Abstract: A method for producing a ceramic-aluminum bonded body obtained by bonding a ceramic member and an aluminum member, the aluminum member before bonding being composed of aluminum having a purity of 99.0 mass % or higher and 99.9 mass % or lower, includes a heat treatment step of subjecting the aluminum member to a heat treatment in a range of 400° C. or higher and lower than a solidus temperature, and a bonding step of bonding the aluminum member after the heat treatment step and the ceramic member via a brazing filler material including Si.

Abstract: A method for producing a ceramic-aluminum bonded body obtained by bonding a ceramic member and an aluminum member, the aluminum member before bonding being composed of aluminum having a purity of 99.0 mass % or higher and 99.9 mass % or lower, includes a heat treatment step of subjecting the aluminum member to a heat treatment in a range of 400° C. or higher and lower than a solidus temperature, and a bonding step of bonding the aluminum member after the heat treatment step and the ceramic member via a brazing filler material including Si.

Abstract: In an aluminum material that constitutes a bonding surface of a metal layer, and an aluminum material that constitutes a bonding surface of a heat sink, any one aluminum material is set to a high-purity aluminum material with high aluminum purity, and the other aluminum material is set to a low-purity aluminum material with low aluminum purity. The difference in a concentration of a contained element other than Al between the high-purity aluminum material and the low-purity aluminum material is set to 1 at % or greater, and the metal layer and the heat sink are subjected to solid-phase diffusion bonding.

Abstract: A thermoelectric conversion module which is obtained by connecting a plurality of thermoelectric conversion elements via a pair of wiring substrates facing each other in such a state that the thermoelectric conversion elements are combined with each other between the wiring substrates: each of the wiring substrates is obtained by forming an electrode layer on one surface of a ceramic substrate, the electrode layer being connected to the thermoelectric conversion elements and being formed of aluminum or an aluminum alloy: at least the electrode layer that is arranged on the high-temperature side is provided with a silver base layer, in which a glass layer and a silver layer are laminated in the surface; and the silver layer of the silver base layer is bonded to the thermoelectric conversion elements.

Abstract: A light-emitting module with a cooler of the present invention includes a circuit layer which is formed on one surface side of an insulating layer and in which a light-emitting element is mounted, and a metal layer and a cooler which are laminated in order on the other surface side of the insulating layer. The circuit layer is formed of Cu, Al, or an alloy thereof and has a thickness of 0.1 mm or less. The metal layer and the cooler are formed of Al or an Al alloy. The metal layer and the cooler are directly bonded to each other. The ratio of the area of the light-emitting element to the area of the one surface of the insulating layer is within a range from 1:20 to 1:400.

Abstract: A light-emitting module substrate of the present invention includes a circuit layer which is formed on one surface of an insulating layer and in which a light-emitting element is mounted, and a metal layer formed of Al or an Al alloy and a heat sink which are laminated in order on the other surface side of the insulating layer. In the heat sink, Cu is present on at least a bonding surface with respect to the metal layer. The metal layer and the heat sink are subjected to solid-phase diffusion bonding on the bonding surface. The thickness of the circuit layer is 0.1 mm or less.

Abstract: In an aluminum material that constitutes a bonding surface of a metal layer, and an aluminum material that constitutes a bonding surface of a heat sink, any one aluminum material is set to a high-purity aluminum material with high aluminum purity, and the other aluminum material is set to a low-purity aluminum material with low aluminum purity. The difference in a concentration of a contained element other than Al between the high-purity aluminum material and the low-purity aluminum material is set to 1 at % or greater, and the metal layer and the heat sink are subjected to solid-phase diffusion bonding.

Abstract: A method for producing a ceramic-aluminum bonded body obtained by bonding a ceramic member and an aluminum member, the aluminum member before bonding being composed of aluminum having a purity of 99.0 mass % or higher and 99.9 mass % or lower, includes a heat treatment step of subjecting the aluminum member to a heat treatment in a range of 400° C. or higher and lower than a solidus temperature, and a bonding step of bonding the aluminum member after the heat treatment step and the ceramic member via a brazing filler material including Si.

Abstract: A communication apparatus comprising a communication module that serves as Data Circuit-terminating Equipment used in a radio packet communication network; an auxiliary circuit board on which said communication module is mounted; a main circuit board on which a communication controller is mounted; and a signal line for connecting said main circuit board to the auxiliary circuit board detachably; wherein said main circuit board further comprises a detecting means for detecting a type of the connected communication module based on a pattern of a signal status on the signal line at a start-up, and said communication controller performs a communication control operation in accordance with a result of detection by the detecting means.

Abstract: A connection adapter is disposed intervening between a communication module for connection to a radio packet communication network and high-level equipment. The connection adapter comprises a connection controller for controlling connection between the high-level equipment and the radio packet communication network, and a communication controller for relaying the communication by the high-level equipment using the communication module. When the communication controller of the connection adapter detects duplication of a TCP packet received from the high-level equipment, the communication controller discards the duplicated packet.

Abstract: A connection adapter converts in accordance with prescribed rules into a form suitable for a second communication device, transmits or discards data transmitted by high-level equipment for use by a first communication device, and also converts in accordance with prescribed rules into a form suitable for the high-level equipment, transmits or discards data received from the second communication device.

Abstract: A connection adapter 1 is interposed between a host device 10 and a communication equipment 20. Upon receipt of a communication start TCP packet from the wireless packet communication network 40 after the establishment of a connection with a wireless packet communication network 40, the connection adapter 1 temporarily stores the TCP packet, and starts the connecting process with the host device 10. When the connecting process is completed, the connection adapter 1 transmits the temporarily stored communication start TCP packet to the host device 10 without delay.

Abstract: A connection adapter is interposed between high-level equipment and a communication module. The connection adapter and a router perform a circuit control and an address conversion processing so that the high-level equipment and a management computer set for the network connection service giving a fixed IP address can use the network connection service giving a dynamic IP address.

Abstract: A communication device includes a case approximately in a shape of box, data circuit-terminating equipment contained in the case for connecting with a radio packet communication network, and a circuit board provided with a circuit for connecting data terminal equipment and the data circuit-terminating equipment each other and mounted with the data circuit-terminating equipment, in which the circuit board includes a main circuit board including a first interface circuit for connecting with data terminal equipment and a circuit for intervening communication between the data terminal equipment and the data circuit-terminating equipment, and an auxiliary circuit board including a second interface circuit for connecting the data circuit-terminating equipment and the main circuit board, and the data circuit-terminating equipment is mounted on the auxiliary circuit board.

Abstract: A communication device includes a case approximately in a shape of box, data circuit-terminating equipment contained in the case for connecting with a radio packet communication network, and a circuit board provided with a circuit for connecting data terminal equipment and the data circuit-terminating equipment each other and mounted with the data circuit-terminating equipment, with an attachment integrated with the outside of the case.

Abstract: A connection adapter is arranged to intervene between a communication device for connection to a radio packet communication network and high-level equipment which performs communication via the communication device. The connection adapter controls to switch the communication speed of the communication device on the radio packet section, based on radio wave condition detected by the communication device and/or the length of IP packets transmitted from the high-level equipment.

Abstract: A connection adapter is arranged to intervene between a communication device for connection to a radio packet communication network and high-level equipment which performs communication via the communication device. The connection adapter includes a communication controller which controls relay of communication via the radio packet communication network between the high-level equipment and a destination of communication thereof; and an indicator which indicates information on the result of the communication each time the communication terminates.

Abstract: A connection adapter is disposed intervening between a communication module for connection to a radio packet communication network and high-level equipment. The connection adapter transmits in response to a TCP packet received from the high-level equipment a confirming response packet to the high-level equipment on behalf of a management computer, which is the communication destination, and the confirming response packet received from the management computer is discarded.

Abstract: A connection adapter is interposed between high-level equipment and a communication module. The connection adapter and a router perform a circuit control and an address conversion processing so that the high-level equipment and a management computer set for the network connection service giving a fixed IP address can use the network connection service giving a dynamic IP address.

Abstract: A connection adapter converts in accordance with prescribed rules into a form suitable for a second communication device, transmits or discards data transmitted by high-level equipment for use by a first communication device, and also converts in accordance with prescribed rules into a form suitable for the high-level equipment, transmits or discards data received from the second communication device.