Abstract: A component mounter which picks up components from two or more tape feeders aligned in a component feeder carriage, and mounts them a board. Suction nozzles for vacuum-holding components are disposed on the transfer head at a predetermined basic pitch in the X direction (tape feeders alignment direction) to form a nozzle line. Two or more nozzle lines are aligned in the Y direction (perpendicular to the X direction). These suction nozzles pick up two or more components from the tape feeders simultaneously, enabling to reduce the space required for installing the mounter and making the mounter more compact. Increased feasibility of simultaneous pickup of several components also improves mounting efficiency.

Abstract: A component mounter which picks up components from two or more tape feeders aligned in a component feeder carriage, and mounts them a board. Suction nozzles for vacuum-holding components are disposed on the transfer head at a predetermined basic pitch in the X direction (tape feeders alignment direction) to form a nozzle line. Two or more nozzle lines are aligned in the Y direction (perpendicular to the X direction). These suction nozzles pick up two or more components from the tape feeders simultaneously, enabling to reduce the space required for installing the mounter and making the mounter more compact. Increased feasibility of simultaneous pickup of several components also improves mounting efficiency.

Abstract: An electronic parts-mounting method for mounting parts on a board in which at least two electronic parts can be picked up by a plurality of nozzles including a plurality of first nozzles arranged substantially parallel to the direction of movement of the board and a plurality of second nozzles arranged substantially perpendicular to the direction of movement of the board such that the positions of the parts picked up by the second nozzles can be recognized by a line sensor and corrected.

Abstract: In this electronic component mounting apparatus, a mounting head is movably arranged between the electronic component supplying unit and the board holding unit. A first camera for taking an image of the board in the board holding unit and detecting an electronic component mounting position, and a second camera for taking images of the chips of the electronic component supplying unit are arranged in such a manner that the first camera and the second camera can be entered/evacuated as against the electronic component supplying unit. Therefore, the electronic component supplying unit and the board holding unit are defined as a range to be transported, and the mounting head, the first camera, and the second camera are relatively traveled in conjunction to each other, a loss-time in both the electronic component supplying unit and the board holding unit can be avoided, and tact time can be shortened to improve a work-efficiency.

Abstract: An electronic components mounting device has a plurality of feeder bases attached with tape feeders thereon, and a guide rail and a cylinder for drawing each of the feeder bases independently to a position for replenishing electronic components. When an electronic component runs out of the storage, only the feeder base that is carrying the relevant tape feeder gone out of the stock is drawn to a place for parts replenishment; in the mean time, the mounting actions keep on going by making use of tape feeders attached on other feeder base. Machine stop times can be decreased with the mounting device.

Abstract: An electronic parts mount apparatus for taking out electronic parts from a parts supply section 3 by a transfer head 9 and transporting and mounting the electronic parts to and on a board 2 has a board recognition camera 15 moving independently of the transfer head 9 and advancing to and retreating from the board 2 positioned on a transfer passage 1 for picking up an image of the board 2 to detect the position thereof. The image pickup step of the board 2 by the board recognition camera 15 and the parts taking out step in the parts supply section by the transfer head 9 are performed concurrently. Thus, the tact time can be shortened and the electronic parts can be mounted on the board efficiently.

Abstract: An electronic parts mount apparatus for taking out semiconductor chips from a semiconductor wafer held on a wafer hold section by a transfer head comprising a plurality of suction nozzles and transporting and mounting the semiconductor chips to and on a board has a parts recognition camera disposed in a manner that it can advance to and retreat from the wafer hold section for picking up an image of the semiconductor wafer. A parts mounting step for mounting a plurality of semiconductor chips on the board by the transfer head and an image picking up step for picking up a plurality of semiconductor chips to be next taken out by the parts recognition camera are performed concurrently. Thereby, the number of electronic parts per mount turn can be increased, the tact time can be shortened, and the electronic parts can be efficiently taken out and mounted on the board.

Abstract: An upstream side first conveyor 5 and a downstream side second conveyor 6 are disposed in a mounting area A capable of mounting electronic components P by a transfer head 23. When mounting electronic components P on a large substrate 30A, the large substrate 30A is positioned on the first conveyor 5 and second conveyor 6 which are used as the mounting stage, and the electronic components P are mounted by the transfer head 23. When mounting electronic components on small substrates, the second conveyor 6 is used as the mounting stage, and the small substrate is positioned, and electronic components P are mounted by the transfer head 23, while the first conveyor 5 is used as a waiting stage, and next small substrate is waiting thereon, so that efficient mounting depending on the size of substrates may be realized.

Abstract: An electronic components mounting device has a plurality of feeder bases 17 attached with tape feeders 18 thereon, and a guide rail 21 and a cylinder 20 for drawing each of the feeder bases 17 independently to a position for replenishing electronic components. When an electronic component runs out of the storage, only the feeder base 17 that is carrying the relevant tape feeder 18 gone out of the stock is drawn to a place for parts replenishment; in the mean time, the mounting actions keep on going by making use of tape feeders 18 attached on other feeder base 17. Machine stop times can be decreased with the mounting device.

Abstract: A component mounter which picks up components from two or more tape feeders aligned in a component feeder carriage, and mounts them a board. Suction nozzles for vacuum-holding components are disposed on the transfer head at a predetermined basic pitch in the X direction (tape feeders alignment direction) to form a nozzle line. Two or more nozzle lines are aligned in the Y direction (perpendicular to the X direction). These suction nozzles pick up two or more components from the tape feeders simultaneously, enabling to reduce the space required for installing the mounter and making the mounter more compact. Increased feasibility of simultaneous pickup of several components also improves mounting efficiency.

Abstract: An outer lead bonding apparatus which includes a device supply section on which devices are arranged at predetermined positions, a transfer head assembly for picking up the devices from the device supply section, means for driving the transfer head assembly in a predetermined direction, a first monitoring camera for checking the devices picked up by the transfer head assembly for its positional exactness, a substrate driving means for moving the substrate in a predetermined direction, and a second monitoring camera for checking the electrodes of the substrate for their positional exactness.

Abstract: A TAB method is known to manufacture an electrical component by bonding a semiconductor on a film carrier made of synthetic resin, then punching the lead of the film carrier, and bonding a device obtained by punching to a circuit board. A bonding of a semiconductor to a film carrier as described above is called "an inner lead bonding". Bonding a punched device to a circuit board is called "an outer lead bonding". In the invention, the film carrier fed from the supply reel is punched by a punching unit, and the device obtained by punching is picked up by a bonding head. Then, the positional deviation of the lead of the device picked up with respect to the electrode of the circuit board is detected by the optical means. Subsequently, the positional deviation of the lead is corrected, the device is placed on the circuit board, and the lead is fusion-bonded to the electrode of the circuit board.

Abstract: An electronic parts mounting apparatus includes an index rotary member. The index rotary member is rotated. A plurality of mounted heads are provided on the index rotary member for sucking electronic components, and for mounting the electronic components on a printed circuit board. The mounting heads are vertically moved through a stoke relative to the printed circuit board. The stroke of movement of the mounting heads is adjusted. A vertically-movable table is provided on a horizontally-movable table. Clampers are supported on the vertically-movable table for holding the printed circuit board therebetween. The vertically-movable table is vertically moved to adjust a height of the printed circuit board held between the clampers.

Abstract: A type of electronic components mounting apparatus is widely known, by which electronic components on an electronic components feeding device are picked up, while pick-and-place heads are being rotated for indexing along a rotary head, and the electronic components are mounted on a circuit board or a substrate positioned on an X-Y table. The electronic components feeding device moves the tables with feeders over a base in lateral direction to supply the electronic components to the feeders on the pick-and-place heads. With increasing demands on high-speed mounting of the components, the moving speed of the above tables must be increased to attain high-speed mounting.

Abstract: An electrical component placing apparatus having a rotary head is required to be further accelerated to place an electrical component. In order to accelerate the operation of the placing apparatus, the indexing speed of the rotary head must be accelerated. However, since the rotary head is heavy, its rotating inertial is large. Thus, when the indexing speed of the rotary head is accelerated, a vibration at the time of stopping indexing of the rotary head is increased as well. Therefore, mistakes of picking up the electrical component by the pick and place head and placing the electrical component on the substrate occur. This invention reduces the outer diameter of a rotor for indexing a pick and place head smaller than the diameter of a guide for guiding the indexing of a pick and place head, disposes a bracket for supporting the pick and place head along the wall surface of the rotor and reduces the rotating diameter of the pick and place head smaller than the diameter of the guide.

Abstract: A nozzle shaft is moved down, and a semiconductor chip sucked to the lower end of the nozzle shaft is placed on a circuit board. Then, a thermally press-bonding member is moved down, and the outer leads of the semiconductor chip are pressed to the circuit board by the thermally press-bonding member. Thereafter, the thermally press-bonded member is pressed by pressing means to strongly press the outer leads to the circuit board, the thermally press-bonding member is then raised to release the pressing state, and the outer leads are thermally press-bonded to the circuit board.

Abstract: By providing an electronic component mounting apparatus which an adjusting mechanism for adjusting the amount of drive in a path of transmission of drive from a drive unit, which is used for driving each component mounting head between elevated and lowered positions, to each component mounting head, the limit of position to which each component mounting head can be lowered is made adjustable. The provision of a control unit is also made to control the lowered position of each component mounting head according to the height of each of the electronic components to be mounted by the apparatus. The control unit is also operable to determine the lowered position of each component mounting head for the mounting of subsequent electronic components with the height of a first mounted one of the electronic components taken as a reference value so that a correction value can be added to the reference value when the succeeding electronic components are to be mounted.