Abstract: Techniques are provided herein to form semiconductor devices that have their semiconductor subfins removed and replaced with one or more dielectric materials. A semiconductor device includes a gate structure around or otherwise on a semiconductor region. A lower end of the semiconductor material includes a subfin adjacent to a dielectric layer that acts as shallow trench isolation (STI) between semiconductor devices. A backside process may be performed to remove the bulk substrate and expose a bottom surface of the subfin. The subfin may then be removed from the backside to form backside recesses. A dielectric liner may be formed within the backside recesses and a dielectric fill may be formed within a remaining volume of the backside recesses. Replacing the subfins with dielectric materials may lower parasitic capacitance between the subfins and the gate electrodes as well as reduce parasitic current between adjacent source or drain regions.

Abstract: Techniques are provided herein to form semiconductor devices that have their semiconductor subfins removed and replaced with one or more dielectric materials. A semiconductor device includes a gate structure around or otherwise on a semiconductor region. A lower end of the semiconductor material includes a subfin adjacent to a dielectric layer that acts as shallow trench isolation (STI) between semiconductor devices. A backside process may be performed to remove the bulk substrate and expose a bottom surface of the subfin. The subfin may then be removed from the backside to form backside recesses. A dielectric liner may be formed within the backside recesses and a dielectric fill may be formed within a remaining volume of the backside recesses. Replacing the subfins with dielectric materials may lower parasitic capacitance between the subfins and the gate electrodes as well as reduce parasitic current between adjacent source or drain regions.

Abstract: A method and system integrates the monitoring of system components and detecting errors or potential problems (or both) in components of bulk fuel distribution facilities. Generally, the method and system includes a diagnostic support module for identifying what stand alone software modules, what fuel hardware, and what software interfaces/drivers associated with the fuel hardware are present in a bulk fuel distribution facility. After the diagnostic support module identifies the unique system components of a particular bulk fuel facility that can include software and fuel hardware, the diagnostic support module can perform system checks of the system components to determine if any system components are missing or if errors or potential problems (or any combination thereof) may exist in a particular bulk fuel distribution facility. The system checks performed by the diagnostic support module can include comparing information collected from the system components against a predetermined set of validation rules.

Abstract: A method and system integrates the monitoring of system components and detecting errors or potential problems (or both) in components of bulk fuel distribution facilities. Generally, the method and system includes a diagnostic support module for identifying what stand alone software modules, what fuel hardware, and what software interfaces/drivers associated with the fuel hardware are present in a bulk fuel distribution facility. After the diagnostic support module identifies the unique system components of a particular bulk fuel facility that can comprise software and fuel hardware, the diagnostic support module can perform system checks of the system components to determine if any system components are missing or if errors or potential problems (or any combination thereof) may exist in a particular bulk fuel distribution facility.