Patents by Inventor Wataru Yago

Wataru Yago has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090321268
    Abstract: The present invention is an electrodeposited film substantially containing no lead, characterized by applying an alloy layer or a simple metal layer with an Hv value of not less than 60 to an under layer, and an alloy layer or a simple metal layer with an Hv value of not more than 40 to an upper layer. This electrodeposited film is harmless to the human body and the environment, and superior in sliding properties.
    Type: Application
    Filed: February 13, 2007
    Publication date: December 31, 2009
    Inventors: Kunio Nakashima, Wataru Yago, Kenichi Ichida, Kazuo Takeuchi, Tokumi Ikeda, Kunio Nakaniwa
  • Patent number: 7361395
    Abstract: A synchronizer ring 1 has an annular ring body 2; a friction material 4 joined integrally to a cylindrical inner peripheral surface 3 of the ring body 2; a conical surface 5 formed on an inner surface of the friction material 4; and a plurality of annular grooves 6 formed in the conical surface 5 of the friction material 4.
    Type: Grant
    Filed: June 7, 2004
    Date of Patent: April 22, 2008
    Assignees: Oiles Corporation, Chuetsu Metal Works Co., Ltd.
    Inventors: Takashi Nakamaru, Satoshi Takamura, Kunio Nakashima, Wataru Yago, Kenichi Ichida, Atsushi Yasukawa, Shigeyuki Aburatani
  • Patent number: 7067068
    Abstract: A lead-containing copper-based alloy is immersed into a weak acidic or neutral etching solution having a buffer effect which is formed by adding an organic acid into a complexing agent having a high ability to form a complexing ion with lead, and lead particles present on the surface of the lead-containing copper-based alloy are then removed. The complexing agent is one of an organic ammonium salt such as ammonium acetate, or ammonium citrate, or may be an organic sodium salt such as sodium acetate, sodium tartrate, and sodium citrate. Preferably, an immersion temperature of the alloy to the etching solution falls within a range of from 10 to 50° C. The etching solution is agitated with oxygen or a gas containing oxygen blown thereinto during the immersion of the alloy into the etching solution. An extremely low voltage of ?0.3 to +0.2 V vs. NHE is applied from outside to the lead-containing copper-based alloy as an anode.
    Type: Grant
    Filed: September 13, 2002
    Date of Patent: June 27, 2006
    Assignee: Chuetsu Metal Works Co., Ltd.
    Inventors: Sumiko Sanuki, Kunio Nakashima, Ryouichi Ishigane, Wataru Yago, Kenichi Ichida, Atsushi Yasukawa, Kazuo Takeuchi
  • Publication number: 20060121235
    Abstract: A synchronizer ring 1 has an annular ring body 2; a friction material 4 joined integrally to a cylindrical inner peripheral surface 3 of the ring body 2; a conical surface 5 formed on an inner surface of the friction material 4; and a plurality of annular grooves 6 formed in the conical surface 5 of the friction material 4.
    Type: Application
    Filed: June 7, 2004
    Publication date: June 8, 2006
    Inventors: Takashi Nakamaru, Satoshi Takamura, Kunio Nakashima, Wataru Yago, Kenichi Ichida, Atsushi Yasukawa, Shigeyuki Aburatani
  • Publication number: 20060099443
    Abstract: The present invention is an electrodeposited film substantially containing no lead, characterized by applying an alloy layer or a simple metal layer with an Hv value of not less than 60 to an under layer, and an alloy layer or a simple metal layer with an Hv value of not more than 40 to an upper layer. This electrodeposited film is harmless to the human body and the environment, and superior in sliding properties.
    Type: Application
    Filed: January 14, 2004
    Publication date: May 11, 2006
    Inventors: Kunio Nakashima, Wataru Yago, Kenichi Ichida, Kazuo Takeuchi, Tokumi Ikeda, Kunio Nakaniwa
  • Publication number: 20030136764
    Abstract: A lead-containing copper-based alloy is immersed into a weak acidic or neutral etching solution having a buffer effect which is formed by adding an organic acid into a complexing agent having a high ability to form a complexing ion with lead, and lead particles present on the surface of the lead-containing copper-based alloy are then removed. The complexing agent is one of an organic ammonium salt such as ammonium acetate, or ammonium citrate, or may be an organic sodium salt such as sodium acetate, sodium tartrate, and sodium citrate. Preferably, an immersion temperature of the alloy to the etching solution falls within a range of from 10 to 50° C. The etching solution is agitated with oxygen or a gas containing oxygen blown thereinto during the immersion of the alloy into the etching solution. An extremely low voltage of −0.3 to +0.2 V vs. NHE is applied from outside to the lead-containing copper-based alloy as an anode.
    Type: Application
    Filed: September 13, 2002
    Publication date: July 24, 2003
    Inventors: Sumiko Sanuki, Kunio Nakashima, Ryouichi Ishigane, Wataru Yago, Kenichi Ichida, Atsushi Yasukawa, Kazuo Takeuchi
  • Patent number: 6419766
    Abstract: A cutting-free bronze alloy which is substantially free of lead contains 1 to 13 wt. % of tin, not larger than 18 wt. % of zinc, 0.5 to 6 wt. % of bismuth, 0.05 to 3 wt. % of antimony, not larger than 1 wt. % of phosphorus, less than 0.4 wt. % of lead, and the balance being copper. The alloy may further contain 0.1 to 3 wt. % of nickel. When 3 to 8 wt. % of tin and 6 to 10 wt. % of zinc are present, the alloy is particularly suitable for use as a plumbing faucet and fixture. Likewise, when 8.5 to 13 wt. % of tin and not larger than 1 wt. % of zinc are present, the alloy is suitable for use as a sliding member.
    Type: Grant
    Filed: November 28, 2000
    Date of Patent: July 16, 2002
    Assignees: Tabuchi Corp., Chuetsu Metal Works Co., Ltd.
    Inventors: Yukinori Ikemiya, Hideki Yoshimura, Kenji Sugiyama, Kunio Nakashima, Masao Hosoda, Wataru Yago, Kazuyuki Inagaki
  • Patent number: 5582281
    Abstract: In a synchronizer ring that is a part of an automobile transmission, a ring body is made of an iron material and a sliding member is made of a wear-resistant copper alloy having the following chemical components, matrix and rigidity, characterized in that the ring body and sliding member are bonded to each other by way of hot working. (1) a wear-resistant copper alloy containing Zn of 22 to 45 wt %, at least one kind of metal elements of 0.1 to 15 wt % which are selected from a metal element group of Al, Mn, Fe, Pb, Ni, Be, Si, Co, Cr, Ti, Nb, V, Zr, Mo, Sn, Bi, B etc. and the remnant composed of Cu and impurities. (2) The wear-resistant copper alloy has a matrix of .alpha. phase+.beta. phase, .beta. phase alone or .beta. phase+.gamma. phase. (3) HRB (Hardness Rockwell B) value is more than 80.
    Type: Grant
    Filed: July 19, 1994
    Date of Patent: December 10, 1996
    Assignee: Chuetsu Metal Works Co., Ltd.
    Inventors: Kunio Nakashima, Masao Hosoda, Kunihiro Uraki, Wataru Yago, Atsushi Yasukawa
  • Patent number: 5326646
    Abstract: A synchronizer ring comprises a ring body having a sliding portion, and a directly spray-coated wear-resistant film formed on a surface of the sliding portion. The film is made of a wear-resistant brass alloy which comprises Cu, Zn and at least one element selected from the group consisting of Al, Mn, Fe, Ni, Si, Co, Cr, Ti, Nb, V, Zr and Mo. The spray-coated film exhibits good wear resistance and good bonding strength.
    Type: Grant
    Filed: December 4, 1992
    Date of Patent: July 5, 1994
    Assignee: Chuetsu Metal Works Co., Ltd.
    Inventors: Kunio Nakashima, Masao Hosoda, Wataru Yago, Kazuyuki Inagaki
  • Patent number: 5282908
    Abstract: A Mn-Si-Co-Fe-based high-strength brass alloy comprises, on the weight basis, 15 to 25% of Zn, 1.0 to 5.0% of Mn, 0.3 to 2.0% of Si, 0.01 to 0.5% of Fe, 0.01 to 2.0% of Co, 0.2 to 1.0% of Sn, 5 to 10% of Pb and the balance being Cu and inevitable impurities. The alloy has a novel intermetallic compound [Mn,Si,Co,Fe] substantially in the form of spheroids and has also fine grains. The alloy is adapted for use as sliding members or parts and has very good resistances to wear and corrosion, anti-seizing property and durability.
    Type: Grant
    Filed: November 3, 1992
    Date of Patent: February 1, 1994
    Assignee: Chuetsu Metal Works Co., Ltd.
    Inventors: Kunio Nakashima, Takayuki Tanaka, Wataru Yago, Kenzo Yamamoto, Ken-ichi Ichida