Patents by Inventor Wataru Soejima

Wataru Soejima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesive of epoxy resin, carboxylated rubber aromatic amine and dicyandiamide
    Patent number: 5859155
    Abstract: There is provided an adhesive composition for use in a flexible printed circuit board, comprising:(a) an epoxy resin having substantially at least two epoxy groups per molecule;(b) at least one selected from carboxyl group-containing nitrile rubber and carboxyl group-containing hydrogenated nitrile rubber; and(c) a curing agent which comprises aromatic amine having substantially at least two primary amino groups per molecule (c1) and dicyandiamide (c2), the molar ratio of the aromatic amine (c1) to the dicyandiamide (c2) being 35/65.ltoreq.(c1)/(c2).ltoreq.99/1.
    Type: Grant
    Filed: May 19, 1997
    Date of Patent: January 12, 1999
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Toshikazu Furihata, Akio Ikeda, Wataru Soejima