Abstract: An imaging apparatus for an electronic endoscope capable of realizing a compact size and improved optical characteristics simultaneously. In the apparatus, the imaging element is mounted on the rigid circuit substrate such that the substrate connection pads of the rigid circuit substrate and the element connection pads of the imaging element are electrically connected by a mutual compression bonding between the rigid circuit substrate and the imaging element, by a face-down bonding such that the imaging surface of the imaging element is facing toward the window of the rigid circuit substrate.

Abstract: An endoscope with a compact scope end section structure in which the length of the scope end section in the scope axis direction is shortened. In the endoscope, the scope end section has an optical system for receiving optical image light beam; an imaging element for converting optical image light beams into electric signals; electric components for processing the electric signals obtained by the imaging element, which are located behind sides of the optical system and the imaging element facing away from an end of the scope section; and a flexible substrate permanently affixed to the imaging element at one of the ends and to a processed electrical signal line at its other end for electrically connecting the imaging element and the electric components.