Abstract: Processes are provided for making a snack food in the form of a thin, crisp pretzel cracker having pretzel-like characteristics. The processes incorporate a sheeted dough process with pretzel cooking and baking. The processes include reducing dough thickness through multiple gauging stations to form a thin sheet of dough, which is cut into a desired shape, submerged in a bath of caustic soda such as sodium hydroxide and water, and baked to a crispy finish by way of a multi-phase baking process.

Abstract: A vehicle instrument panel assembly includes a display screen positioned within a housing, wherein the housing includes first and second protrusions. The vehicle instrument panel assembly includes a cross-car beam and a first bracket coupled to the cross-car beam. A second bracket is coupled to the first bracket and the first and second protrusions.

Abstract: A vehicle instrument panel assembly includes a display screen positioned within a housing, wherein the housing includes first and second protrusions. The vehicle instrument panel assembly includes a cross-car beam and a first bracket coupled to the cross-car beam. A second bracket is coupled to the first bracket and the first and second protrusions.

Abstract: A method and apparatus for generating normalized occupations for job titles at a job aggregation system is described. The method may include receiving a job title having a plurality of words that make up the job title, the job title received as part of a request of a job aggregation system to perform a service. The method may also include translating the plurality of words into standardized terms of the job aggregation system to generate a translated job title. Furthermore, the method may include mapping the translated job title to one of a plurality of normalized occupations of the job aggregation system by a machine learning based classifier of the translated job title, wherein the machine learning based classifier is trained based on user search behavior of users that have searched for jobs at the job aggregation system.

Abstract: A connector (20) to a couple breathing conduit to a patient interface or another conduit. The connector allows for an electrical connection (22a, 22b) in a first conduit (14a) to be connected to another electrical connection (21a, 21b) in a patient interface or second conduit (14b). The connector is capable of swivelling without disrupting the gas flow through the conduits of the electrical connection.

Abstract: An apparatus for drawing the attention of a server in a restaurant is disclosed. The apparatus may be comprised of a base, an elongated member having a first end and a second end, a lighting device, and a switch device. The first end of the elongated member can be attached to the base, so that the elongated member is substantially perpendicular to the base. The lighting device may be attached to the elongated member near the second end of the elongated member. The switch device can be used to turn on the lighting device. The base can be placed on to a tabletop in a restaurant and the lighting device can be turned on by using the switch device to draw the attention of the server.

Abstract: An electronic structure, and associated method of fabrication, that includes a substrate having attached circuit elements and conductive bonding pads of varying thickness. Pad categories relating to pad thickness include thick pads (17 to 50 microns), medium pads (10–17 microns), and thin pads (3 to 10 microns). A thick pad is used for coupling a ball grid array (BGA) to a substrate with attachment of the BGA to a circuit card. A medium pad is useful in flip-chip bonding of a chip to a substrate by use of an interfacing small solder ball. A thin copper pad, coated with a nickel-gold layer, is useful for coupling a chip to a substrate by use of a wirebond interface. The electrical structure includes an electrical coupling of two pads having different thickness, such that the pads are located either on the same surface of a substrate or on-opposite sides of a substrate.

Abstract: Embedded flush circuitry features are provided by providing a conductive seed layer on the sidewalls and bottom of laser ablated trench features plating a layer of conductive metal onto the seed layer and depositing a layer of dielectric material.

Abstract: An electronic structure, and associated method of fabrication, that includes a substrate having attached circuit elements and conductive bonding pads of varying thickness. Pad categories relating to pad thickness include thick pads (17 to 50 microns), medium pads (10-17 microns), and thin pads (3 to 10 microns). A thick pad is used for coupling a ball grid array (BGA) to a substrate with attachment of the BGA to a circuit card. A medium pad is useful in flip-chip bonding of a chip to a substrate by use of an interfacing small solder ball. A thin copper pad, coated with a nickel-gold layer, is useful for coupling a chip to a substrate by use of a wirebond interface. The electrical structure includes an electrical coupling of two pads having different thickness, such that the pads are located either on the same surface of a substrate or on opposite sides of a substrate.