Patents by Inventor Wasif K. Ahmed

Wasif K. Ahmed has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6403710
    Abstract: The present invention is at least a two-component thermoplastic elastomeric composition comprising at least one block copolymer wherein the composition has essentially the same comparative elasticity, high temperature serviceability and hardness as the unmodified, undiluted (neat) block copolymer portion of the composition. The composition also shows enhanced thermal stability and processibility and is well suited for fabricating elastic moldings, films and fibers as well as for formulating with asphalts, adhesives and sealants. The novel thermoplastic elastomeric composition comprises (a) from about 50 to about 99 percent by weight of at least one block copolymer and (b) about 1 to about 50 percent by weight of at least one ethylene interpolymer having a density from about 0.855 g/cc to about 0.905 g/cc, wherein the ethylene interpolymer in the amount employed is a substantially inert extender of the block copolymer and the composition is further characterized as having: i.
    Type: Grant
    Filed: October 16, 2000
    Date of Patent: June 11, 2002
    Assignee: The Dow Chemical Company
    Inventors: Wasif K. Ahmed, Stephen R. Betso, Antonio Batistini, Martin J. Guest, Thoi H. Ho, Deepak R. Parikh, George W. Knight, Rajen M. Patel
  • Patent number: 6184291
    Abstract: The present invention is at least a two-component thermoplastic elastomeric composition comprising at least one block copolymer wherein the composition has essentially the same comparative elasticity, high temperature serviceability and hardness as the unmodified, undiluted (neat) block copolymer portion of the composition. The composition also shows enhanced thermal stability and processibility and is well suited for fabricating elastic moldings, films and fibers as well as for formulating with asphalts, adhesives and sealants. The novel thermoplastic elastomeric composition comprises (a) from about 50 to about 99 percent by weight of at least one block copolymer and (b) about 1 to about 50 percent by weight of at least one ethylene interpolymer having a density from about 0.855 g/cc to about 0.905 g/cc, wherein the ethylene interpolymer in the amount employed is a substantially inert extender of the block copolymer and the composition is further characterized as having: i.
    Type: Grant
    Filed: November 26, 1997
    Date of Patent: February 6, 2001
    Assignee: The Dow Chemical Company
    Inventors: Wasif K. Ahmed, Antonio Batistini, Stephen R. Betso, Martin J. Guest, Thoi H. Ho, George W. Knight, Deepak R. Parikh, Rajen M. Patel
  • Patent number: 6184290
    Abstract: The present invention is at least a two-component thermoplastic elastomeric composition comprising at least one block copolymer wherein the composition has essentially the same comparative elasticity, high temperature serviceability and hardness as the unmodified, undiluted (neat) block copolymer portion of the composition. The composition also shows enhanced thermal stability and processibility and is well suited for fabricating elastic moldings, films and fibers as well as for formulating with asphalts, adhesives and sealants. The novel thermoplastic elastomeric composition comprises (a) from about 50 to about 99 percent by weight of at least one block copolymer and (b) about 1 to about 50 percent by weight of at least one ethylene interpolymer having a density from about 0.855 g/cc to about 0.905 g/cc, wherein the ethylene interpolymer in the amount employed is a substantially inert extender of the block copolymer and the composition is further characterized as having: i.
    Type: Grant
    Filed: November 26, 1997
    Date of Patent: February 6, 2001
    Assignee: The Dow Chemical Company
    Inventors: Wasif K. Ahmed, Antonio Batistini, Stephen R. Betso, Martin J. Guest, Thoi H. Ho, George W. Knight, Deepak R. Parikh, Rajen M. Patel