Abstract: A printed circuit board testing means is disclosed comprising a rectangularly-shaped base structure having a forwardly inclined top front face that is oriented continuously to an interchangeable hinged top mounted platen structure resting thereon which incorporates a pair of fixedly mounted guide rails. A ledge-like structure located at the front edge of the top mounted platen is adjacent to a locating contact pin module incorporated in said platen structure and has guide pins.A test head interface assembly is slid into co-planar contact and alignment with the platen structure utilizing the guide rail means and ledge guide pins, thereby aligning the locating contact pin modules with the associated test head interface assembly electrical contacts and vacuum source. Movement of a lever operated control interface lowering means incorporated in the base structure housing will then lower the test head interface assembly into electrical contact and vacuum contact with the locating contact pin modules.