Patents by Inventor Wataru SUGITA

Wataru SUGITA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11940761
    Abstract: A manufacturing method includes a first repeating step of irradiating a base material with a pulse laser, having a spot diameter S, while relatively moving a laser head and the base material in a first direction, moving the laser head by a predetermined pitch width P in a second direction that intersects the first direction, and repeating irradiation by the pulse laser along the first direction and movement of the laser head in the second direction, and a second repeating step of irradiating the base material with the pulse laser while relatively moving the laser head and the base material in the second direction, moving the laser head by the pitch width in the first direction, and repeating irradiation by the pulse laser along the second direction and movement of the laser head in the first direction, wherein S<P<100 ?m.
    Type: Grant
    Filed: August 23, 2021
    Date of Patent: March 26, 2024
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Wataru Uehara, Yuki Takishita, Ai Yoshinaga, Atsuhiko Sugita
  • Publication number: 20230335417
    Abstract: The wafer cleaning water supply system of the present invention has a wafer cleaning water production unit producing wafer cleaning water having a chemical agent, a replenishment pipe extending from the wafer cleaning water production unit, and a circulation-type cleaning water supply pipe connected to the replenishment pipe. The circulation-type cleaning water supply pipe feeds a liquid to a use point via a feeding pump and is provided with a supply-side flowmeter and a recovery-side flowmeter. The measurement results of the supply-side and recovery-side flowmeters and the water quality data obtained by a monitor of a sampling pipe for monitoring are transmitted to a control device, which controls the wafer cleaning water production unit. With such a configuration, the wafer cleaning water supply system involves a small amount of excess water, dissolved gas is less likely to be mixed with the wafer cleaning water, and space-saving is possible.
    Type: Application
    Filed: September 22, 2021
    Publication date: October 19, 2023
    Applicant: KURITA WATER INDUSTRIES LTD.
    Inventor: Wataru SUGITA
  • Publication number: 20220184571
    Abstract: Dilute chemical solution production device has a plunger pump and a chemical solution supply pipe that supply a chemical solution from a chemical solution reservoir. The end of the chemical solution supply pipe serves as an injection point for the chemical solution. The chemical solution supply pipe is inserted to an approximately central position in the radial direction of an ultrapure water passage, which is a first pipe, via a bore-through joint. Conductivity meter as a conductivity measuring means is provided on the downstream side of the bore-through joint, which serves as the injection point, and is connected to the previously described control means so that the plunger pump can be controlled in accordance with the measured value of the conductivity meter. The dilute chemical solution production device is capable of producing, with a simple structure, a dilute chemical solution having an extremely low concentration of acid/alkali or the like.
    Type: Application
    Filed: February 18, 2020
    Publication date: June 16, 2022
    Applicant: KURITA WATER INDUSTRIES LTD.
    Inventors: Wataru SUGITA, Yuichi OGAWA