Patents by Inventor Wataru Okase
Wataru Okase has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8434522Abstract: There is provided a fluid control apparatus which can reduce the number of members and can improve the assembling operation efficiency. A pressure indication device 4 to be replaced with a relatively-higher frequency is coupled to a base block 5 existing thereunder through male screw members 17 from above. An on-off valve 6 to be replaced with a relatively-lower frequency has, at its lower portion, a block-shaped main body 6a formed integrally therewith. The main body 6a of the on-off valve 6 is coupled to the base block 5 through male screw members 18 in the forward and rearward directions.Type: GrantFiled: May 26, 2008Date of Patent: May 7, 2013Assignees: Tokyo Electron Limited, Fujikin IncorporatedInventors: Wataru Okase, Shuji Moriya, Tomohiro Nakata, Tsutomu Shinohara, Michio Yamaji
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Patent number: 8381755Abstract: A pressure type flow rate control reference allows the performance of flow rate calibrations of a flow rate controller on all types of gases, including corrosive gases, at low costs, and also has excellent flow rate control accuracy. The pressure type flow rate control reference includes a pressure controller for adjusting the pressure of a calibration gas from a calibration gas supply source, a first volume provided on the downstream side of a pressure controller, a first connection mouth of an uncalibrated flow rate controller provided on the downstream side of the first volume, a reference pressure type flow rate controller connected to a second connection mouth on the downstream side of the uncalibrated flow rate controller, a second volume provided on the downstream side of a reference pressure type flow rate controller, and an evacuation device provided on the downstream side of the second volume.Type: GrantFiled: May 30, 2012Date of Patent: February 26, 2013Assignees: Fujikin Incorporated, Tokyo Electron LimitedInventors: Shuji Moriya, Wataru Okase, Tsutomu Shinohara, Nobukazu Ikeda, Michio Yamaji, Yasutaka Hayashi, Toshihide Yoshida, Yasuyuki Omata
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Publication number: 20120234406Abstract: A pressure type flow rate control reference allows the performance of flow rate calibrations of a flow rate controller on all types of gases, including corrosive gases, at low costs, and also has excellent flow rate control accuracy. The pressure type flow rate control reference includes a pressure controller for adjusting the pressure of a calibration gas from a calibration gas supply source, a first volume provided on the downstream side of a pressure controller, a first connection mouth of an uncalibrated flow rate controller provided on the downstream side of the first volume, a reference pressure type flow rate controller connected to a second connection mouth on the downstream side of the uncalibrated flow rate controller, a second volume provided on the downstream side of a reference pressure type flow rate controller, and an evacuation device provided on the downstream side of the second volume.Type: ApplicationFiled: May 30, 2012Publication date: September 20, 2012Applicants: TOKYO ELECTRON LIMITED, FUJIKIN INCORPORATEDInventors: Shuji Moriya, Wataru Okase, Tsutomu Shinohara, Nobukazu Ikeda, Michio Yamaji, Yasutaka Hayashi, Toshihide Yoshida, Yasuyuki Omata
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Patent number: 8210022Abstract: A pressure type flow rate control reference allows the performance of flow rate calibrations of a flow rate controller on all types of gases, including corrosive gases, at low costs, and also has excellent flow rate control accuracy. The pressure type flow rate control reference includes a pressure controller for adjusting the pressure of a calibration gas from a calibration gas supply source, a first volume provided on the downstream side of a pressure controller, a first connection mouth of an uncalibrated flow rate controller provided on the downstream side of the first volume, a reference pressure type flow rate controller connected to a second connection mouth on the downstream side of the uncalibrated flow rate controller, a second volume provided on the downstream side of a reference pressure type flow rate controller, and an evacuation device provided on the downstream side of the second volume.Type: GrantFiled: December 11, 2008Date of Patent: July 3, 2012Assignees: Fujikin Incorporated, Tokyo Electron LimitedInventors: Shuji Moriya, Wataru Okase, Tsutomu Shinohara, Nobukazu Ikeda, Michio Yamaji, Yasutaka Hayashi, Toshihide Yoshida, Yasuyuki Omata
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Publication number: 20100096031Abstract: There is provided a fluid control apparatus which can reduce the number of members and can improve the assembling operation efficiency. A pressure indication device 4 to be replaced with a relatively-higher frequency is coupled to a base block 5 existing thereunder through male screw members 17 from above. An on-off valve 6 to be replaced with a relatively-lower frequency has, at its lower portion, a block-shaped main body 6a formed integrally therewith. The main body 6a of the on-off valve 6 is coupled to the base block 5 through male screw members 18 in the forward and rearward directions.Type: ApplicationFiled: May 26, 2008Publication date: April 22, 2010Applicant: TOKYO ELECTRON LIMITEDInventors: Wataru Okase, Shuji Moriya, Tomohiro Nakata, Tsutomu Shinohara, Michio Yamaji
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Publication number: 20090146089Abstract: A pressure type flow rate control reference which allows performance of flow rate calibrations of a flow rate controller on all types of gases, including corrosive gases, at low costs, and also has excellent flow rate control accuracy. The pressure type flow rate control reference includes a pressure controller for adjusting the pressure of a calibration gas from a calibration gas supply source, a first volume provided on the downstream side of a pressure controller, a first connection mouth of an uncalibrated flow rate controller provided on the downstream side of the first volume, a reference pressure type flow rate controller connected to a second connection mouth on the downstream side of the uncalibrated flow rate controller, a second volume provided on the downstream side of a reference pressure type flow rate controller, and an evacuation device provided on the downstream side of the second volume.Type: ApplicationFiled: December 11, 2008Publication date: June 11, 2009Applicants: FUJIKIN INCORPORATED, TOKYO ELECTRON LIMITEDInventors: Shuji Moriya, Wataru Okase, Tsutomu Shinohara, Nobukazu Ikeda, Michio Yamaji, Yasutaka Hayashi, Toshihide Yoshida, Yasuyuki Omata
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Publication number: 20070187868Abstract: A pasting method and a pasting apparatus hold a thin plate 1 and a planar member 2 in high flatness respectively on a first holding member 44 and a second holding member 44, a main controller 40a controls a moving mechanism 45 and a parallelism adjusting mechanism 52 on the basis of information provided by position recognizing mechanisms 33 and 34 to align the thin plate 1 and the carrying member 2 with each other in a predetermined positional relation. The main controller 40a controls a moving mechanism 45 so as to move the thin plate 1 and the carrying member 2 relative to each other in a state where a liquid-phase liquid crystal wax heated by a heater 49 is held between the thin plate 1 and the carrying member 2 to spread the liquid-phase liquid crystal wax over the entire surfaces of the thin plate 1 and the carrying member 2.Type: ApplicationFiled: July 14, 2004Publication date: August 16, 2007Inventors: Tsuyoshi Aruga, Junichi Hagihara, Wataru Okase, Eiji Yamaguchi
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Patent number: 7112268Abstract: A plating device and a plating method are provided that are capable of enhancing uniformity in plating on a treatment surface of an object to be treated.Type: GrantFiled: February 20, 2002Date of Patent: September 26, 2006Assignee: Tokyo Electron LimitedInventors: Wataru Okase, Takenobu Matsuo
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Patent number: 6953522Abstract: A contact is disposed to come into contact with a metal layer formed on a substrate being treated, the contact being in contact with a surface being treated from an opposite surface through a through hole present in a substrate. Alternatively, a contact is disposed to come into contact with a metal layer formed on a substrate, the contact coming into contact at an approximate center of the substrate. Alternatively, a plurality of needle bodies are disposed to be in electrical contact with a metal layer of a substrate being treated, thereby power supply for electrolytic polishing/plating to a substrate being treated being implemented, without restricting to a periphery of a substrate, from a plurality of points on a surface thereof. Due to any one of these, liquid treatment equipment enables to improve uniformity in plane of an electric current sent to a surface being treated and of liquid treatment.Type: GrantFiled: May 7, 2001Date of Patent: October 11, 2005Assignee: Tokyo Electron LimitedInventors: Kyungho Park, Wataru Okase, Takenobu Matsuo
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Patent number: 6949719Abstract: A thermal insulator can change a heat insulation characteristic partially with a simple structure. The thermal insulator is divided into a plurality of parts in accordance with a temperature of a heat source which is insulated by the thermal insulator. The plurality of parts are formed of different honeycomb structures, respectively, so as to provide different heat insulation characteristics. The plurality of parts may be formed by different materials, or a shape or dimension such as a cell pitch of the honeycomb structure may be varied. Heat is collected from air within the honeycomb cells, and is transferred to other parts for heating.Type: GrantFiled: April 26, 2004Date of Patent: September 27, 2005Assignee: Tokyo Electron LimitedInventors: Osamu Suenaga, Wataru Okase, Takenobu Matsuo
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Publication number: 20040195230Abstract: A thermal insulator can change a heat insulation characteristic partially with a simple structure. The thermal insulator is divided into a plurality of parts in accordance with a temperature of a heat source which is insulated by the thermal insulator. The plurality of parts are formed of different honeycomb structures, respectively, so as to provide different heat insulation characteristics. The plurality of parts may be formed by different materials, or a shape or dimension such as a cell pitch of the honeycomb structure may be varied. Heat is collected from air within the honeycomb cells, and is transferred to other parts for heating.Type: ApplicationFiled: April 26, 2004Publication date: October 7, 2004Applicant: Tokyo Electron LimitedInventors: Osamu Suenaga, Wataru Okase, Takenobu Matsuo
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Patent number: 6756565Abstract: A thermal insulator can change a heat insulation characteristic partially with a simple structure. The thermal insulator is divided into a plurality of parts in accordance with a temperature of a heat source which is insulated by the thermal insulator. The plurality of parts are formed of different honeycomb structures, respectively, so as to provide different heat insulation characteristics. The plurality of parts may be formed by different materials, or a shape or dimension such as a cell pitch of the honeycomb structure may be varied. Heat is collected from air within the honeycomb cells, and is transferred to other parts for heating.Type: GrantFiled: December 27, 2001Date of Patent: June 29, 2004Assignee: Tokyo Electron LimitedInventors: Osamu Suenaga, Wataru Okase, Takenobu Matsuo
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Patent number: 6740164Abstract: Plating apparatus and plating method that can plate more uniformly on a processing surface of a workpiece are provided. The plating apparatus is comprised of a plating solution bathe which is provided with a first electrode held in a state soaked in a plating solution; a workpiece holding mechanism which holds a workpiece to contact its processing surface to the plating solution; and a contact member, disposed in the workpiece holding mechanism, that electrically contacts with the circumferential edge of the workpiece so to form a conductive layer on the workpiece surface as a second electrode. The contact member is divided along the circumferential direction of the workpiece with which they are electrically contacted. Thus, even if the contact resistance between each section of the contact member with the workpiece is variable, it is possible to adjust the plating electric current for each section of the contact member.Type: GrantFiled: January 30, 2002Date of Patent: May 25, 2004Assignee: Tokyo Electron LimitedInventors: Wataru Okase, Takenobu Matsuo
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Publication number: 20040074763Abstract: A plating device and a plating method are provided that are capable of enhancing uniformity in plating on a treatment surface of an object to be treated.Type: ApplicationFiled: August 21, 2003Publication date: April 22, 2004Inventors: Wataru Okase, Takenobu Matsuo
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Patent number: 6716329Abstract: A plating system is composed of a transfer device for performing transfer of a wafer, a plating unit and a washing/drying unit provided around the transfer device. Each unit is structured to be detachable from the plating system. The plating unit is divided into a wafer transfer section and a plating section by a separator, and atmosphere of each section is independently set.Type: GrantFiled: May 1, 2001Date of Patent: April 6, 2004Assignee: Tokyo Electron LimitedInventors: Wataru Okase, Takenobu Matsuo
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Publication number: 20040053509Abstract: A plating system includes a housing forming an outer face thereof. The housing is composed of a frame and a plurality of panels fitted into the frame. Heat contraction is utilized to cover the frame and the panels with synthetic resin films.Type: ApplicationFiled: July 11, 2003Publication date: March 18, 2004Inventors: Wataru Okase, Jun Yamauchi, Takenobu Matsuo
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Patent number: 6641709Abstract: A mist trap mechanism and method for a plating apparatus, which can provide an improved mist removing effect by a simple structure, are provided. A gas discharge passage is formed to connect the space in a plating chamber and space outside of the plating chamber and provided with a liquid spouting portion and a solid wall. The discharge gas collides with the liquid spouted from the liquid spouting portion, and the discharge gas collides with the solid wall which has its surface wetted with the liquid spouted from the liquid spouting portion. Such a two-staged collision of the discharge gas effectively takes the mist contained in the discharge gas into the liquid. A liquid recovery portion is disposed in connection with the gas discharge passage to collectively catch the mist in a state captured by the liquid.Type: GrantFiled: November 8, 2002Date of Patent: November 4, 2003Assignee: Tokyo Electron LimitedInventors: Wataru Okase, Koichiro Kimura, Takenobu Matsuo
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Patent number: 6634370Abstract: Liquid treatment units are disposed in multi-tiers surrounding a main-arm 35. Among liquid treatment units, plating units M1 through M4 are disposed on a lower tier side, and a unit for post-treatment process such as a cleaning unit 70 where a cleaner atmosphere is necessary is disposed on an upper tier side. Thereby, an improvement in an area efficiency and the formation and maintenance of a clean atmosphere can be simultaneously obtained.Type: GrantFiled: May 7, 2001Date of Patent: October 21, 2003Assignee: Tokyo Electron LimitedInventors: Satoshi Nakashima, Wataru Okase, Takenobu Matsuo, Tameyasu Hyakuzuka, Yasushi Yagi, Yoshiyuki Harima, Jun Yamauchi, Hiroki Taniyama, Kyungho Park, Yoshitsugu Tanaka, Yoshinori Kato, Hiroshi Sato
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Publication number: 20030141016Abstract: In an exhaust system for a processing apparatus wherein a processing gas is used to subject a semiconductor wafer W to be processed to a predetermined processing, a vacuum exhaust pathway 40 having a vacuum pump 42 is connected to the processing apparatus 20. A trap mechanism 52 for removing reaction products that flow into the vacuum exhaust pathway 40 is provided within the vacuum exhaust pathway 40, via disconnectable connection flanges 78 and 86 on the upstream side of the vacuum pump 42. An upstream-side inlet portion and an outlet portion of this trap mechanism 52 are provided with isolation valves 80 and 88 that can place the interior of the trap mechanism in a hermetically sealed state when necessary. A bypass pathway 54 is provided to allow a cleaning gas to bypass the trap mechanism 52 during the cleaning of the processing apparatus 20.Type: ApplicationFiled: January 30, 2003Publication date: July 31, 2003Inventors: Wataru Okase, Noriaki Matsushima, Akihiko Tsukada, Akihiko Hiroe, Kouji Shimomura
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Publication number: 20030094372Abstract: A mist trap mechanism and method for a plating apparatus, which can provide an improved mist removing effect by a simple structure, are provided. A gas discharge passage is formed to connect the space in a plating chamber and space outside of the plating chamber and provided with a liquid spouting portion and a solid wall. The discharge gas collides with the liquid spouted from the liquid spouting portion, and the discharge gas collides with the solid wall which has its surface wetted with the liquid spouted from the liquid spouting portion. Such a two-staged collision of the discharge gas effectively takes the mist contained in the discharge gas into the liquid. A liquid recovery portion is disposed in connection with the gas discharge passage to collectively catch the mist in a state captured by the liquid.Type: ApplicationFiled: November 8, 2002Publication date: May 22, 2003Inventors: Wataru Okase, Koichiro Kimura, Takenobu Matsuo