Patents by Inventor Wataru Gotou

Wataru Gotou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10429269
    Abstract: A building safety verification system and a building safety verification method for estimating a degree of damage of a building after an earthquake occurs are provided. The building safety verification system includes: an inter-story displacement measurement unit which obtains, from measurement data of acceleration sensors which measure accelerations of a plurality of stories in a building, an inter-story displacement of each of the stories; a natural period measurement unit which obtains a natural period of microtremor of the building from measurement data of a micro vibration sensor which measures micro vibration of a highest story of the building or a story near the highest story; and a building safety evaluation unit which evaluates soundness of the building from the inter-story displacement obtained by the inter-story displacement measurement unit and the natural period obtained by the natural period measurement unit.
    Type: Grant
    Filed: January 8, 2014
    Date of Patent: October 1, 2019
    Assignee: NTT FACILITIES, INC.
    Inventors: Kenichi Yoshida, Shigeto Nagashima, Toshiya Motohi, Kouzou Toyota, Yoshifumi Sugimura, Wataru Gotou, Maki Mochiduki, Hiroyasu Nishii
  • Patent number: 8592686
    Abstract: A method for manufacturing a printed circuit board assembled panel by a simple process with an excellent material yield and a high conforming product rate. Unit printed circuit boards previously manufactured are arranged in a frame in a prescribed relationship. Then, the printed circuit boards are fixed to one another, and the printed circuit board and the frame body are fixed to one another.
    Type: Grant
    Filed: April 4, 2005
    Date of Patent: November 26, 2013
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Atsushi Kobayashi, Kazuo Umeda, Wataru Gotou, Takahiro Sahara, Susumu Nakazawa, Kiyoshi Takeuchi, Takayuki Terauchi
  • Patent number: 7815441
    Abstract: A rigid-flexible board and a method for manufacturing the same can be provided, whereby the material yield ratio can be enhanced and the productive yield can be also enhanced. A rigid board with a step for connection and a flexible board with a connector at the edge thereof are formed independently. Then, the connecting area is spot facing processed so that the depth of the thus obtained depressed portion is equal to or lower than the thickness of the flexible board. The connector of the flexible board is electrically connected to the vertical wiring area of the depressed portion.
    Type: Grant
    Filed: April 4, 2005
    Date of Patent: October 19, 2010
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Atsushi Kobayashi, Kazuo Umeda, Wataru Gotou, Susumu Nakazawa, Kiyoshi Takeuchi, Takayuki Terauchi
  • Publication number: 20090014205
    Abstract: A method for manufacturing a printed circuit board assembled panel by a simple process with an excellent material yield and a high conforming product rate. Unit printed circuit boards previously manufactured are arranged in a frame in a prescribed relationship. Then, the printed circuit boards are fixed to one another, and the printed circuit board and the frame body are fixed to one another.
    Type: Application
    Filed: April 4, 2005
    Publication date: January 15, 2009
    Inventors: Atsushi Kobayashi, Kazuo Umeda, Wataru Gotou, Takahiro Sahara, Susumu Nakazawa, Kiyoshi Takeuchi, Takayuki Terauchi
  • Publication number: 20070281505
    Abstract: A rigid-flexible board and a method for manufacturing the same can be provided, whereby the material yield ratio can be enhanced and the productive yield can be also enhanced. A rigid board with a step for connection and a flexible board with a connector at the edge thereof are formed independently. Then, the connecting area is spot facing processed so that the depth of the thus obtained depressed portion is equal to or lower than the thickness of the flexible board. The connector of the flexible board is electrically connected to the vertical wiring area of the depressed portion.
    Type: Application
    Filed: April 4, 2005
    Publication date: December 6, 2007
    Inventors: Atsushi Kobayashi, Kazuo Umeda, Wataru Gotou, Susumu Nakazawa, Kiyoshi Takeuchi, Takayuki Terauchi
  • Patent number: 4880476
    Abstract: A corrosion-resistant phosphate chemical conversion coating layer is formed on a steel material surface by a process comprising bringing the steel material into contact with a treatment liquid containing mixed anions consisting of phosphate ions and at least one other type of active anions, at least one type of metal ions, and an oxidizing agent, to provide a phosphate chemical conversion coating layer on the surface of the steel material, wherein the ratio (P/An) in weight of the phosphate ions (P) to the total of mixed anions (An) is 1/2 or less and the temperature of the treatment liquid is maintained at a level of 40.degree. C. or less without external heating.
    Type: Grant
    Filed: December 9, 1987
    Date of Patent: November 14, 1989
    Assignees: Nippondenso Co., Ltd., Nihon Parkerizing Co., Ltd.
    Inventors: Shigeki Matsuda, Kazuhiko Mori, Wataru Gotou, Takahiro Ohnuki