Abstract: A probe card 6 is produced by forming probe pins 2, each having a thin film portion 21, three-dimensionally on a substrate 1 having a concave portion 11 formed thereon, forming bumps 3 at base end portions of the probe pins 2, moving the substrate 1 to the probe card substrate 4 side while supporting the same by a flip-chip bonder, bonding the probe pins 2 to pads 42 on said probe card substrate 4 via the bumps 3, then, moving the substrate 1 to the side separating from the probe card substrate 4 by the flip-chip bonder and rupturing the probe pins 2 at adjacent portions of the thin film portions 21 to mechanically remove the substrate 1 from the probe pins 2.

Abstract: There is provided a method of manufacturing a probe card that electrically connects a testing device and a device under test to transmit a signal between the testing device and the device under test. The method includes the steps of forming a probe pin on a probe pin substrate, joining the probe pin held on the probe pin substrate to a circuit board, and cutting the probe pin to separate the probe pin substrate from the probe pin.

Abstract: There is provided a method of manufacturing a probe card that electrically connects a testing device and a device under test to transmit a signal between the testing device and the device under test. The method includes the steps of forming a probe pin on a probe pin substrate, joining the probe pin held on the probe pin substrate to a circuit board, and cutting the probe pin to separate the probe pin substrate from the probe pin.

Abstract: A method for manufacturing a probe card comprises the steps of forming a plurality of amorphous alloy layers of a predetermined shape at a predetermined substrate, wherein the amorphous alloy layer has a supercooled liquid temperature area, heating the amorphous alloy layer at the supercooled liquid temperature area, cooling the amorphous alloy layer at a temperature lower than the supercooled liquid temperature area and removing at least a part of the substrate in a state where the amorphous alloy layer is cooled at a temperature lower than the supercooled liquid temperature area.

Abstract: A probe card including a minute and highly accurate probe pin, including a probe pin electrically connecting with the electronic device; and a wiring substrate including a wiring electrically connecting with the probe pin. The probe pin includes: a first end electrically connecting with the wiring; a contact section extending from the first end to a direction away from the wiring substrate, the contact section being formed to oppose the wiring substrate and electrically connecting with the electronic device; a second end extending from the contact section and electrically connecting with the wiring; and a hollow section formed in an area sandwiched between the wiring substrate and the contact section.

Abstract: A sampler module is disclosed for use in a sampling waveform measurement device that samples subject signals and measures the waveform of the signals. The module is constructed by accommodating within a metal container: a laser diode driver circuit that receives laser drive sampling pulse signals from the outside and supplies pulse drive signals by a gain switching method, a laser diode that receives the drive signals from the LD driver circuit and generates optical probe pulse light, a sampling photoconductor that performs switching in accordance with irradiated light pulses and samples the subject signals, a condenser that focuses optical probe pulse light from the laser diode upon the photoconductor, and cooling temperature control means that maintains the temperature of the laser diode at a fixed temperature.