Abstract: A substrate holding device includes a spin table, and three or more holders. The three or more holders each have a base and a position regulator, and are arranged on an outer periphery of the spin table while being spaced apart from one another. At least one of the holders includes a rotating base as the base that is rotatable around a longitudinal shaft axis, a rotating position regulator as the position regulator that regulates a horizontal position of the substrate on the spin table, a rotating mechanism configured to switch the rotating position regulator between a first condition and a second condition, and a pushing member that is spaced apart from the substrate when the rotating position regulator is under the first condition and pushes the substrate in a direction apart from the position regulator when the rotating position regulator is switched to the second condition.

Abstract: Disclosed is a substrate treating method for performing cleaning treatment to a substrate by contacting a brush against the substrate. The method includes a rotating step of rotating a spin holder, holding the substrate, around a vertical shaft axis, an outer periphery edge contacting step of contacting the brush against the substrate at an outer periphery edge contacting position closer to an outer periphery edge of the substrate than to the shaft axis while the substrate is rotated in a horizontal plane, a first moving step of moving the brush from the outer periphery edge contacting position to a side adjacent to the shaft axis while the brush is brought into contact against the substrate, and a second moving step of moving the brush from the side adjacent to the shaft axis toward the outer periphery edge after the first moving step.

Abstract: A method for conditioning a polishing tool includes: a substrate rotation process, holding a silicon dummy substrate having a main surface in a non-mirror state in a horizontal posture and rotating the dummy substrate about a vertical axis; and a conditioning execution process, executing conditioning of the polishing tool by bringing the polishing tool into contact with the main surface of the dummy substrate that is being rotated, wherein the polishing tool has a resin body in which abrasive grains are dispersed.

Abstract: A substrate cleaning brush for cleaning a wafer includes a brush main body, a brush holding unit, and a main flow path forming body. The brush main body has a liquid permeable structure and includes a lower surface that comes into contact with a substrate. The brush holding unit holds the brush main body while exposing a distal end portion in a vertical direction of the brush main body to the outside. The main flow path forming body includes a main flow path and a plurality of sub flow paths. The main flow path is formed to allow a processing liquid supplied from the outside to pass therethrough. The plurality of sub flow paths branch off from the main flow path, extend outward in a width direction perpendicular to the vertical direction of the brush main body, and are connected to an upper surface of the brush main body.

Abstract: A substrate treatment apparatus includes a brush moving mechanism which moves a shaft to which a cleaning brush is attached. The brush body includes a substrate contact portion of a pillar-shaped portion. The substrate treatment apparatus further includes a correcting member and a relatively-positioning mechanism. When the correcting member is placed in a target position, a contact portion of the correcting member overlaps an object portion which is a combination of a design contact portion and a belt-shaped annular portion in an outer surface of a design pillar-shaped portion of a design body of a design brush. The contact portion is formed to have an inverted shape of the object portion of the design brush, and a portion of the contact portion, which corresponds to the belt-shaped annular portion, is a center-axis facing surface which faces a center axis of the shaft.

Abstract: A substrate cleaning brush for cleaning a wafer includes a brush main body, a brush holding unit, and a main flow path forming body. The brush main body has a liquid permeable structure and includes a lower surface that comes into contact with a substrate. The brush holding unit holds the brush main body while exposing a distal end portion in a vertical direction of the brush main body to the outside. The main flow path forming body includes a main flow path and a plurality of sub flow paths. The main flow path is formed to allow a processing liquid supplied from the outside to pass therethrough. The plurality of sub flow paths branch off from the main flow path, extend outward in a width direction perpendicular to the vertical direction of the brush main body, and are connected to an upper surface of the brush main body.

Abstract: A substrate treatment apparatus includes a brush moving mechanism which moves a shaft to which a cleaning brush is attached. The brush body includes a substrate contact portion of a pillar-shaped portion. The substrate treatment apparatus further includes a correcting member and a relatively-positioning mechanism. When the correcting member is placed in a target position, a contact portion of the correcting member overlaps an object portion which is a combination of a design contact portion and a belt-shaped annular portion in an outer surface of a design pillar-shaped portion of a design body of a design brush. The contact portion is formed to have an inverted shape of the object portion of the design brush, and a portion of the contact portion, which corresponds to the belt-shaped annular portion, is a center-axis facing surface which faces a center axis of the shaft.

Abstract: A liquid crystal display device and a method for fabricating the same are provided. In fabricating a liquid crystal display device, the method enables liquid crystal alignment operation to be easily and accurately carried out in such a way that liquid crystal alignment is changed between adjacent minute regions. An alignment film is formed on a glass substrate formed with transparent electrodes, and then rubbing operation is performed using a rubbing cloth in one direction with respect to the alignment film, so that the alignment film is caused to maintain a high pretilt condition. After a mask substrate is so positioned as to register with the glass substrate, ultraviolet light irradiation is effected to form a high-pretilt keeping region and a low-pretilt keeping region on the surface of the alignment film. In the display device, it is arranged that one high-pretilt keeping region is disposed opposite one low-pretilt keeping region.