Abstract: A process for treating a polymeric plastic substrate to render it receptive to electroless plating in a process of the type including the steps of etching the substrate and activating the etched substrate. The present improvement includes the step of accelerating the activated substrate with an improved aqueous accelerating solution containing an aqueous soluble compatible oxidizing agent present in an amount effective to increase the activity of the accelerating solution. The improved accelerating solution inhibits the plating of stop-off coatings and plating racks and is of versatile use.

Abstract: A process for treating a polymeric plastic substrate to render it receptive to electroless plating including the steps of etching the substate, rinsing and activating the etched substrate with an acidic tin-palladium complex, rinsing and thereafter accelerating the activated substrate employing an improved aqueous accelerating solution containing an aqueous soluble compatible substituted alkyl amine. The improved accelerating solution is stable, easy to control, tolerant to metallic impurities present in the solution, inhibits rack plating and is of versatile use.

Abstract: The present invention is directed to a process and composition for accelerating the activation of a polymeric surface prior to the electroless plating thereof, wherein there is employed a solution comprising a relatively dilute inorganic acid and a metal salt desirably selected from the group consisting of nickel, cobalt and ruthenium. There may also be employed a compound cabable or ionizing to produce a source of fluoride ions. By so proceeding, microscopic cavities in the polymeric substrate are thoroughly cleansed of residual tin ions which remain subsequent to rinsing of the polymeric body following the conventional activation step employing an acidic solution of pollodium chloride and stannous chloride. The removal of palladium ions, which have a catalytic effect in the electroless plating operation, is minimized by the composition and process of this invention, and further, in addition to other advantages, there is achieved relatively low and uniform values of part resistance and contact resistance.