solder reflow effecting a tab to wire connection and in another embodiment, precious metal coatings are employed to allow pressure connection between wire and traces. Alternatively, coatings of conductive inks or conductive adhesives may be used. The conductive traces may be placed on centers appropriate to the particular centers in the array of conductive pads and in the array of wires, such centers being selectively varied.