Abstract: A non-curable thermal-conductive silicone composition contains essential components of: (A) an organopolysiloxane having a kinematic viscosity at 25° C. of 1,000,000 mm2/s or more in an amount of 5 to 20 mass % relative to a sum of the component (A) and a component (B); (B) a hydrolysable organopolysiloxane compound shown by the following general formula (1) in an amount of 80 to 95 mass % relative to the sum of the components (A) and (B); and (C) a heat conductive filler in an amount of 10 to 95 mass % relative to a total amount of the composition. A mixture of the components (A) and (B) has a molecular weight distribution Mw/Mn of 10 or more. R1 represents a monovalent hydrocarbon group having 1 to 10 carbon atoms optionally having a substituent. “m” represents an integer of 5 to 100.

Abstract: This silicone composition contains (A) an organopolysiloxane which has at least two aliphatic unsaturated hydrocarbon groups per molecule and has a kinematic viscosity at 25° C. of 60-100,000 mm2/s, (B) an organohydrogenpolysiloxane represented by general formula (I) (R1 is an alkyl group having 1-6 carbon atoms, R2 is R1 or a hydrogen atom, n is an integer between 2 and 40, m is an integer between 0 and 98, and the value of n+m is such that 5?n+m?100), (C) a flaky graphite powder having an average thickness of 100 nm or less, (D) a thermally conductive filler having a thermal conductivity of 10 W/m·° C. or more, (E) a platinum group metal catalyst and (G) a slightly volatile isoparaffin compound which has a boiling point of 160-360° C. and which can disperse or dissolve the component (A) and the component (B). This silicone composition can give a silicone grease having a higher thermal conductivity and better handleability than conventional silicone greases.

Abstract: The present invention is a thermal conductive silicone composition comprises (C) one or more aluminum nitride particles selected from an irregular-shaped, a round, and a polyhedral particles having an average particle size of 4 µm or more and less than 50 µm; (D) one or more aluminum nitride particles selected from an irregular-shaped, a round, and a polyhedral particles having an average particle size of 50 µm or more and 150 µm or less; and (E) an inorganic particle having an average particle size of 0.1 µm or more and less than 4.0 µm. This provides a thermal conductive silicone composition ensuring both high thermal conductivity and shift resistance.

Abstract: A thermal conductive silicone composition includes: (A) an organopolysiloxane having kinematic viscosity at 25° C. of 10 to 100,000 mm2/s; (B) a hydrolysable organopolysiloxane containing an alkoxysilyl group; (C) a heat conductive filler with average particle size of 4 to 30 ?m containing a coarse particle with particle size of 45 ?m or more in an amount of 0.5 mass % or less in the entire component (C), and an irregular-shaped zinc oxide particle in an amount of 40 to 90 mass % in the entire composition; and (D) an irregular-shaped zinc oxide particle having average particle size of 0.01 to 2 ?m in an amount of 1 to 50 mass % in the entire composition, wherein the thermal conductivity of the silicone composition is 2.0 W/m·K or more and less than 7.0 W/m·K, and the viscosity at 25° C. is 5 to 800 Pa·s.

Abstract: Provided is a silicone composition that has high thermal conductivity and favorable adhesion. A silicone composition that contains (A) 50-99.9 parts by mass of an organopolysiloxane that has at least two aliphatic unsaturated hydrocarbon groups per molecule thereof and has a kinematic viscosity of 60-100,000 mm2/s at 25° C., (B) 0.1-50 parts by mass of a silicone resin that has at least one aliphatic unsaturated hydrocarbon group per molecule thereof (provided that the total of components (A) and (B) is 100 parts by mass), (C) an organohydrogen polysiloxane, (D) 0.01-10.0 parts by mass of an organic peroxide that has a ten-hour half-life temperature of at least 40° C. per 100 total parts by mass of components (A) and (B), and (E) 100-3,000 parts by mass of a thermally conductive filler that has a thermal conductivity of at least 10 W/(m·° C.) per 100 total parts by mass of components (A) and (B).

Abstract: A thermal-conductive silicone composition containing (A) 0.5 to 2.5 mass % of a crosslinked silicone gel containing (a) an organopolysiloxane having at least two aliphatic unsaturated hydrocarbon groups per molecule, and having a kinematic viscosity at 25° C. of 10,000,000 mm2/s or more, and (b) an organohydrogenpolysiloxane having two or more silicon-bonded hydrogen atoms per molecule; (B) 12.5 to 19.5 mass % of a hydrolysable organopolysiloxane compound; and (C) 80 to 85 mass % of aluminum nitride particles having an average particle size of 0.5 pm or more and 1.5 pm or less. A content of coarse particles in the aluminum nitride particles is 1.0 volume % or less relative to the whole. The coarse particles are 10 pm or more in a particle size distribution by laser diffraction. A thermal-conductive silicone composition has excellent coating workability and favorable pumping-out resistance, and is capable of attaining low thermal resistance by being thinly compressed.

Abstract: A thermal-conductive silicone composition containing: (A) a hydrolysable organopolysiloxane having an alkoxysilyl group; and (B) aluminum nitride particles having an average particle size of 0.5 ?m or more and 2.0 ?m or less and contained in an amount of 50 to 70 volume %. A content of coarse particles in the aluminum nitride particles is 1.0 volume % or less relative to the entire aluminum nitride particles, the coarse particles having particle sizes of 10 ?m or more according to a particle size distribution measurement method by laser diffraction. The thermal-conductive silicone composition has a heat conductivity of 1.3 W/mK or more according to a hot disc method. The present invention provides: a thermal-conductive silicone composition having high heat conductivity and being compressible to 10 ?m or less; and a production method of the thermal-conductive silicone composition.

Abstract: A non-curable thermal-conductive silicone composition contains essential components of: (A) an organopolysiloxane having a kinematic viscosity at 25° C. of 1,000,000 mm2/s or more in an amount of 5 to 20 mass % relative to a sum of the component (A) and a component (B); (B) a hydrolysable organopolysiloxane compound shown by the following general formula (1) in an amount of 80 to 95 mass % relative to the sum of the components (A) and (B); and (C) a heat conductive filler in an amount of 10 to 95 mass % relative to a total amount of the composition. A mixture of the components (A) and (B) has a molecular weight distribution Mw/Mn of 10 or more. R1 represents a monovalent hydrocarbon group having 1 to 10 carbon atoms optionally having a substituent. “m” represents an integer of 5 to 100.

Abstract: This silicone composition contains (A) an organopolysiloxane which has at least two aliphatic unsaturated hydrocarbon groups per molecule and has a kinematic viscosity at 25° C. of 60-100,000 mm2/s, (B) an organohydrogenpolysiloxane represented by general formula (I) (R1 is an alkyl group having 1-6 carbon atoms, R2 is R1 or a hydrogen atom, u is an integer between 2 and 40, m is an integer between 0 and 98, and the value of n+m is such that 5?n+m?100), (C) a flaky graphite powder having an average thickness of 100 nm or less, (D) a thermally conductive filler having a thermal conductivity of 10 W/m·° C. or more, (E) a platinum group metal catalyst and (G) a slightly volatile isoparaffin compound which has a boiling point of 160-360° C. and which can disperse or dissolve the component (A) and the component (B). This silicone composition can give a silicone grease having a higher thermal conductivity and better handleability than conventional silicone greases.

Abstract: Provided is a silicone composition that has high thermal conductivity and favorable adhesion. A silicone composition that contains (A) 50-99.9 parts by mass of an organopolysiloxane that has at least two aliphatic unsaturated hydrocarbon groups per molecule thereof and has a kinematic viscosity of 60-100,000 mm2/s at 25° C., (B) 0.1-50 parts by mass of a silicone resin that has at least one aliphatic unsaturated hydrocarbon group per molecule thereof (provided that the total of components (A) and (B) is 100 parts by mass), (C) an organohydrogen polysiloxane, (D) 0.01-10.0 parts by mass of an organic peroxide that has a ten-hour half-life temperature of at least 40° C. per 100 total parts by mass of components (A) and (B), and (E) 100-3,000 parts by mass of a thermally conductive filler that has a thermal conductivity of at least 10 W/(m·° C.) per 100 total parts by mass of components (A) and (B).