Abstract: A stator (4) has a stator core having a plurality of tooth portions (7), a slot (8) provided between the tooth portions (7) and accommodating a coil (9), and the coil (9) accommodated in the slot (8), the stator has a resin layer (50) provided on an inner surface of the slot (8) and made of an insulating resin composition, a wall surface (a resin layer surface (55) of an inner resin layer (51)) of the resin layer (50) on an inner side of the slot (8) is provided in parallel with a rotating shaft direction, the resin composition of the resin layer (50) contains a thermosetting resin, and the thermosetting resin has a glass transition temperature Tg of 120° C. or higher.

Abstract: A power module (10) includes a power semiconductor chip (1) and a Cu circuit (3) having the power semiconductor chip (1) provided on one surface. The power module (10) includes: a sintering layer (2) joining the power semiconductor chip (1) and the Cu circuit (3) by using a sintering paste; and a heat dissipation sheet (4) provided for joining a Cu base plate (5) to the other surface of the Cu circuit (3), in which in a first laminated structure in which the power semiconductor chip (1), the sintering layer (2), the Cu circuit (3), and the heat dissipation sheet (4) are laminated, the total thermal resistance XA in the direction of lamination is equal to or less than 0.30 (K/W).

Abstract: A motor (100) includes a stator (6) having a plurality of tooth portions (7), a coil (9) wound around the tooth portions (7), and a slot (8) in which the coil (9) is formed between the tooth portions (7), in which the coil (9) is provided in the slot (8), and a cooling structure for the motor (100) includes a first resin composition with which the slot (8) is filled and which covers the coil (9), and a coil inner side cooling flow path (10) which is provided in a region filled with the first resin composition and extends in a rotating shaft direction, and in which a coolant circulates inside.

Abstract: A resin composition including the following components (A) to (C): (A) polyarylene sulfide resin: 20 wt %<component (A)?60 wt %; (B) hexagonal boron nitride: 8 wt %?component (B)?55 wt %; and (C) flat glass fiber: 15 wt % ?component (C)?55 wt % wherein the amount ratio of each component is a weight percentage relative to the total amount of the components (A) to (C).

Abstract: A resin composition including the following components (A) to (C): (A) polyarylene sulfide resin: 20 wt %<component (A)?60 wt %; (B) hexagonal boron nitride: 8 wt %?component (B)?55 wt %; and (C) flat glass fiber: 15 wt % component?(C)?55 wt % wherein the amount ratio of each component is a weight percentage relative to the total amount of the components (A) to (C).

Abstract: To provide an insulating and thermally conductive resin composition from which a molded article having a high insulating properties and a high thermal conductivity can be produced and which is excellent in moldability, a molded article, and a method of producing the resin composition. The insulating and thermally conductive resin composition of the invention includes at least 30% by volume or more of a thermoplastic resin, 10 to 40% by volume of metallic aluminum type filler, and 5 to 25% by volume of a flame retardant. Particularly, addition of 1 to 10% by volume of a metal powder having a melting point of 500° C. or higher and 1 to 10% by volume of a low melting point alloy having a melting point of 500° C. or lower can provide more isotropic thermal conduction.

Abstract: The present invention provides a method for producing a prepreg from which a laminate stable and superior in quality can be obtained at low cost without air pollution and with saving of resources and energy, and further provides a method for producing the laminate. That is, the present invention provides a method for producing a prepreg, characterized in that a mechanical energy is applied to a mixture comprising a powdered thermosetting resin and a hardener as essential components to bring about a mechanochemical reaction, the resulting powdered resin composition, as it is, or with addition of a fine powder additive having an average particle size of 0.

Abstract: A process for producing an electrolessly plated molded article, which includes molding a resin composition made of a thermoplastic resin having a specific Izod impact strength and a Rockwell surface hardness and an inorganic filler, then treating the surface of the molded article with air blast using an abrasive having a sharp granular shape, and then conducting catalyst coating, activation treatment and electroless plating. It has been possible to apply the electroless plating with a high adhesion strength to the molded article of the thermoplastic resin composition without conducting the chemical etching treatment.

Abstract: A process for producing an electrolessly plated molded article, which includes molding a resin composition made of a thermoplastic resin having a specific Izod impact strength and a Rockwell surface hardness and an inorganic filler, then treating the surface of the molded article with air blast using an abrasive having a sharp granular shape, and then conducting catalyst coating, activation treatment and electroless plating. It has been possible to apply the electroless plating with a high adhesion strength to the molded article of the thermoplastic resin composition without conducting the chemical etching treatment.

Abstract: Provided is a polyarylene sulfide resin composition comprising (a) from 30 to 75% by mass of a polyarylene sulfide resin and (b) from 25 to 70% by mass of a filler, and containing (c) from 0.08 to 1.0 part by weight, relative to 100 parts by mass of the sum of (a) and (b), of an oxidized polyethylene wax having an acid value of at least 10 mg KOH/g and a dropping point of not higher than 120° C., or (d) from 0.1 to 1.0 part by weight relative to the same of a silicone oil having a viscosity at 25° C. of from 30 to 6,000 mm2/sec. The mold releasability of the moldings of the composition is improved, not interfering with the mechanical and chemical properties intrinsic to polyarylene sulfide resins.

Abstract: A process for producing an electrolessly plated molded article, which includes molding a resin composition made of a thermoplastic resin having a specific Izod impact strength and a Rockwell surface hardness and an inorganic filler, then treating the surface of the molded article with air blast using an abrasive having a sharp granular shape, and then conducting catalyst coating, activation treatment and electroless plating. It has been possible to apply the electroless plating with a high adhesion strength to the molded article of the thermoplastic resin composition without conducting the chemical etching treatment.

Abstract: A process for producing an electrolessly plated molded article, which includes molding a resin composition made of a thermoplastic resin having a specific Izod impact strength and a Rockwell surface hardness and an inorganic filler, then treating the surface of the molded article with air blast using an abrasive having a sharp granular shape, and then conducting catalyst coating, activation treatment and electroless plating. It has been possible to apply the electroless plating with a high adhesion strength to the molded article of the thermoplastic resin composition without conducting the chemical etching treatment.

Abstract: A polyarylene sulfide resin composition contains a polyarylene sulfide containing at least one group selected from a group consisting of an amino group and an amide group, a polyamide resin, an epoxy resin and, as needed, a filler. A further composition contains 100 parts by weight of the polyarylene sulfide, 0.05 to 5 parts of the epoxy resin, and 5 to 400 parts of the filler. Another type of the resin composition contains the polyarylene sulfide, the polyamide, a compound selected from an acid, an acid anhydride and an acid halide, each having in its molecule not less than two functional groups reactive with the amino group or the amide group, and, as needed, the filler. A further type of the resin composition contains the polyarylene sulfide, the compound and, as needed, an inorganic filler subjected to surface treatment with a silane type coupling agent. A still further type of the resin composition contains the polyarylene sulfide and the compound.

Abstract: A polyarylene sulfide resin composition contains a polyarylene sulfide containing at least one group selected from a group consisting of an amino group and an amide group, a polyamide resin, an epoxy resin and, as needed, a filler. A further composition contains 100 parts by weight of the polyarylene sulfide, 0.05 to 5 parts of the epoxy resin, and 5 to 400 parts of the filler. Another type of the resin composition contains the polyarylene sulfide, the polyamide, a compound selected from an acid, an acid anhydride and an acid halide, each having in its molecule not less than two functional groups reactive with the amino group or the amide group, and, as needed, the filler. A further type of the resin composition contains the polyarylene sulfide, the compound and, as needed, an inorganic filler subjected to surface treatment with a silane type coupling agent. A still further type of the resin composition contains the polyarylene sulfide and the compound.

Abstract: A polyarylene sulfide has an inherent viscosity [.eta..sub.i n h ] of 0.1 to 0.5 dl/g, a weight-average molecular weight of 1.times.10.sup.4 to 2.times.10.sup.5 ; a ratio of the inherent viscosity [.eta..sub.i n h ] to a calculated viscosity [.eta.].sub.calc ([.eta..sub.i n h /[.eta.].sub.calc) of 0.4/1 to 0.8/1; and a degree of whiteness of 50 or higher when measured in accordance with whiteness testing procedures (JIS P8123). The polyarylene sulfide is prepared by reaction by contacting at least one member of a metallic sulfide (A) selected from an alkali metal sulfide and an alkali metal hydrosulfide with a dihalogen aromatic compound (B) and an aromatic compound (C) having three or more than three functional groups in a polar solvent in a molar ratio of the dihalogen aromatic compound (B) to the metallic sulfide (A) [(B)/(A)] ranging from 1.035/1 to 1.300/1 and in a molar ratio of the aromatic compound (C) to the dihalogen aromatic compound (B) [(C)/(B)] ranging from 0.003/1 to 0.05/1.

Abstract: A polyarylene sulfide resin composition contains 30% to 75% by weight of a polyarylene sulfide resin (A), 15% to 70% by weight of a fiber reinforcement (B) containing silic acid as a major component and having an average fiber diameter of 15.mu.m or shorter and an average fiber length of 300 .mu.m or longer, and 1% to 25% by weight of a fiber reinforcement (C) containing Al.sub.2 O.sub.3 and SiO.sub.2 as major components in a ratio in weight of Al.sub.2 O.sub.3 to SiO.sub.2 ranging from 0.8 to 1 to 1.3 to 1 and having an average fiber diameter of 7 .mu.m or shorter and an average fiber length of 150 .mu.m or shorter. The composition is remarkable as molding material and a molded article resulting from the composition offers excellent mechanical strength and characteristics for metal plating. The metal-plated, molded article from the composition is particularly excellent in platability such as plate adhesion and plate gloss as well as short etching time.

Abstract: An epoxy resin composition for semiconductor sealing, comprising as essential components:(A) an epoxy resin,(B) a phenolic resin curing agent comprising 30-100% by weight, based on the total amount of the phenolic resin curing agent, of a silicone-modified phenolic resin curing agent obtained by reacting a phenolic resin with at least one of silicone compounds represented by the following formulas [I] and [II] ##STR1## wherein ##STR2## A: --R--COOH, ##STR3## or H, R: a lower alkylene group,10.ltoreq.N=l+m+n+2.ltoreq.200,0.ltoreq.m/N.ltoreq.0.1, and 5.ltoreq.N/n.ltoreq.50,(C) an inorganic filler, and(D) a curing accelerator.

Abstract: A polyarylene sulfide resin composition contains 30% to 75% by weight of a polyarylene sulfide resin (A), 15% to 70% by weight of a fiber reinforcement (B) containing silic acid as a major component and having an average fiber diameter of 15 .mu.m or shorter and an average fiber length of 300 .mu.m or longer, and 1% to 25% by weight of a fiber reinforcement (C) containing Al.sub.2 O.sub.3 and SiO.sub.2 as major components in a ratio in weight of Al.sub.2 O.sub.3 to SiO.sub.2 ranging from 0.8 to 1 to 1.3 to 1 and having an average fiber diameter of 7 .mu.m or shorter and an average fiber length of 150 .mu.m or shorter. The composition is remarkable as molding material and a molded article resulting from the composition offers excellent mechanical strength and characteristics for metal plating. The metal-plated, molded article from the composition is particularly excellent in platability such as plate adhesion and plate gloss as well as short etching time.