Abstract: A manufacturing method includes a first repeating step of irradiating a base material with a pulse laser, having a spot diameter S, while relatively moving a laser head and the base material in a first direction, moving the laser head by a predetermined pitch width P in a second direction that intersects the first direction, and repeating irradiation by the pulse laser along the first direction and movement of the laser head in the second direction, and a second repeating step of irradiating the base material with the pulse laser while relatively moving the laser head and the base material in the second direction, moving the laser head by the pitch width in the first direction, and repeating irradiation by the pulse laser along the second direction and movement of the laser head in the first direction, wherein S<P<100 ?m.

Abstract: The wafer cleaning water supply system of the present invention has a wafer cleaning water production unit producing wafer cleaning water having a chemical agent, a replenishment pipe extending from the wafer cleaning water production unit, and a circulation-type cleaning water supply pipe connected to the replenishment pipe. The circulation-type cleaning water supply pipe feeds a liquid to a use point via a feeding pump and is provided with a supply-side flowmeter and a recovery-side flowmeter. The measurement results of the supply-side and recovery-side flowmeters and the water quality data obtained by a monitor of a sampling pipe for monitoring are transmitted to a control device, which controls the wafer cleaning water production unit. With such a configuration, the wafer cleaning water supply system involves a small amount of excess water, dissolved gas is less likely to be mixed with the wafer cleaning water, and space-saving is possible.

Abstract: Dilute chemical solution production device has a plunger pump and a chemical solution supply pipe that supply a chemical solution from a chemical solution reservoir. The end of the chemical solution supply pipe serves as an injection point for the chemical solution. The chemical solution supply pipe is inserted to an approximately central position in the radial direction of an ultrapure water passage, which is a first pipe, via a bore-through joint. Conductivity meter as a conductivity measuring means is provided on the downstream side of the bore-through joint, which serves as the injection point, and is connected to the previously described control means so that the plunger pump can be controlled in accordance with the measured value of the conductivity meter. The dilute chemical solution production device is capable of producing, with a simple structure, a dilute chemical solution having an extremely low concentration of acid/alkali or the like.