Abstract: This method is for conveying, in a processing system comprising at least one processing unit that performs a desired process on substrates and a conveyance unit that conveys the substrates to the processing unit, a plurality of substrates, which are to be continuously processed, from the conveyance unit to the processing unit. To each of the substrates, an adjustment value for optionally changing processing time is assigned in advance.

Abstract: A substrate processing apparatus is provided. The substrate processing apparatus for processing substrates includes a plurality of processing modules that perform predetermined processes on the substrates, and an information display that displays information about an error that occurred in the predetermined processes. The information display displays, in the same screen, a substrate on which a predetermined process in which the error occurred, a processing module which was performing the predetermined process in which the error occurred, the timing at which the error occurred, and a main cause of the error.

Abstract: A processing system 10 applies an etching process on a wafer W in a PM1 or PM2. An EC 200 includes functions of a transfer/process control unit 250, a communication unit 255, a log management unit 260, and a backup unit 265, and controls the processing system 10. The transfer/process control unit 250 controls wafer transfer and the etching process. The communication unit 255 transmits to or receives data from each MC 300 and the like. The log management unit 260 registers log information generated at times of the wafer process and transfer, data communication, and the like in log files (in predetermined storage areas of an HDD 215). The backup unit 265 collectively saves the log information stored in the log files in backup files (in other storage areas of the HDD 215), in response to a timing when an unexpected alarm has been generated.

Abstract: A processing system 10 applies an etching process on a wafer W in a PM1 or PM2. An EC 200 includes functions of a transfer/process control unit 250, a communication unit 255, a log management unit 260, and a backup unit 265, and controls the processing system 10. The transfer/process control unit 250 controls wafer transfer and the etching process. The communication unit 255 transmits to or receives data from each MC 300 and the like. The log management unit 260 registers log information generated at times of the wafer process and transfer, data communication, and the like in log files (in predetermined storage areas of an HDD 215). The backup unit 265 collectively saves the log information stored in the log files in backup files (in other storage areas of the HDD 215), in response to a timing when an unexpected alarm has been generated.