Abstract: A protective enclosure for a PCB assembly, e.g., a solid-state-drive assembly. In an example embodiment, the enclosure comprises a flexible, stamped-metal heat spreader connected, by way of cured-liquid TIM parts, to at least some of the packaged integrated circuits on one side of the PCB assembly. In some embodiments, additional cured-liquid TIM parts may be connected between the body of the protective enclosure and packaged integrated circuits on the other side of the PCB assembly and/or the assembly’s PCB. The PCB assembly, heat spreader, and various TIM parts are arranged in a manner that helps to significantly lower the risk of solder-joint failure under thermal cycling.

Abstract: A data storage device includes an enclosure and a Printed Circuit Board Assembly (PCBA) extending in a basal plane, and a plurality of semiconductor memory packages electromechanically bonded to the PCBA and coupled to the enclosure with thermal interface material. The data storage device further includes a first fitting coupled to a first end of the PCBA and the enclosure, restricting movement of the PCBA in the basal plane with respect to the enclosure and restricting movement of the PCBA out of the basal plane. The data storage device further includes a second fitting coupled to a second end of the PCBA, allowing movement of the PCBA in the basal plane with respect to the enclosure and restricting movement of the PCBA out of the basal plane.

Abstract: A ?SD card is disclosed including an arrangement of interface pins enabling the ?SD card to be used in a combination connector having a slot configured to receive both ?SD cards and SIM cards. In examples, the ?SD card may include multiple rows and/or columns of interface pins configured at positions such that, when the ?SD card is inserted into a multi-card connector, the positions of the ?SD card interface pins do not overlap with the positions of SIM card contacts in the connector.

Abstract: A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package.

Abstract: A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package.

Abstract: A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package.

Abstract: A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package.

Abstract: Improved techniques to produce integrated circuit products are disclosed. The improved techniques permit smaller and less costly production of integrated circuit products. One aspect of the invention concerns covering test contacts (e.g., test pins) provided with the integrated circuit products using printed ink. Once covered with the ink, the test contacts are no longer electrically exposed. Hence, the integrated circuit products are not susceptible to accidental access or electrostatic discharge. Moreover, the integrated circuit products can be efficiently produced in a small form factor without any need for additional packaging or labels to electrically isolate the test contacts.

Abstract: A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package.

Abstract: Improved techniques to produce integrated circuit products are disclosed. The improved techniques permit smaller and less costly production of integrated circuit products. One aspect of the invention concerns covering test contacts (e.g., test pins) provided with the integrated circuit products using printed ink. Once covered with the ink, the test contacts are no longer electrically exposed. Hence, the integrated circuit products are not susceptible to accidental access or electrostatic discharge. Moreover, the integrated circuit products can be efficiently produced in a small form factor without any need for additional packaging or labels to electrically isolate the test contacts.

Abstract: Improved techniques to produce integrated circuit products are disclosed. The improved techniques permit smaller and less costly production of integrated circuit products. One aspect of the invention concerns covering test contacts (e.g., test pins) provided with the integrated circuit products using printed ink. Once covered with the ink, the test contacts are no longer electrically exposed. Hence, the integrated circuit products are not susceptible to accidental access or electrostatic discharge. Moreover, the integrated circuit products can be efficiently produced in a small form factor without any need for additional packaging or labels to electrically isolate the test contacts.

Abstract: An enclosed re-programmable non-volatile memory card includes a cover that is hinged to the card to normally cover a set of external contacts to which the memory is connected but which can be rotated out of the way by hand to expose that set of contacts for connection with a mating receptacle of a host device. A second set of electrical contacts having a different pattern than the covered set may also be provided on the card. The covered set of contacts may be in accordance with the universal serial bus (USB) plug standards. A latching mechanism built into the hinged cover holds it firmly in a closed position but allows its manual release to expose the covered set of contacts. One exemplary release mechanism utilizes a resiliently held element that is moveable by hand against the resilience, and another employs a hand slideable latch.

Abstract: Improved techniques to produce integrated circuit products are disclosed. The improved techniques permit smaller and less costly production of integrated circuit products. One aspect of the invention concerns covering test contacts (e.g., test pins) provided with the integrated circuit products using printed ink. Once covered with the ink, the test contacts are no longer electrically exposed. Hence, the integrated circuit products are not susceptible to accidental access or electrostatic discharge. Moreover, the integrated circuit products can be efficiently produced in a small form factor without any need for additional packaging or labels to electrically isolate the test contacts.

Abstract: Improved techniques to produce integrated circuit products are disclosed. The improved techniques permit smaller and less costly production of integrated circuit products. One aspect of the invention concerns covering test contacts (e.g., test pins) provided with the integrated circuit products using printed ink. Once covered with the ink, the test contacts are no longer electrically exposed. Hence, the integrated circuit products are not susceptible to accidental access or electrostatic discharge. Moreover, the integrated circuit products can be efficiently produced in a small form factor without any need for additional packaging or labels to electrically isolate the test contacts.

Abstract: An enclosed re-programmable non-volatile memory card includes a cover that is hinged to the card to normally cover a set of external contacts to which the memory is connected but which can be rotated out of the way by hand to expose that set of contacts for connection with a mating receptacle of a host device. A second set of electrical contacts having a different pattern than the covered set may also be provided on the card. The covered set of contacts may be in accordance with the universal serial bus (USB) plug standards. A latching mechanism built into the hinged cover holds it firmly in a closed position but allows its manual release to expose the covered set of contacts. One exemplary release mechanism utilizes a resiliently held element that is moveable by hand against the resilience, and another employs a hand slideable latch.

Abstract: A single-lid flash memory card and methods of manufacturing same are disclosed. The single-sided lid flash memory card may be formed from a semiconductor package having two or more tapered, stepped or otherwise shaped edges capable of securing a single-sided lid thereon. The taper, step or other shape may be fabricated by various methods, including during the molding step or during the singulation step. A semiconductor package having shaped edges may be enclosed within an external lid to form a finished flash memory card. The lid may be applied to a single side of the semiconductor package by various processes, including over-molding, or by pre-forming the lid with interior edges to match the exterior edges of the semiconductor package, and then sliding the lid over the package to form a tight fit therebetween. The shaped edge of the semiconductor package effectively holds the lid securely on the memory card without any adhesives and prevents the lid from dislodging from the semiconductor package.

Abstract: A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package.