Patents by Inventor Wataru IJUIN

Wataru IJUIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11205814
    Abstract: A power storage device packaging material having a structure including at least a substrate layer, an adhesive layer, a metal foil layer, a sealant adhesive layer, and a sealant layer laminated in this order. The substrate layer is formed of a polyester film exhibiting ?A, as expressed by the following formula, of 10% or more and a 50% elongation stress of 75 MPa or more after heat treatment at 160° C.: “?A=(break elongation after 160° C. heat treatment)?(break elongation before 160° C. heat treatment)”.
    Type: Grant
    Filed: April 16, 2019
    Date of Patent: December 21, 2021
    Assignee: TOPPAN PRINTING CO., LTD.
    Inventors: Wataru Ijuin, Satoshi Sasaki, Masayoshi Suzuta
  • Patent number: 11121425
    Abstract: The present invention relates to a packaging material for a power storage device, the packaging material including at least a slip agent layer, a substrate layer, an adhesive layer, a metal foil layer, a sealant adhesive layer, and a sealant layer, in this order, wherein the slip agent layer contains a fatty acid amide and a fatty acid bisamide, or a fatty acid amide and silicone oil.
    Type: Grant
    Filed: August 17, 2018
    Date of Patent: September 14, 2021
    Assignee: TOPPAN PRIMING CO., LTD.
    Inventors: Wataru Ijuin, Masayoshi Suzuta
  • Patent number: 10777783
    Abstract: A power storage device packaging material including a base material layer; an adhesion-enhancing treatment layer on a surface of the base material layer; an adhesive layer on a surface of the adhesion-enhancing treatment layer opposite the base material layer; a metal foil layer formed on one side of the adhesive layer opposite the adhesion-enhancing treatment layer; and a sealant layer disposed on a surface of the metal foil layer opposite the adhesive layer. The base material layer is formed of a biaxially oriented film to have a breaking strength of 240 MPa or more in at least one of four directions (0° (MD), 45°, 90° (TD), 135°) and an elongation of 80% or more in at least one direction in a tensile test (test specimen shape: test specimen type 5 stipulated in JIS K7127; inter-chuck distance: 60 mm; tensile speed: 50 mm/min).
    Type: Grant
    Filed: January 12, 2017
    Date of Patent: September 15, 2020
    Assignee: TOPPAN PRINTING CO., LTD.
    Inventor: Wataru Ijuin
  • Patent number: 10693111
    Abstract: An outer packaging material for electric storage device comprises at least a substrate layer, an adhesion layer, a metal foil layer, a sealant adhesion layer, and a sealant layer laminated in this order, wherein the substrate layer is one made of either a polyamide film having a hot water shrinkage rate at 95° C. of less than 5% and a hot shrinkage rate at 180° C. of 4 to 16%, or a polyester film having a hot water shrinkage rate at 95° C. of less than 5% and a hot shrinkage rate at 180° C. of 10 to 25%.
    Type: Grant
    Filed: August 30, 2017
    Date of Patent: June 23, 2020
    Assignee: TOPPAN PRINTING CO., LTD.
    Inventors: Wataru Ijuin, Satoshi Sasaki
  • Patent number: 10651433
    Abstract: A packaging material for a power storage device having a structure including at least a substrate layer, an adhesive layer, a metal foil layer, a sealant adhesive layer, and a sealant layer laminated in this order. In the packaging material, the substrate layer is formed of a polyester film having a 50% elongation stress in the range of 100 to 180 MPa and a thermal shrinkage in the range of 1 to 15%, after heat treatment from 160° C. to 200° C., or a polyester film having a difference ?A in break elongation of 12% or more after heat treatment at 200° C. and 160° C. and having a 50% elongation stress of 75 MPa or more after heat treatment at 200° C.
    Type: Grant
    Filed: March 15, 2018
    Date of Patent: May 12, 2020
    Assignee: TOPPAN PRINTING CO., LTD.
    Inventors: Wataru Ijuin, Satoshi Sasaki
  • Publication number: 20190245165
    Abstract: A power storage device packaging material having a structure including at least a substrate layer, an adhesive layer, a metal foil layer, a sealant adhesive layer, and a sealant layer laminated in this order. The substrate layer is formed of a polyester film exhibiting ?A, as expressed by the following formula, of 10% or more and a 50% elongation stress of 75 MPa or more after heat treatment at 160° C.: “?A=(break elongation after 160° C. heat treatment)?(break elongation before 160° C. heat treatment)”.
    Type: Application
    Filed: April 16, 2019
    Publication date: August 8, 2019
    Applicant: TOPPAN PRINTING CO., LTD.
    Inventors: Wataru IJUIN, Satoshi SASAKI, Masayoshi SUZUTA
  • Publication number: 20180366693
    Abstract: The present invention relates to a packaging material for a power storage device, the packaging material including at least a slip agent layer, a substrate layer, an adhesive layer, a metal foil layer, a sealant adhesive layer, and a sealant layer, in this order, wherein the slip agent layer contains a fatty acid amide and a fatty acid bisamide, or a fatty acid amide and silicone oil.
    Type: Application
    Filed: August 17, 2018
    Publication date: December 20, 2018
    Applicant: TOPPAN PRINTING CO., LTD.
    Inventors: Wataru IJUIN, Masayoshi SUZUTA
  • Publication number: 20180219192
    Abstract: A packaging material for a power storage device having a structure including at least a substrate layer, an adhesive layer, a metal foil layer, a sealant adhesive layer, and a sealant layer laminated in this order. In the packaging material, the substrate layer is formed of a polyester film having a 50% elongation stress in the range of 100 to 180 MPa and a thermal shrinkage in the range of 1 to 15%, after heat treatment from 160° C. to 200° C., or a polyester film having a difference ?A in break elongation of 12% or more after heat treatment at 200° C. and 160° C. and having a 50% elongation stress of 75 MPa or more after heat treatment at 200° C.
    Type: Application
    Filed: March 15, 2018
    Publication date: August 2, 2018
    Applicant: TOPPAN PRINTING CO., LTD.
    Inventors: Wataru IJUIN, Satoshi SASAKI
  • Publication number: 20170365825
    Abstract: An outer packaging material for electric storage device comprises at least a substrate layer, an adhesion layer, a metal foil layer, a sealant adhesion layer, and a sealant layer laminated in this order, wherein the substrate layer is one made of either a polyamide film having a hot water shrinkage rate at 95° C. of less than 5% and a hot shrinkage rate at 180° C. of 4 to 16%, or a polyester film having a hot water shrinkage rate at 95° C. of less than 5% and a hot shrinkage rate at 180° C. of 10 to 25%.
    Type: Application
    Filed: August 30, 2017
    Publication date: December 21, 2017
    Applicant: TOPPAN PRINTING CO., LTD.
    Inventors: Wataru Ijuin, Satoshi Sasaki
  • Publication number: 20170141362
    Abstract: A power storage device packaging material including a base material layer; an adhesion-enhancing treatment layer on a surface of the base material layer; an adhesive layer on a surface of the adhesion-enhancing treatment layer opposite the base material layer; a metal foil layer formed on one side of the adhesive layer opposite the adhesion-enhancing treatment layer; and a sealant layer disposed on a surface of the metal foil layer opposite the adhesive layer. The base material layer is formed of a biaxially oriented film to have a breaking strength of 240 MPa or more in at least one of four directions (0° (MD), 45°, 90° (TD), 135°) and an elongation of 80% or more in at least one direction in a tensile test (test specimen shape: test specimen type 5 stipulated in JIS K7127; inter-chuck distance: 60 mm; tensile speed: 50 mm/min).
    Type: Application
    Filed: January 12, 2017
    Publication date: May 18, 2017
    Applicant: TOPPAN PRINTING CO., LTD.
    Inventor: Wataru IJUIN