Patents by Inventor Wataru Iwanami

Wataru Iwanami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5895541
    Abstract: A parting layer 12, colored layer 13, reflective layer 14, and photosensitive resin layer 15 are laminated to base film 11 of relief pattern transfer sheet 10. When forming letters on the face of a timepiece, photosensitive resin layer 15 is first exposed through negative film 16. Mask areas 161 of a pattern corresponding to the letters are formed in negative film 16. Therefore, when photosensitive resin layer 15 is developed by a water wash, molded resin layer 150 of the specified pattern is left on base film 11 with parting layer 12, colored layer 13, and reflective layer 14. Pressure-sensitive adhesive layer 17 is then formed only on the surface of molded resin layer 150, and relief pattern transfer sheet 10 is bonded to the timepiece face. When relief pattern transfer sheet 10 is thereafter pulled off of the timepiece face, reflective layer 14 and colored layer 13 corresponding to the areas in which molded resin layer 150 is formed are also transferred to the timepiece face.
    Type: Grant
    Filed: May 26, 1995
    Date of Patent: April 20, 1999
    Assignee: Seiko Epson Corporation
    Inventors: Koichi Kobayashi, Wataru Iwanami, Taiyo Kanai, Hideki Horiuchi
  • Patent number: 5750241
    Abstract: A thermal transfer foil (4) on which the following layer are stacked is superimposed on one side of a base film (4a), approximately 12 .mu.m to 25 .mu.m thick, relative to a substrate (11), such as a metal plate, comprising a timepiece face plate: a separable processing layer (4b), approximately 0.02 .mu.m thick; a transparent protective coloring layer (4c), approximately 2 .mu.m thick; and a reflection layer (4d), approximately 0.03 .mu.m to 0.05 .mu.m thick; as well as a thermoplastic resin layer (4e). Then, the base film (4a) is peeled off the thermal transfer foil (4), and then heat-pressed using a mold (21). Fine relief-and-indentation patterns are provided on the pressing surface (22) of the mold (21), which are transferred to the protective coloring layer (4c), the reflection layer (4d), and the thermoplastic resin layer (4e).
    Type: Grant
    Filed: December 21, 1994
    Date of Patent: May 12, 1998
    Assignee: Seiko Epson Corporation
    Inventors: Koichi Kobayashi, Wataru Iwanami, Taiyo Kanai
  • Patent number: 5615179
    Abstract: An electronic apparatus with a fitting band has a structure for containing conductive members in the fitting band which permits easy production of the fitting band and which improves the durability, design, fitting properties and so on of the fitting band containing the conductive members.An end piece plate (21a) which forms an end piece (21) has recessed portions (21c) formed for holding pipes (50) and conductive wires (30) under predetermined pressure. A piece plate (31a) which forms a piece member (31) has recessed portions (31c) formed for containing, with play, the pipes (50) and the conductive wires (30). The conductive wires (30) which are passed through the pipes (50) are mounted on the end piece plate (21a) and the piece plate (31a) so as to rotatably connect the end piece (21) and the piece member (31) after assembly. Since the end piece (21) is fixed to the case band of a wrist watch, no load is applied to the connection portion at the ends (30a) of the conductive wires (30).
    Type: Grant
    Filed: May 1, 1995
    Date of Patent: March 25, 1997
    Assignee: Seiko Epson Corporation
    Inventors: Akio Yamamoto, Wataru Iwanami, Hiroshi Yabe, Kenji Yamazaki, Tatsumi Miyashita, Akeshi Tsurubuchi