Patents by Inventor Warren K. Harwood
Warren K. Harwood has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11225091Abstract: Examples described herein include examples print media handling system including a first media guide assembly comprising a sensor assembly, and a second media guide assembly comprising a retractable pressure plate and disposed opposite the first media guide assembly to guide a print media along a path between the first media guide assembly and second media guide assembly, the pressure plate moveable about an axis perpendicular to the path between an actuated position and a retracted position.Type: GrantFiled: December 22, 2015Date of Patent: January 18, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Peter J Boucher, Jason Y. Carothers, Warren K Harwood, Luke P Sosnowski
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Patent number: 7595632Abstract: A wafer probe station is equipped with an integrated environment control enclosure substantially surrounding a supporting surface for holding a test device, such enclosure limiting fluid communication between the interior and exterior of the enclosure and preferably also providing EMI shielding and a dark environment. The limited communication between the interior and exterior of the enclosure is kept substantially constant despite positioning movement of either the supporting surface or probes. The positioning mechanisms for the supporting surface and probes each are located at least partially outside of the enclosure.Type: GrantFiled: January 2, 2008Date of Patent: September 29, 2009Assignee: Cascade Microtech, Inc.Inventors: Warren K. Harwood, Paul A. Tervo, Martin J. Koxxy
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Patent number: 7589518Abstract: A probe station includes a fully guarded chuck assembly and connector mechanism for increasing sensitivity to low-level currents while reducing settling times. The chuck assembly includes a wafer-supporting first chuck element surrounded by a second chuck element having a lower component, skirting component and upper component each with a surface portion extending opposite the first element for guarding thereof. The connector mechanism is so connected to the second chuck element as to enable, during low-level current measurements, the potential on each component to follow that on the first chuck element as measured relative to an outer shielding enclosure surrounding each element. Leakage current from the first chuck element is thus reduced to virtually zero, hence enabling increased current sensitivity, and the reduced capacitance thus provided by the second chuck element decreases charging periods, hence reducing settling times.Type: GrantFiled: February 11, 2005Date of Patent: September 15, 2009Assignee: Cascade Microtech, Inc.Inventors: Randy J. Schwindt, Warren K. Harwood, Paul A. Tervo, Kenneth R. Smith, Richard H. Warner
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Patent number: 7492147Abstract: A probe station includes a fully guarded chuck assembly and connector mechanism for increasing sensitivity to low-level currents while reducing settling times. The chuck assembly includes a wafer-supporting first chuck element surrounded by a second chuck element having a lower component, skirting component and upper component each with a surface portion extending opposite the first element for guarding thereof. The connector mechanism is so connected to the second chuck element as to enable, during low-level current measurements, the potential on each component to follow that on the first chuck element as measured relative to an outer shielding enclosure surrounding each element. Leakage current from the first chuck element is thus reduced to virtually zero, hence enabling increased current sensitivity, and the reduced capacitance thus provided by the second chuck element decreases charging periods, hence reducing settling times.Type: GrantFiled: July 27, 2007Date of Patent: February 17, 2009Assignee: Cascade Microtech, Inc.Inventors: Randy J. Schwindt, Warren K. Harwood, Paul A. Tervo, Kenneth R. Smith, Richard H. Warner
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Patent number: 7348787Abstract: A wafer probe station is equipped with an integrated environment control enclosure substantially surrounding a supporting surface for holding a test device, such enclosure limiting fluid communication between the interior and exterior of the enclosure and preferably also providing EMI shielding and a dark environment. The limited communication between the interior and exterior of the enclosure is kept substantially constant despite positioning movement of either the supporting surface or probes. The positioning mechanisms for the supporting surface and probes each are located at least partially outside of the enclosure.Type: GrantFiled: December 22, 2005Date of Patent: March 25, 2008Assignee: Cascade Microtech, Inc.Inventors: Warren K. Harwood, Paul A. Tervo, Martin J. Koxxy
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Patent number: 7330023Abstract: A probe station includes a fully guarded chuck assembly and connector mechanism for increasing sensitivity to low-level currents while reducing settling times. The chuck assembly includes a wafer-supporting first chuck element surrounded by a second chuck element having a lower component, skirting component and upper component each with a surface portion extending opposite the first element for guarding thereof. The connector mechanism is so connected to the second chuck element as to enable, during low-level current measurements, the potential on each component to follow that on the first chuck element as measured relative to an outer shielding enclosure surrounding each element. Leakage current from the first chuck element is thus reduced to virtually zero, hence enabling increased current sensitivity, and the reduced capacitance thus provided by the second chuck element decreases charging periods, hence reducing settling times.Type: GrantFiled: April 21, 2005Date of Patent: February 12, 2008Assignee: Cascade Microtech, Inc.Inventors: Randy J. Schwindt, Warren K. Harwood, Paul A. Tervo, Kenneth R. Smith, Richard H. Warner
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Patent number: 7009383Abstract: A wafer probe station is equipped with an integrated environment control enclosure substantially surrounding a supporting surface for holding a test device, such enclosure limiting fluid communication between the interior and exterior of the enclosure and preferably also providing EMI shielding and a dark environment. The limited communication between the interior and exterior of the enclosure is kept substantially constant despite positioning movement of either the supporting surface or probes. The positioning mechanisms for the supporting surface and probes each are located at least partially outside of the enclosure.Type: GrantFiled: August 25, 2004Date of Patent: March 7, 2006Assignee: Cascade Microtech, Inc.Inventors: Warren K. Harwood, Paul A. Tervo, Martin J. Koxxy
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Patent number: 6980012Abstract: A probe station includes a fully guarded chuck assembly and connector mechanism for increasing sensitivity to low-level currents while reducing settling times. The chuck assembly includes a wafer-supporting first chuck element surrounded by a second chuck element having a lower component, skirting component and upper component each with a surface portion extending opposite the first element for guarding thereof. The connector mechanism is so connected to the second chuck element as to enable, during low-level current measurements, the potential on each component to follow that on the first chuck element as measured relative to an outer shielding enclosure surrounding each element. Leakage current from the first chuck element is thus reduced to virtually zero, hence enabling increased current sensitivity, and the reduced capacitance thus provided by the second chuck element decreases charging periods, hence reducing settling times.Type: GrantFiled: October 2, 2003Date of Patent: December 27, 2005Assignee: Cascase Microtech, Inc.Inventors: Randy J. Schwindt, Warren K. Harwood, Paul A. Tervo, Kenneth R. Smith, Richard H. Warner
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Patent number: 6801047Abstract: A wafer probe station is equipped with an integrated environment control enclosure substantially surrounding a supporting surface for holding a test device, such enclosure limiting fluid communication between the interior and exterior of the enclosure and preferably also providing EMI shielding and a dark environment. The limited communication between the interior and exterior of the enclosure is kept substantially constant despite positioning movement of either the supporting surface or probes. The positioning mechanisms for the supporting surface and probes each are located at least partially outside of the enclosure.Type: GrantFiled: May 19, 2003Date of Patent: October 5, 2004Assignee: Cascade Microtech, Inc.Inventors: Warren K. Harwood, Paul A. Tervo, Martin J. Koxxy
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Patent number: 6720782Abstract: A probe station includes a fully guarded chuck assembly and connector mechanism for increasing sensitivity to low-level currents while reducing settling times. The chuck assembly includes a wafer-supporting first chuck element surrounded by a second chuck element having a lower component, skirting component and upper component each with a surface portion extending opposite the first element for guarding thereof. The connector mechanism is so connected to the second chuck element as to enable, during low-level current measurements, the potential on each component to follow that on the first chuck element as measured relative to an outer shielding enclosure surrounding each element. Leakage current from the first chuck element is thus reduced to virtually zero, hence enabling increased current sensitivity, and the reduced capacitance thus provided by the second chuck element decreases charging periods, hence reducing settling times.Type: GrantFiled: October 17, 2002Date of Patent: April 13, 2004Assignee: Cascade Microtech, Inc.Inventors: Randy J. Schwindt, Warren K. Harwood, Paul A. Tervo, Kenneth R. Smith, Richard H. Warner
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Publication number: 20040061514Abstract: A probe station includes a fully guarded chuck assembly and connector mechanism for increasing sensitivity to low-level currents while reducing settling times. The chuck assembly includes a wafer-supporting first chuck element surrounded by a second chuck element having a lower component, skirting component and upper component each with a surface portion extending opposite the first element for guarding thereof. The connector mechanism is so connected to the second chuck element as to enable, during low-level current measurements, the potential on each component to follow that on the first chuck element as measured relative to an outer shielding enclosure surrounding each element. Leakage current from the first chuck element is thus reduced to virtually zero, hence enabling increased current sensitivity, and the reduced capacitance thus provided by the second chuck element decreases charging periods, hence reducing settling times.Type: ApplicationFiled: October 2, 2003Publication date: April 1, 2004Inventors: Randy J. Schwindt, Warren K. Harwood, Paul A. Tervo, Kenneth R. Smith, Richard H. Warner
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Publication number: 20030205997Abstract: A wafer probe station is equipped with an integrated environment control enclosure substantially surrounding a supporting surface for holding a test device, such enclosure limiting fluid communication between the interior and exterior of the enclosure and preferably also providing EMI shielding and a dark environment. The limited communication between the interior and exterior of the enclosure is kept substantially constant despite positioning movement of either the supporting surface or probes. The positioning mechanisms for the supporting surface and probes each are located at least partially outside of the enclosure.Type: ApplicationFiled: May 19, 2003Publication date: November 6, 2003Applicant: Cascade Microtech, Inc., an Oregon corporationInventors: Warren K. Harwood, Paul A. Tervo, Martin J. Koxxy
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Patent number: 6636059Abstract: A wafer probe station is equipped with an integrated environment control enclosure substantially surrounding a supporting surface for holding a test device, such enclosure limiting fluid communication between the interior and exterior of the enclosure and preferably also providing EMI shielding and a dark environment. The limited communication between the interior and exterior of the enclosure is kept substantially constant despite positioning movement of either the supporting surface or probes. The positioning mechanisms for the supporting surface and probes each are located at least partially outside of the enclosure.Type: GrantFiled: October 9, 2002Date of Patent: October 21, 2003Assignee: Cascade Microtech, Inc.Inventors: Warren K. Harwood, Paul A. Tervo, Martin J. Koxxy
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Publication number: 20030057979Abstract: A probe station includes a fully guarded chuck assembly and connector mechanism for increasing sensitivity to low-level currents while reducing settling times. The chuck assembly includes a wafer-supporting first chuck element surrounded by a second chuck element having a lower component, skirting component and upper component each with a surface portion extending opposite the first element for guarding thereof. The connector mechanism is so connected to the second chuck element as to enable, during low-level current measurements, the potential on each component to follow that on the first chuck element as measured relative to an outer shielding enclosure surrounding each element. Leakage current from the first chuck element is thus reduced to virtually zero, hence enabling increased current sensitivity, and the reduced capacitance thus provided by the second chuck element decreases charging periods, hence reducing settling times.Type: ApplicationFiled: October 17, 2002Publication date: March 27, 2003Inventors: Randy J. Schwindt, Warren K. Harwood, Paul A. Tervo, Kenneth R. Smith, Richard H. Warner
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Publication number: 20030048110Abstract: A wafer probe station is equipped with an integrated environment control enclosure substantially surrounding a supporting surface for holding a test device, such enclosure limiting fluid communication between the interior and exterior of the enclosure and preferably also providing EMI shielding and a dark environment. The limited communication between the interior and exterior of the enclosure is kept substantially constant despite positioning movement of either the supporting surface or probes. The positioning mechanisms for the supporting surface and probes each are located at least partially outside of the enclosure.Type: ApplicationFiled: October 9, 2002Publication date: March 13, 2003Inventors: Warren K. Harwood, Paul A. Tervo, Martin J. Koxxy
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Patent number: 6492822Abstract: A probe station includes a fully guarded chuck assembly and connector mechanism for increasing sensitivity to low-level currents while reducing settling times. The chuck assembly includes a wafer-supporting first chuck element surrounded by a second chuck element having a lower component, skirting component and upper component each with a surface portion extending opposite the first element for guarding thereof. The connector mechanism is so connected to the second chuck element as to enable, during low-level current measurements, the potential on each component to follow that on the first chuck element as measured relative to an outer shielding enclosure surrounding each element. Leakage current from the first chuck element is thus reduced to virtually zero, hence enabling increased current sensitivity, and the reduced capacitance thus provided by the second chuck element decreases charging periods, hence reducing settling times.Type: GrantFiled: October 30, 2001Date of Patent: December 10, 2002Assignee: Cascade Microtech, Inc.Inventors: Randy J. Schwindt, Warren K. Harwood, Paul A. Tervo, Kenneth R. Smith, Richard H. Warner
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Patent number: 6486687Abstract: A wafer probe station is equipped with an integrated environment control enclosure substantially surrounding a supporting surface for holding a test device, such enclosure limiting fluid communication between the interior and exterior of the enclosure and preferably also providing EMI shielding and a dark environment. The limited communication between the interior and exterior of the enclosure is kept substantially constant despite positioning movement of either the supporting surface or probes. The positioning mechanisms for the supporting surface and probes each are located at least partially outside of the enclosure.Type: GrantFiled: February 6, 2002Date of Patent: November 26, 2002Assignee: Cascade Microtech, Inc.Inventors: Warren K. Harwood, Paul A. Tervo, Martin J. Koxxy
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Publication number: 20020093353Abstract: A wafer probe station is equipped with an integrated environment control enclosure substantially surrounding a supporting surface for holding a test device, such enclosure limiting fluid communication between the interior and exterior of the enclosure and preferably also providing EMI shielding and a dark environment. The limited communication between the interior and exterior of the enclosure is kept substantially constant despite positioning movement of either the supporting surface or probes. The positioning mechanisms for the supporting surface and probes each are located at least partially outside of the enclosure.Type: ApplicationFiled: February 6, 2002Publication date: July 18, 2002Inventors: Warren K. Harwood, Paul A. Tervo, Martin J. Koxxy
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Patent number: 6380751Abstract: A wafer probe station is equipped with an integrated environment control enclosure substantially surrounding a supporting surface for holding a test device, such enclosure limiting fluid communication between the interior and exterior of the enclosure and preferably also providing EMI shielding and a dark environment. The limited communication between the interior and exterior of the enclosure is kept substantially constant despite positioning movement of either the supporting surface or probes. The positioning mechanisms for the supporting surface and probes each are located at least partially outside of the enclosure.Type: GrantFiled: June 20, 2001Date of Patent: April 30, 2002Assignee: Cascade Microtech, Inc.Inventors: Warren K. Harwood, Paul A. Tervo, Martin J. Koxxy
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Publication number: 20020043981Abstract: A probe station includes a fully guarded chuck assembly and connector mechanism for increasing sensitivity to low-level currents while reducing settling times. The chuck assembly includes a wafer-supporting first chuck element surrounded by a second chuck element having a lower component, skirting component and upper component each with a surface portion extending opposite the first element for guarding thereof. The connector mechanism is so connected to the second chuck element as to enable, during low-level current measurements, the potential on each component to follow that on the first chuck element as measured relative to an outer shielding enclosure surrounding each element. Leakage current from the first chuck element is thus reduced to virtually zero, hence enabling increased current sensitivity, and the reduced capacitance thus provided by the second chuck element decreases charging periods, hence reducing settling times.Type: ApplicationFiled: October 30, 2001Publication date: April 18, 2002Inventors: Randy J. Schwindt, Warren K. Harwood, Paul A. Tervo, Kenneth R. Smith, Richard H. Warner